PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE

Title:

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2016/140024

Kind Code:

A1

Abstract:

Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.

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Inventors:

ARIMOTO YUKARI (JP)
MASUDA YUKI (JP)
OKUDA RYOJI (JP)

Application Number:

PCT/JP2016/053765

Publication Date:

September 09, 2016

Filing Date:

February 09, 2016

Export Citation:

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Assignee:

TORAY INDUSTRIES (JP)

International Classes:

G03F7/004; C08G73/10; C08G73/22; G03F7/023; G03F7/075

Domestic Patent References:

WO2010001780A1	2010-01-07
WO2014199800A1	2014-12-18
WO2012002134A1	2012-01-05

Foreign References:

JP2008058839A	2008-03-13
JP2012027490A	2012-02-09
JP2016045220A	2016-04-04

Other References: