Title:
THIN FILM CAPACITOR, PRODUCTION METHOD THEREFOR, AND ELECTRONIC CIRCUIT BOARD EQUIPPED WITH THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2022/004018
Kind Code:
A1
Abstract:
[Problem] To provide a highly reliable thin film capacitor. [Solution] A thin film capacitor 1 comprises: a metal foil 10 that has a roughened top surface 11; a dielectric film D that covers the top surface 11 of the metal foil 10 and has an opening for partially exposing the metal foil 10; a first electrode layer that is in contact with the metal foil 10 via the opening; a second electrode layer that is in contact with the dielectric film D without being in contact with the metal foil 10; and an insulating member 22 that is provided to the top surface 11 of the metal foil 10 and surrounds the first and second electrode layers. The metal foil 10 has an outer perimeter region 15 that is positioned on the outer side of the region surrounded by the insulating member 22 and that is not covered by the first and second electrode layers. The height H1 of the electrode layers is the same as or greater than the height H2 of the insulating member 22. As a result, the outer perimeter of the thin film capacitor 1 has a stepped shape that facilitates stress mitigation, thus increasing the reliability of the product.
Inventors:
ISHII DAIKI (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
Application Number:
PCT/JP2020/048394
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2007010768A1 | 2007-01-25 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JP2007149730A | 2007-06-14 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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