Title:
WIRING BOARD, PLANAR LIGHT-EMITTING DEVICE, AND PRODUCTION METHODS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/054094
Kind Code:
A1
Abstract:
[Problem] To provide a wiring board with which it is possible to supress an increase in the types of members in a double-sided board, and to decrease the production time and the number of steps. [Solution] This wiring board production method includes: a step for preparing a substrate 30 having an insulating resin 10 and a metal member 20 which has an anti-rust layer 21 formed on the surface disposed facing a second surface 10B of the insulating resin 10; a step for forming a plurality of first holes 51 that pass through the metal member 20 by etching; a step for forming a second hole 52 that passes through the insulating resin 10 from the first surface 10A side of the insulating resin 10, and communicates with at least one of the first holes 51; and a step for supplying a conductive paste 40 so as to connect the second hole 52 with one of the plurality of first holes 51 and disposing the conductive paste 40 on the first surface 10A of the insulating resin 10 so as to form wiring connected to the supplied conductive paste 40. The anti-rust layer 21 on the surface of the metal member 20 at inner bottom surface 52B of the second hole 52 is removed in the step for forming the second hole 52.
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Inventors:
KATSUMATA MASAAKI (JP)
KURAOKA TAKASHI (JP)
MINATO EIKO (JP)
KURAOKA TAKASHI (JP)
MINATO EIKO (JP)
Application Number:
PCT/JP2022/035103
Publication Date:
April 06, 2023
Filing Date:
September 21, 2022
Export Citation:
Assignee:
NICHIA CORP (JP)
International Classes:
H05K1/11; H01L33/62; H05K3/10
Foreign References:
| JP2003318546A | 2003-11-07 | |||
| JP2001168481A | 2001-06-22 | |||
| JP2015156471A | 2015-08-27 | |||
| JP2020053582A | 2020-04-02 | |||
| JP2021131928A | 2021-09-09 | |||
| JP2021057574A | 2021-04-08 | |||
| JP2002026520A | 2002-01-25 | |||
| JP2006049930A | 2006-02-16 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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