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WO/2012/003828A1 |
An abrasion arrangement is disclosed to abrade a surface of an item, the arrangement comprising a multiple axis robotic arm having at least five axes, an abrading cylinder mounted on the robotic arm and comprising abrasive means which co...
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WO/2011/144624A1 |
Methods and apparatuses are used for optically measuring by interferometry the thickness (T) of an object (2) such as a slice of semiconductor material. Readings of the object thickness by optical interferometry are carried out, rough th...
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WO/2011/131394A1 |
The invention relates to an angle grinder (10), comprising a housing (22), a drive unit (12) for driving a usage tool (14) having a sensor device (16) for providing a rotation parameter and a control unit (18) for evaluating the rotation...
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WO/2011/133386A2 |
Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to...
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WO/2011/121835A1 |
Provided is a disturbance suppression load control device capable of causing a measured load value output from a linear motor-combined cylinder to better approach an objective load value to heighten responsiveness to a disturbance, and s...
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WO/2011/117050A2 |
The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element (1) comprising the steps of -manufacturing at least two cavities (2, 3) on the surface of the element to be polished, the dept...
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WO/2011/114658A1 |
Sensors, a memory which stores detected information obtained by the sensors, and a communication instrument which, by being driven by a power supply section, performs communication with the outside in a non-contact manner, are installed ...
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WO/2011/114399A1 |
A grinding head is lowered. Subsequently, with a large foreign object (A) (defect) being ground, the grinding head is moved, without being raised, along the large foreign object (A), in a state where a grinding tape feeding direction (d2...
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WO/2011/111136A1 |
The disclosed foreign body polishing method involves creating information for capturing and correcting defects in the (work) surface of an array substrate (W), selecting a large foreign body (A) larger than a prescribed size from said in...
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WO/2011/112591A2 |
A system and method for removing an outer layer of resilient material from an object to achieve a target outer dimension includes performing an initial cut at a cutting depth to remove an outer layer of the material. A parameter indicati...
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WO/2011/107872A1 |
The machine (1) for the mechanical machining of plate- shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-sha...
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WO/2011/103926A1 |
An optical measurement apparatus, comprising a reference support (40) on which are mounted a fixed headstock (57) and a movable tailstock (60) opposed to the fixed headstock and movable along a linear axis (x) for coming near to or movin...
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WO/2011/096090A1 |
Since a large-sized optical element has a very long focal point distance, a worked surface and a measuring device need to be installed distantly spaced apart using an elongated frame structure in order to measure the worked surface. Howe...
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WO/2011/089870A1 |
Disclosed is a method for manufacturing an electronic component provided with an adhesive film, wherein cutting dusts and the like are prevented from adhering to an adhesive layer (404) at the time of dividing a wafer in a state wherein ...
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WO/2011/085950A1 |
The invention relates to a device (10) and method for determining the position of a working surface (16, 18) of a working disc (12, 14) of a double-sided machine tool, wherein the device comprises an optical measurement device (24) havin...
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WO/2011/085913A1 |
The invention relates to a cylindrical grinding machine, wherein a round rod (3) to be ground by peel-grinding is clamped in the chuck (2) of a workpiece spindle head (1) so that a rotation occurs around the common center axis (4). Accor...
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WO/2011/083605A1 |
Provided is a blast machining method or the like having high machining accuracy. The disclosed blast machining method is for forming a recess (9) in the surface of an object being machined (8) so as to conform with a target recess of a p...
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WO/2011/083206A1 |
A method for grinding a roll, in which method a roll (2; 25) in a paper or paper- board machine or a corresponding machine for processing a fibrous web is ground by a grinding device (1; 15) installed in the machine, and in which method ...
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WO/2011/077631A1 |
Disclosed is a dual-surface polishing device which has at least: upper and lower setting plates which have polishing cloths attached thereto; a carrier which has a holding-hole formed therein to hold a wafer between the upper and lower s...
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WO/2011/074691A1 |
A polishing method and a polishing apparatus particularly suitable for finishing a surface of a substrate of a compound semiconductor containing an element such as Ga or the like to a desired level of flatness, so that a surface of a sub...
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WO/2011/061884A1 |
A defect on the surface of a workpiece is captured, and information for correction is prepared. On the basis of this information, the height of a foreign object requiring correction is measured. If this measured height is less than the f...
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WO/2011/054481A1 |
The invention relates to a device (10) for the double-sided processing of flat work pieces, comprising an upper working disk (40) and a lower working disk, wherein facing each other between the working surfaces (46) thereof, the working ...
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WO/2011/052267A1 |
Disclosed is a low-cost polishing device provided with: a high polishing ability for eliminating microfissures that exist on the surface of a polygonal column shape comprising a hard material; and a fine polishing ability that eliminates...
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WO/2011/048014A1 |
The invention relates to a grinding machine for grinding a workpiece (20, 22, 48, 60), in particular cams (48, 60), comprising a machine bed (12), a grinding disk (58, 36, 36') which has a profile having a grinding area (74) extending es...
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WO/2011/048013A1 |
The invention relates to a grinding machine for grinding workpieces (20, 22, 48, 60), in particular for simultaneously grinding two closely adjacent workpieces (48). Said grinding machine comprises at least two first grinding spindles (2...
