Title:
TRANSMISSION LINE PATH AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/095620
Kind Code:
A1
Abstract:
A transmission line path (10) is provided with: a structure (11A) comprising an insulating base material (15A) and a ground conductor (17A) formed on the insulating base material (15A); a structure (11B) comprising an insulating base material (15B), a signal line (16) formed on the insulating base material (15B), a ground conductor (17B1, 17B2, 17B3), and an inter-layer connecting conductor (18B1, 18B2); an insulating base material (12A) with an opening (21A) formed therein; and a metal bonding material (13A) bonding the structure (11A) and the structure (11B) together, with the insulating base material (12A) therebetween. The insulating base material (15A) and the insulating base material (15B) are stacked with the insulating base material (12A) therebetween, whereby a hollow portion (14A) is formed. The signal line (16) and the ground conductor (17A) oppose each other partially in the bonding direction, with the hollow portion (14A) therebetween. The ground conductor (17A), when viewed in plan from the bonding direction, includes an opening (31A) in a region overlapping the signal line (16) and not overlapping the hollow portion (14A).
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Inventors:
IKEMOTO NOBUO (JP)
Application Number:
PCT/JP2020/041294
Publication Date:
May 20, 2021
Filing Date:
November 05, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P3/08; H05K1/02
Domestic Patent References:
| WO2017130731A1 | 2017-08-03 | |||
| WO2018151134A1 | 2018-08-23 |
Foreign References:
| JP2017108455A | 2017-06-15 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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