Title:
WIRING SHEET FOR THREE-DIMENSIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2022/202216
Kind Code:
A1
Abstract:
A wiring sheet for three-dimensional molding formed by sandwiching a pseudo-sheet structure constituted by a plurality of electrically conductive linear bodies arranged at intervals between a first embed layer and a second embed layer. The electrically conductive linear bodies have a wave shape in planar view. The storage shear elastic modulus of the first embed layer and the second embed layer at 23°C are both 1×104 to 3×106Pa. When the thickness of the first embed layer is T1, the thickness of the second embed layer is T2, and the thickness of the pseudo-sheet structure is T3, a specific relational expression is satisfied.
Inventors:
HASEGAWA TATSUKI (JP)
ITO MASAHARU (JP)
MORIOKA TAKASHI (JP)
ITO MASAHARU (JP)
MORIOKA TAKASHI (JP)
Application Number:
PCT/JP2022/009363
Publication Date:
September 29, 2022
Filing Date:
March 04, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H05B3/10; H05B3/18; H05B3/20
Domestic Patent References:
| WO2020044903A1 | 2020-03-05 | |||
| WO2018181766A1 | 2018-10-04 | |||
| WO2017086395A1 | 2017-05-26 |
Foreign References:
| JP2020119856A | 2020-08-06 | |||
| JP2020126706A | 2020-08-20 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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