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WO/2011/035864A1 |
The invention relates to a measuring device (2), in particular for in-process measurement on specimens during a machining process on a machine tool, in particular a grinding machine, comprising a main body (18) and a measuring head (12),...
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WO/2011/036789A1 |
Provided is a method of phasing a threaded grinding stone, as well as a gear grinding machine, the aforementioned method and machine being such that the phasing of the threaded grinding stone with respect to a gear to be machined or to a...
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WO/2011/036791A1 |
Provided is a device for phasing a threaded grinding stone, the aforementioned device being configured in a simple manner and capable of accurately phasing the threaded grinding stone with respect to a gear to be machined or to a dresser...
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WO/2011/036790A1 |
Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone with a disk dresser can be detected with hi...
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WO/2011/031506A2 |
A method of finishing an edge of a material to be finished is provided, comprising the steps of applying a removable sensing layer to a portion of the material to be finished, and placing the edge of the material to be finished into a ma...
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WO/2011/030866A1 |
A control unit (72) causes a headstock (20), a tailstock (30), and a tool (43) to make relative movements, thereby machining the peripheral surface of a workpiece (W) in the radial direction. This control unit (72) performs control in su...
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WO/2011/016118A1 |
Disclosed is a grinding device which can perform high-precision end surface grinding with a good work efficiency by a simple constitution. The grinding device can perform fixed-quantity processing (S102-S112) when a control unit (301) an...
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WO/2011/017266A1 |
A method of finishing an optical element includes mounting the optical element in an optical mount having a plurality of fiducials overlapping with the optical element and obtaining a first metrology map for the optical element and the p...
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WO/2011/013710A1 |
A grinding machine, wherein a first grindstone head is provided to a machine base frame (10) with a first movement body (11A) and a first grindstone base (12A) provided therebetween. The base end of a tilting arm (28) is tiltably fitted ...
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WO/2011/012490A1 |
The invention relates to an ultrasonic machining machine having a generator coupled to means for putting it into operation, a transduction assembly equipped with a sonotrode (1), means for managing the descent of the sonotrode towards a ...
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WO/2011/010528A1 |
A master servo motor (16) and a slave servo motor (21), which rotationally drive a master principal axis (Cm) provided with a center (14) that supports one end of a work piece (W), and a slave principal axis (Cs) provided with a center (...
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WO/2011/006650A1 |
The invention discloses a method for microstructuring for improving known polishing methods and polishing devices for correcting geometric deviation defects on precision surfaces. In order to determine the microstructure for the purpose ...
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WO/2011/008499A2 |
In one aspect, a polishing pad includes a homogeneous unitary polishing layer having a polishing surface, an opposed bottom surface, a recess in the polishing surface extending partially but not entirely through the polishing layer, and ...
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WO/2011/004473A1 |
An optical disc polishing apparatus (10) is provided with: an optical disc turntable (15), which is rotary-driven by being horizontally disposed and has an optical disc (14) placed on an upper section thereof; and polishing material turn...
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WO/2010/139397A1 |
The invention relates to a method for machining flat work pieces in a double-sided machine tool comprising an upper and a lower working disc, wherein at least one of the working discs is rotationally driven and each of the working discs ...
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WO/2010/130531A1 |
The invention relates to a grinding device (1) for the surface treatment of rolls (2), particularly of rolls (2) for machines producing, finishing and/or processing webs, such as paper, cardboard or tissue machines, comprising stationary...
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WO/2010/119585A1 |
In order to provide a technology by which an amount of processing, such as an amount of abrading, can be detected without wire bonding, an abrasive apparatus is provided with a capacity (5) formed on an abrasion target (2) by a conductiv...
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WO/2010/112225A1 |
The invention relates to a method for the grinding or polishing machining of very flat work pieces (38) that are releaseably fastened on flat carriers (28). The work pieces (38) are inserted together with the carriers (28) into the reces...
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WO/2010/112635A1 |
Finished ophthalmic lens and corresponding methods. Finished ophthalmic lens that has a concave face and a convex face and an external perimeter (1) and that furthermore has: a thickness within a pre-established range; a central working ...
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WO/2010/113982A1 |
A device for chamfering a glass substrate comprises: a table for supporting the glass substrate; a columnar whetstone used to form multiple annular grooves at predetermined intervals and in the axial direction in order to chamfer the fac...
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WO/2010/090096A1 |
An underwater maintenance device which can maintain the submerged propeller of a ship floating on water without being docked. An underwater maintenance device is provided with: an underwater grinder which has a portable grinding disc wh...
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WO/2010/082992A2 |
A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fi...
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WO/2010/067732A1 |
A grinding device for grinding an object to be ground in such a manner that a grinding tool and the object to be ground are moved while being pressed to each other and the object to be ground is ground by the grinding tool while a grindi...
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WO/2010/037469A1 |
The invention relates to a method for measuring the thickness of disc-shaped work pieces for integrated circuits machined in a machine tool, wherein the machine tool comprises an upper working disc driven in a rotating manner and having ...
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WO/2010/018735A1 |
Even if a belt layer or a belt-reinforcing layer is constituted of a nonmetal material, a belt is reliably detected to form a base tire of desired shape and size. When a tread rubber (10a) positioned on the radially outer side of the be...
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