Title:
THREE-DIMENSIONAL CIRCUIT STRUCTURE BODY
Document Type and Number:
WIPO Patent Application WO/2016/140023
Kind Code:
A1
Abstract:
An electronic component (11) is embedded in the end section of a surface (P1) and the end section of a surface (P2), the end sections being adjacent to each other on a three-dimensional base section 2. A part of an electrode (21) that is exposed on the surface (P1), and the electrode (101) of a package IC (41), are connected via wiring (201). A part of an electrode (31) that is exposed on the surface (P2), and the electrode (25) of an electronic component (15) are connected via wiring (202). A three-dimensional circuit structure body is thereby achieved that does not require wiring straddling or going along the end sections.
Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2016/053761
Publication Date:
September 09, 2016
Filing Date:
February 09, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H05K1/18; H05K3/00
Foreign References:
| JPH04271188A | 1992-09-28 | |||
| JP2006018421A | 2006-01-19 | |||
| JPH08191186A | 1996-07-23 | |||
| JPH0786493A | 1995-03-31 | |||
| JP2010087155A | 2010-04-15 |
Other References:
See also references of EP 3250013A4
Attorney, Agent or Firm:
MURAKAMI, TAKASHI (JP)
Murakami In addition (JP)
Murakami In addition (JP)
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