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Title:
UREYLENE ADDITIVE, ITS USE AND A PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/137724
Kind Code:
A1
Abstract:
The present invention relates to ureylene additives, a method for their preparation, a use of said ureylene additives favorably as additive in metal or metal alloy deposition composition, preferably in a copper or copper alloy deposition composition, more preferably as leveler and/or suppressor therein, metal or metal alloy deposition composition comprising said ureylene additive and the use of such composition, a method for electrolyticaliy depositing a metal or metal alloy layer, preferably a copper or copper alloy layer, onto at least one surface of a substrate and metal or metal alloy layers formed from above metal or metal alloy deposition composition. The ureylene additives allow for example in the case of copper plating for very levelled copper deposits without voids, in particular when filling recesses.

Inventors:
BOLTON ONAS (DE)
ACKERMANN STEFANIE (DE)
ADOLF JAMES (DE)
WU JUN (DE)
HOFFMANN NADJA (DE)
BRUNNER HEIKO (DE)
Application Number:
EP2018/084442
Publication Date:
July 18, 2019
Filing Date:
December 12, 2018
Export Citation:
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Assignee:
ATOTECH DEUTSCHLAND GMBH (DE)
International Classes:
C25D7/12; C07C211/13; C07C215/18; C07C215/50; C07C217/42; C07C275/14; C08G18/28; C08G18/32; C08G18/71; C08G18/73; C25D3/38
Domestic Patent References:
WO2011012475A12011-02-03
WO2011029781A12011-03-17
Foreign References:
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Other References:
CHEMICAL ABSTRACTS, Columbus, Ohio, US; abstract no. 68555-36-2
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Attorney, Agent or Firm:
SCHULZ, Hendrik (DE)
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