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WO/1999/064527A1 |
A composition is provided in the present invention for polishing a composite semiconductor structure containing a metal layer (such as tungsten, aluminum, or copper), a barrier layer (such as tantalum, tantalum nitride, titanium, or tita...
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WO/1999/058296A1 |
A system to smooth and radius a microhole in a workpiece to calibrate the microhole. The workpiece is held in an indexable holder (28), which moves the workpiece through a series of calibrating, abrasive jet, and cleaning stations.
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WO/1999/055493A1 |
A grinding wheel capable of polishing only protruded parts and having a self-stop function so that the polishing is terminated automatically when irregularities have been eliminated by the polishing and a polishing method using the grind...
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WO/1999/050024A1 |
A polishing apparatus has a turntable (20) with a polishing cloth (5) attached thereto and a top ring (3) for holding and pressing a workpiece (2) to be polished against the polishing cloth (5) under a certain pressure. The polishing app...
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WO/1999/048644A1 |
The invention relates to a method and device for machining out of round contours by using a cone-shaped or truncated cone-shaped tool which is rotationally mounted on a spindle. The spindle is arranged at a certain angle in relation to t...
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WO/1999/047304A1 |
A dual load system (18) to achieve desired controlled polishing forces in the finishing of large batches of ceramic balls (54). The first, and primary, load system (18) is a mechanical dead weight system, and the other is a magnetic fiel...
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WO/1999/046082A1 |
The invention aims to provide a surface pattern for wide-wheel grinding devices instead of improving the surface fineness of such devices by increasingly intensive grinding measures. When on the side of a plate at least two grinding devi...
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WO/1999/046080A1 |
A method and apparatus for repairing optical discs (30), wherein the apparatus includes an improved buffing wheel (10) capable of applying a uniform buffing action across the readable surface (38) of an optical disc (30), and wherein the...
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WO/1999/043469A1 |
A multi-pass grinding method for fabricating an endodontic instrument. A tapered rod (10) is sucessively advanced past a rotating grinding wheel (12) to remove layers (14, 16, 18, 20) of material from the rod (10) until attaining a desir...
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WO/1999/043465A1 |
A polishing apparatus for semiconductor wafers includes an index table (26) with a rotatable annular ring (60) carrying multiple wafer positions (31-36), with different surface treatment arrangements for each position. With each index mo...
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WO/1999/038648A1 |
A method of obtaining superabrasive grinding performance from tools employing less expensive, non-superabrasive conventional abrasive grain involves operating the conventional abrasive tool at ultra high tangential contact speed, (that i...
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WO/1999/033610A1 |
A methodology for conducting magnetic float polishing of magnetic materials. This is accomplished by isolating the magnetic workpiece from any appreciable magnetic induction and subsequently polishing the magnetic workpiece utilizing the...
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WO/1999/031538A1 |
A method and device for polishing an optical part so that the end face of an optical path may protrude from the connecting end face of the optical part by a desired length. The device is provided with a connector holding section (16), a ...
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WO/1999/026763A2 |
A polishing apparatus has two parallel processing lines that enables to carry out efficient parallel processing by minimizing the idle time for the turntable and maximizing the through-put. The polishing apparatus comprises at least two ...
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WO/1999/022905A1 |
With sanding or sanding machines with rotating sanding tools comprising sanding segments which are rotated in mutually opposite directions, according to the invention a more uniform sanding result and uniform wear on the tools is achieve...
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WO/1999/016578A1 |
The invention relates to a chemical and mechanical polishing method, whereby a polishing agent comprised of a solution with polishing grains suspended therein is introduced between a substrate to be planished and an abrasive disk moving ...
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WO/1999/016577A2 |
A methodology for finishing of HIP'ed Si¿3?N¿4? balls from the as-received condition by magnetic fluid polishing. It involves mechanical removal of material initially using harder abrasives with respect to the workmaterial (of differen...
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WO/1999/011427A1 |
A chemical mechanical polishing system comprising a moving polishing pad and an ultrasonic conditioning head. The head is positioned in close facing relationship to the pad surface and agitates a liquid on the rotating pad surface at an ...
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WO/1999/007514A2 |
Generally rough sphere-shaped work pieces made of fragile material are ground into more uniform spheres. The rough spheres are fed into a holding plate (3) having a channel (4) cut into the bottom side of the plate (3) with a width sligh...
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WO/1999/004929A1 |
A method for preparing a surface (24) of a workpiece (10) of solid ductile material to provide a transition zone between that material and a different material to be brought into intimate contact with the first material, involves relativ...
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WO/1998/055260A1 |
The invention concerns a rotating metal part (1) having an external surface (3) with in axial cross-section a general profile consisting of a regular series of flattened convex arches (4). The invention also concerns a polishing method w...
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WO/1998/036871A1 |
The present invention concerns a procedure and an arrangement for the abrasive precision machining of a blank (1) made of a material with a high degree of hardness and/or toughness by means of a rotating high speed abrasive tool (2) that...
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WO/1998/028101A1 |
The combined processes of mechanical texturing with free abrasive and conductive texture tape (1) with electro-deburring and electro-smoothening of the textured surface of the NiP layer (5) of the aluminium disk substrate, or a combinati...
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WO/1998/024588A1 |
A method for manufacturing a quartz oscillator in which a quartz piece is ground as small, thin, and accurate as possible as to obtain a quartz oscillator, a quartz resonator or an optical lens for transmission and reception of a high fr...
