Title:
TRANSFER DEVICE, TRANSFER METHOD, AND INSPECTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/221576
Kind Code:
A1
Abstract:
The present invention has: a loader (31); a transfer path (50), which moves the loader (31) in the X direction, and which has a plurality of transfer positions for transferring a wafer W; a belt-driven drive mechanism (32) that moves the loader (31) along the transfer path (50) by means of a timing belt (51) disposed in the X direction; position sensors (71a, 71b) that transmit signals when the loader (31) reaches predetermined positions corresponding to the transfer positions; and a transfer control unit (81) that controls the loader (31). The transfer control unit (81) has coordinates relating to the position of the loader (31), and when the signals transmitted from the position sensors (71a, 71b) are received, the transfer control unit corrects, on the basis of the signals each time the signals are received, the loader (31) position data on the coordinates, said data being in the transfer control unit (81).
Inventors:
OBIKANE TADASHI (JP)
UCHIDA MINORU (JP)
UCHIDA MINORU (JP)
Application Number:
PCT/JP2017/017857
Publication Date:
December 28, 2017
Filing Date:
May 11, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; H01L21/66
Foreign References:
| JPH07161632A | 1995-06-23 | |||
| JP2001088067A | 2001-04-03 | |||
| JP2002308420A | 2002-10-23 |
Attorney, Agent or Firm:
TAKAYAMA Hiroshi (JP)
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