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Patent Searching and Data


Title:
WAFER CLEANING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/093799
Kind Code:
A1
Abstract:
A wafer cleaning device provided by the present invention comprises a rotating shaft, a chuck which is arranged at the top of the rotating shaft and used for retaining a wafer, a fixing shaft which coaxially passes through the rotating shaft, and an upper end cover and a lower end cover which respectively block the top portion and the bottom portion of the fixing shaft. The fixing shaft is hollow. The wall surface of the fixing shaft is provided with exhaust holes arranged in at least one circle. The lower end cover is provided with an air inlet. A protective gas is provided into the fixing shaft through the air inlet. The protective gas forms positive pressure through an annular gap between the fixing shaft and the rotating shaft through the exhaust holes arranged in at least one circle. According to the present invention, the exhaust holes are formed on the wall surface of the fixing shaft to provide positive-pressure protection gas to the gap between the fixing shaft and the rotating shaft and form an air seal, thereby preventing particles, metals and other pollutants generated in the bottom area of the rotating shaft from being diffused to the back surface of the wafer through the annular gap between the fixing shaft and the rotating shaft and improving the cleanliness of the back surface of the washed wafer.

Inventors:
HE XIDENG (CN)
HAN YANG (CN)
ZHONG ZHAOMING (CN)
HUANG TIANYU (CN)
ZHAO YUNXIANG (CN)
TAO XIAOFENG (CN)
DENG XINPING (CN)
JIA SHENA (CN)
WANG HUI (CN)
Application Number:
PCT/CN2022/133987
Publication Date:
June 01, 2023
Filing Date:
November 24, 2022
Export Citation:
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Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
H01L21/306; H01L21/67
Foreign References:
US20070235062A12007-10-11
CN102779772A2012-11-14
CN103506339A2014-01-15
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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