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WO/1998/022976A1 |
An abrading method having a stable high abrasion efficiency in chemical mechanical polishing of a large scale integrated circuit wafer. To reduce the quantity of use of consumptive members, such as, an abrasive solution and an abrasive p...
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WO/1998/019826A1 |
A method for polishing articles comprising soft acrylic materials is disclosed. The method includes a cryogenic polishing step and a cleaning step. In the polishing step, a receptacle is charged with polishing beads of various sizes, sod...
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WO/1998/012019A1 |
A method of abrasively removing material from a workpiece, the method comprising the steps of rotating an abrasive wheel about a first axis and orbiting the wheel about a second axis spaced from the first axis to contact said workpiece w...
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WO/1998/006540A1 |
The present invention provides for a method and apparatus for conditioning a polishing pad (202) in a semiconductor polishing arrangement (200) in which slurry (216) is directed under pressure at the polishing pad (202) and by means of a...
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WO/1998/005889A1 |
A wavy face ring having a smooth face and a method of manufacturing this wavy face ring. In particular, the method includes providing a ring blank having a face surface and a peripheral surface and applying a predetermined force to the p...
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WO/1998/003303A1 |
The time to grind a workpiece can be reduced by selecting a grinding wheel whose width is not substantially greater than wheel strength considerations require, and which may therefore be less than the axial length of the region to be gro...
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WO/1998/001258A1 |
A diamond to be ground is heated, while feeding an oxide powder (P) containing at least one member selected from among transition metal elements, alkali metal elements, and alkaline earth metal elements to the surface of the diamond, to ...
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WO/1997/048525A1 |
A workpiece alignment and shifting system for moving circular workpieces from a first inspection station to a second machining station, comprises workpiece holding means for attachment to the face of a disc workpiece to move the latter f...
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WO/1997/048524A1 |
The invention concerns a method of polishing or smoothing paint surfaces, the method calling for the paint surface to be cooled by a cold gas. The cold gas is produced by splitting a gas stream into a cold stream and a warm stream by mea...
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WO/1997/048526A1 |
A grinding or polishing machine comprises a rigid platform on which a workhead spindle and a grinding wheel spindle are located. The grinding wheel spindle is mounted on a sub-assembly which is attached to the platform by means of flexur...
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WO/1997/048522A1 |
A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been...
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WO/1997/048521A1 |
An actuator comprising a pair of similar devices each responsive to electrical signals to generate reciprocatory displacements, and link means coupled to the devices to translate the respective displacements of the devices into a single ...
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WO/1997/035686A1 |
A method of, and apparatus for, treating an elongate rotary tool (22) that presents a sharp cutting edge (30) are described. The method includes the steps of emitting under pressure from a nozzle (60) an abrasive fluid stream comprising ...
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WO/1997/033716A1 |
A method of polishing selected ceramics and metals is provided wherein the selected ceramic or metal material is rubbed against a solid surface in the presence of a nonabrasive liquid medium which only attacks the selected ceramic or met...
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WO/1997/028909A1 |
A technique for removing loose powder from the interior surfaces of ceramic molds made using layer manufacturing processes, such as three-dimensional printing processes. The interior of a mold is filled with water which is boiled and the...
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WO/1997/014532A1 |
Method and apparatus (10) for finishing a workpiece surface using magnetorheological fluid (16) wherein the workpiece (26) is positioned near a carrier surface (14) such that a converging gap (22) is defined between the workpiece surface...
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WO/1997/013009A1 |
There are disclosed a process and an apparatus for processing of precision parts or components by using abrasive-containing electrolyte, characterized in that the coupled parts or components to be processed are fitted together, or a part...
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WO/1997/011484A1 |
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abra...
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WO/1997/007931A1 |
A surface treatment process employing pulsed laser energy enables selective texturizing and polishing of non-magnetizable substrate disks used in fabricating magnetic reading and recording disks (16). Substrate surfaces (44, 92, 100, 119...
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WO/1997/000756A2 |
A method and an apparatus for polishing a diamond surface by utilization of ultrasonic vibrations are provided whereby surface roughness of a diamond surface can be reduced to a level suitable for e.g. mechanical, optical, and semiconduc...
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WO/1996/039275A1 |
Methods of finishing and microfinishing the edges of a die component (18) are disclosed. Each edge is polished to finish the edge of the die component to a smoother finish than the rest of the die component. This eliminates the incidence...
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WO/1996/027189A1 |
A method for texturing magnetic recording media substrates using a structured abrasive article including a flexible backing having a major surface and an abrasive coating, the abrasive coating attached to and at least substantially cover...
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WO/1996/022173A1 |
The invention relates to a method for grinding of preferably billets, blooms and slabs which are moved in a certain direction on a support. The method means that the grinding is performed in a track which is perpendicular to the travel d...
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WO/1996/019317A1 |
A process and device are disclosed for finishing the surface of rotationally symmetrical workpieces. The workpiece (29) is pre-machined and hardened with a stock allowance and is then finished in two steps in a grinding machine in which ...
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WO/1996/017032A1 |
A friction-enhancing composition including a semisolid mixture of hydrocarbons, a thinning substance, a first abrasive substance, and a second abrasive substance which is harder than the first abrasive substance, and wherein both abrasiv...
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WO/1996/011081A2 |
Ultrasonic polishing equipment comprises a frame (1) adapted to hold a workpiece (2) and a tool mount (3) for holding the tool (4) and vibrating this tool with an ultrasonic driver (not shown). The equipment allows relative orientation c...
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