Title:
WORKPIECE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/189168
Kind Code:
A1
Abstract:
[Problem] To provide a workpiece processing method capable of reducing TTV of a workpiece. [Solution] A workpiece processing method comprises: a step for adhering a surface protective sheet to a surface of a workpiece having a front surface and a rear surface; and a step for grinding the rear surface of the workpiece with the surface protective sheet adhered thereto, wherein the surface of the workpiece has a bump electrode, in the step for adhering the surface protective sheet, a projecting pattern is formed in a region different from a region at an outer periphery of the surface of the workpiece where the bump electrode is formed, the surface protective sheet is adhered to bury the bump electrode, and Hb and H1, where Hb is a height of the bump electrode and H1 is a height of the projecting pattern, satisfy the relationship Hb/8 < H1
Inventors:
NAKANISHI HAYATO (JP)
MAEDA JUN (JP)
FUJIMOTO HIRONOBU (JP)
MAEDA JUN (JP)
FUJIMOTO HIRONOBU (JP)
Application Number:
PCT/JP2023/007781
Publication Date:
October 05, 2023
Filing Date:
March 02, 2023
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; B32B3/30; B32B7/025; B32B37/14; C09J5/00; C09J7/38; C09J201/00
Domestic Patent References:
| WO2020203437A1 | 2020-10-08 | |||
| WO2020003920A1 | 2020-01-02 |
Foreign References:
| JP2004288725A | 2004-10-14 | |||
| JP2010027685A | 2010-02-04 | |||
| JP2013247133A | 2013-12-09 | |||
| JP2020123666A | 2020-08-13 | |||
| JP2008311514A | 2008-12-25 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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