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WO/2015/136008A1 |
The invention relates to a method for controlling an automated orbital sander, in which method an electrically powered orbital sander is moved around automatically, at constant pressure, over the surface of an object, along at least one ...
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WO/2015/136081A1 |
The invention relates to a method and to a grinding machine for completely grinding large crankshafts of truck engines, ship engines, or stationary engines, wherein main journals and crankpins and cylindrical, possibly conical end region...
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WO/2015/133516A1 |
The present invention relates to a substrate processing system and a substrate processing method that are capable of flushing the processing liquid supply line. The substrate processing system is provided with a substrate processing appa...
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WO/2015/129516A1 |
In this grinding machine, which is provided with a manual rotation handle having a rotation detector for outputting a rotation detection signal and which can move a grindstone relative to a workpiece in accordance with the rotation detec...
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WO/2015/105055A1 |
A workpiece thickness measurement device is provided with: a liquid immersion device that immerses at least one part of a workpiece in a liquid after polishing; and two or more measurement devices that are arranged to face each other and...
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WO/2015/102552A1 |
The invention is on the method of processing multidimensional objects such as medical implants, heater surfaces or parts of vehicles and equipment operating in extreme environmental conditions with large and curved surfaces using chemica...
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WO/2015/098126A1 |
This machining assistance system (1) assists a machining device (2) and is provided with: a workpiece supporting force generating unit (6) which generates a workpiece supporting force that resists the processing reaction force exerted by...
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WO/2015/097947A1 |
This double-sided workpiece polishing apparatus is provided with a rotating surface plate having an upper surface plate and a lower surface plate, a sun gear, an internal gear, and a carrier plate provided with at least one holder openin...
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WO/2015/088063A1 |
The present invention relates to a method of aligning a drill bit for a drill bit grinder and, more specifically, to a method of horizontally aligning the cutting tip of a drill bit in order to grind the drill bit. The method of aligning...
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WO/2015/086544A1 |
A method of processing a super-hard material product (100) having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product (100) with a surface of the super-hard material product (10...
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WO/2015/083319A1 |
The present invention is a chamfering device (1) comprising the following: a chamfering part (4) that removes a notch from a wafer (W); a washing part (5) that washes and dries the wafer; and a chamfered-shape measuring device (7) that m...
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WO/2015/079464A1 |
Device for sharpening blades of cutting-off machines, comprising two grinding wheels (1) each positioned on a corresponding side of a cutting edge (20) of a blade (2) of a cutting machine. The device comprises means adapted for controlli...
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WO/2015/070269A1 |
A grinding disk (6) which is moved along the edge (4) of the glass pane (1) is used during the production of bevels (11, 12) on the edge (4) of a workpiece, such as a glass pane (1). The borders (A, B) of the edge (4) of the glass pane (...
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WO/2015/035708A1 |
Disclosed is an in-situ detection device for precision grinding of a ring with an inner spherical surface, the device comprising a base plate (4), a swing arm (5), a swing cylinder (6) and a precise displacement sensor (7). Further discl...
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WO/2015/028285A1 |
The invention relates to a device for sharpening rotary knives, in particular sickle knives or circular knives, in particular for a machine for slicing food products, which have at least two segments, having at least one receptacle on wh...
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WO/2015/029524A1 |
The present invention is provided with a polishing step for polishing a semiconductor wafer (W) using a polishing means (1), a measurement step for measuring the shape of the semiconductor wafer (W) using a measurement means (3) before t...
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WO/2015/021531A1 |
The present disclosure relates to grinding apparatus for grinding the hard metal inserts of rock drill bits, said grinding apparatus having said grinding machine equipped with a grinding cup driven by a motor to rotate about its longitud...
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WO/2015/015015A1 |
The invention relates to an assembly having a handheld power tool, in particular an angle grinder (1), wherein the power tool (1) comprises: a housing (2), a drive shaft (3) supported on the housing (2) by means of a bearing (5), a drive...
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WO/2015/011243A1 |
A method for optically checking by interferometry the thickness of an object (2) being machined comprises a phase of direct checking wherein the spectrum of the result of interference between primary reflected radiations (R1) generated b...
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WO/2014/198719A1 |
The invention relates to a method for grinding spring ends of helical compression springs (F) using a numerically controlled spring-end grinding machine (100) having a grinding unit (120), a loading unit (150) and a control unit (160) fo...
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WO/2014/198712A2 |
The invention relates to a recess grinding device (1) having at least one holding device (10) for holding a specimen (20) and at east one abrasive ball (11, 11b, 11c) which can be set rotating by drive means (12) and can be guided by mea...
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WO/2014/171375A1 |
The present invention relates to a glass plate manufacturing method provided with a process for grinding the edges of a glass plate and a control process for controlling the strength of the ground edges, the method being characterized in...
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WO/2014/165891A1 |
The invention relates to a method for grinding a metal strip (2), in which the thickness/surface of the metal strip (2) is measured, the grinding device (3) is moved/pressed against said metal strip (2) and the metal strip (2) is moved i...
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WO/2014/164360A1 |
A method and apparatus for conditioning a polishing pad used in a substrate polishing process. In one embodiment, a method for conditioning a polishing pad utilized to polish a substrate is provided. The method includes providing relativ...
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WO/2014/131621A1 |
In order to measure the geometry of a workpiece surface (165) without contact, in particular in order to measure the geometry of substantially rotationally symmetrically curved workpiece surfaces on workpiece sections machined by means o...
