WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE

Title:

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/021750

Kind Code:

A1

Abstract:

Provided is a highly reliable wiring substrate with which the thickness of layers provided on a substrate does not increase, heat dissipation is high and also adhesion with a sealing resin is good, and also provided are a method for manufacturing the wiring substrate and a semiconductor device in which a semiconductor element is mounted on this wiring substrate. A wiring substrate (1) of the present invention includes a substrate (2) comprising an insulation layer, and wiring (3) disposed on one side surface of the substrate (2). The wiring (3) has a porous electrically conductive layer comprising a large number of holes therein, and the area of the surface of the wiring (3) at the substrate (2) side is different to the area of the surface opposite the surface at the substrate (2) side.

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Inventors:

WATANABE MASATO (JP)
HIKASA KAZUHITO (JP)

Application Number:

PCT/JP2012/066870

Publication Date:

February 14, 2013

Filing Date:

July 02, 2012

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)
WATANABE MASATO (JP)
HIKASA KAZUHITO (JP)

International Classes:

H05K1/09; H01L23/12

Foreign References:

JP2010272835A	2010-12-02
JP2010161127A	2010-07-22
JP2010251446A	2010-11-04
JP2006173399A	2006-06-29
JPH09130046A	1997-05-16
JP2003188316A	2003-07-04
JP2006228804A	2006-08-31

Other References: