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Patent Searching and Data


Title:
WIRE MODULE
Document Type and Number:
WIPO Patent Application WO/2016/117352
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve, in a wire module provided with a protective member having a hollow structure, the stability of the state of fixation between the protective member and a wire. This wire module is provided with a wire part and the protective member. The wire part includes at least one wire. The protective member covers at least a part of the wire part along the circumferential direction thereof, the protective member being formed from a hollow plate member that includes a plurality of plate-shaped portions and interposing portions arranged between the plurality of plate-shaped portions so as to form hollow spaces between the plurality of plate-shaped portions. From among the plurality of plate-shaped portions of the protective member, the innermost plate-shaped portion in contact with the wire part is curved to a shape following the outer-circumferential surface of the wire part overall.

Inventors:
ITOU HIDEAKI (JP)
Application Number:
PCT/JP2016/050196
Publication Date:
July 28, 2016
Filing Date:
January 06, 2016
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01B7/17; B60R16/02; H02G3/04
Foreign References:
JP2010187439A2010-08-26
JP2007325357A2007-12-13
JP2013201797A2013-10-03
JP2011078231A2011-04-14
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
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