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WO/2014/119163A1 |
To provide a technique which enables an idle running start position to be appropriately corrected. A grinding processing method for grinding the surface of a workpiece by bringing a grindstone and the workpiece into contact with each oth...
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WO/2014/119843A1 |
The present invention relates to a method for grinding a drill bit which can enhance yield and work efficiency and shorten working processes at the time of grinding the drill bit. The method for grinding a drill bit comprises: a first st...
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WO/2014/103806A1 |
Provided is a grinding method capable of preventing variations in the outer diameter of a workpiece (1) at the completion of grinding regardless of variations in the amount of elastic deformation of the workpiece (1) based on changes in ...
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WO/2014/090678A1 |
The invention relates to a method and a cylindrical grinding machine for centerless cylindrical grinding. According to the invention, the workpiece is supported on a first contact surface (7) and a second contact surface (9). The first c...
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WO/2014/091610A1 |
In order to easily and accurately measure, directly in real time, the polishing amount of an optical fiber member being polished, independently of the polishing amount of a ferrule, this method measures the polishing amount of the optica...
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WO/2014/075924A1 |
Method of manufacturing an optical lens, the method comprising: • a lens member providing step (S1) during which a lens member comprising a first surface and a first reference system identified by first markings on the first surface is...
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WO/2014/072314A1 |
The invention relates to a machine tool in particular a grinding machine, and a method for measuring a workpiece in a machine tool. The machine tool can have a workpiece receptacle (14), a tool unit (28), a measuring device (48) and a co...
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WO/2014/069371A1 |
In this thread grinder, in which the axis of rotation (T) of a grinding-wheel shaft (51) is angled with respect to the axis (S) of a main shaft (1) and a thread groove is ground into an inside surface of a workpiece, a centering master (...
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WO/2014/049844A1 |
This method for polishing a board-like body is provided with: a planarity measuring step wherein planarity of a board-like body surface to be polished is measured; and a polishing step wherein the surface of which the planarity has been ...
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WO/2014/046901A1 |
A method for manufacturing an aircraft component according to one embodiment of this disclosure includes providing a machining system including a controller, at least one sensor, and a tool for machining. The method further includes prov...
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WO/2014/039759A1 |
A monitoring system may be used to monitor machining of a workpiece. In some embodiments, the monitoring system may use an acoustic emission sensor to measure acoustic emissions from the machining and generate an acoustic emission signal...
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WO/2014/029703A1 |
The present invention relates to an imaging device for localising structures through the surface of an object (20) such as a wafer, with a view to positioning a measuring sensor (45, 46, 47) relative to said structures, comprising: (i) a...
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WO/2014/029784A1 |
The present invention relates to an imaging method and device for inspecting for the presence, in an area of an object (20) such as a wafer, of structures (70a, 70b, 70c) enclosed in said object (20), such as vias, employing: an imaging ...
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WO/2014/013033A1 |
The invention relates to a machine tool for machining workpieces, particularly a grinding machine, and a method for positioning a spindle head (18) on such a machine tool. The machine tool (10) has a workpiece holder (22) for holding a w...
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WO/2014/002624A1 |
Provided is a technique making it possible to grind a workpiece with high-precision even if there is a need for a processing force such as would produce elastic deformation in a mechanism. A feeding means supports a grindstone and/or a w...
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WO/2013/185603A1 |
A multi-carriage dual-spindle symmetrical grinding processing center is disclosed. A work table with a rotary table therein is positioned on a first carriage which is attached to a front base. First and second upright posts are positione...
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WO/2013/186494A1 |
The present invention relates to a machine (1) for flat deburring parts, including at least one self-propeller (2) combined with at least one metal brush (3) and mounted on a supporting plate (4), also rotated by a motor (7) and arranged...
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WO/2013/183094A1 |
A gear tooth surface processing device and a gear manufacturing method are provided which are capable of adjusting processing pressure for the purpose of improving the surface roughness of high-hardness gears and the like. The gear tooth...
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WO/2013/176187A1 |
The present invention obtains a smoothing method and device whereby it is possible to automatically carry out a process for smoothing a weld member which was conventionally carried out manually. This method uses a belt grinding device ha...
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WO/2013/145827A1 |
The surface grinder (100), which moves an X-axis table (2) using a table-moving mechanism (20) with which the flow rate and flow direction of the hydraulic fluid can be adjusted, is provided with: a control device (9) that controls the m...
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WO/2013/139998A1 |
The invention relates to a device and method for electromechanically roller burnishing a surface of a workpiece, in which precisely one current-guiding roller burnishing element for roller burnishing and one separate electrical contact e...
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WO/2013/135631A1 |
A method for machining a profile into a silicon seed rod using a machine. The silicon seed rod is capable of being used in a chemical vapor deposition polysilicon reactor. The machine includes a plurality of grinding wheels. The method i...
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WO/2013/118357A1 |
The finishing assistance apparatus, which assists in steel plate finishing, is provided with: an imaging device that images the steel plate surface; a display device that displays an image on the steel plate surface; and a control device...
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WO/2013/113628A1 |
A method for grinding spring ends of helical compression springs is performed using a numerically controlled spring end grinding machine (100) having a grinding unit (120), a loading unit (150) and a control unit (160) for controlling th...
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WO/2013/110555A1 |
The invention relates to a method for polishing a flat surface (21) of a workpiece (10) made of a brittle material and to a device for carrying out the method. A polishing process on the surface (21) of the workpiece (19) along a first p...
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