WAFER ROTATION DEVICE, WAFER INSPECTION DEVICE, AND WAFER INSPECTION METHOD

Title:

WAFER ROTATION DEVICE, WAFER INSPECTION DEVICE, AND WAFER INSPECTION METHOD

Document Type and Number:

WIPO Patent Application WO/2023/190699

Kind Code:

A1

Abstract:

A wafer rotation device (4) comprises: a wafer placement unit (16) provided with a plurality of placement arms (164) on which a wafer (100) is placed; a rotating drive unit (14) that rotates the wafer placement unit (16) to rotate the wafer (100) in a circumferential direction; and a raising/lowering mechanism (18) provided with a plurality of raising/lowering arms (184) that can be raised and lowered relative to the placement arms (164). Because the placement position of the wafer (100) can be displaced with respect to the placement arms (164) without gripping the wafer (100), physical contact with the wafer (100) can be reduced by that much, so that the generation of contamination can be suppressed compared to conventional art. Further, because the placement position of the wafer (100) with respect to the placement arms (164) can be displaced by a simpler operation in a shorter time than by conventional art, throughput can be improved over conventional art.

More Like This:

JP7432664	Support unit and substrate processing equipment including the same
WO/2017/043809	WAFER CENTERING DEVICE FOR MEASUREMENT APPARATUS
JP2015067878	HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD

Inventors:

KONNO JUNJI (JP)
HAGA KAZUMI (JP)

Application Number:

PCT/JP2023/012841

Publication Date:

October 05, 2023

Filing Date:

March 29, 2023

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NANOSYSTEM SOLUTIONS INC (JP)

International Classes:

H01L21/683; H01L21/66; H01L21/68

Foreign References:

JP2006102706A	2006-04-20
JP2013137292A	2013-07-11
JP2009141081A	2009-06-25
JPH08125004A	1996-05-17
US20100315617A1	2010-12-16