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WO/2002/041392A2 |
An integrated circuit and manufacturing method therefor is provided having a semiconductor substrate with a semiconductor device. A device dielectric layer [216] is formed on the semiconductor substrate. A channel dielectric layer [208,2...
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WO/2002/032625A2 |
The invention provides abrasive articles (30) comprising: a backing (32) having a first major surface and a second major surface; and an abrasive coating (37) consisting essentially of: a hardened binder coating having a first surface ad...
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WO/2002/022308A1 |
A polishing pad and method, wherein surface dressing is made unnecessary, no deformation occurs with the lapse of working time, there is no clogging otherwise caused by abrasive grains or abraded chips, and the surface of a polish-object...
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WO/2002/004170A1 |
An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding ...
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WO/2002/002272A1 |
A chemical mechanical polishing (CMP) apparatus (200) is provided. A first roller (212a) is situated at a first point and a second roller (212b) situated at a second point, such that the first point is separate from the second point. A p...
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WO/2001/094072A1 |
An apparatus (10) for grinding and/or polishing a surface of a wall element includes a first elongate guide device (30) oriented substantially parallel to the surface of the wall element. A second elongate guide device (36) is movably co...
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WO/2001/089766A1 |
The invention relates to a method for grinding metallic workpieces containing, in particular, nickel, whereby a rotationally driven grinding wheel (2) is continuously dressed by a rotationally driven dressing wheel (3) during the grindin...
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WO/2001/088970A1 |
A method for thinning a semiconductor wafer having a semiconductor element (2) on its surface, by polishing the back thereof. This method comprises bonding the surface of the semiconductor wafer (1) to a support (4) through an adhesive l...
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WO/2001/085392A2 |
A two-step chemical mechanical polishing (CMP) process is provided to minimize (reduce) dishing of metal lines (17) in trenches in an insulation (oxide) layer (12) of each of a plurality of semiconductor wafers during fabrication thereof...
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WO/2001/083165A1 |
The present invention relates to an apparatus (1) for mechanically treating a surface, in particular milling, scouring, grinding and/or polishing the same, using a treatment device (3-9) which rotates about a horizontal axis, which treat...
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WO/2001/083166A1 |
The present invention is a fixed abrasive article (10) for grinding or polishing the surface of a glass workpiece. The abrasive article (10) for grinding glass has abrasive composites (11) containing agglomerates having diamond particles...
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WO/2001/083163A2 |
A method of polishing and cleaning a glass surface with a single abrasive article (13, 13'). The abrasive article (13, 13') includes ceria abrasive particles dispersed in binder, the abrasive article having a textured, three-dimensional ...
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WO/2001/082356A2 |
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the microelectronic substrate is engaged with a planarizing medium that includes a planarizing pad and a planarizing liquid, at least one of which inc...
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WO/2001/076820A1 |
The invention relates to a device for machining workpieces, in particular for finishing metal or ceramic mass-produced parts comprising small components and for machining, using micro-tools. Said device comprises a housing (1), a drive b...
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WO/2001/072472A2 |
A carrier head (100) for a chemical mechanical polishing apparatus includes a flexible membrane (150) that applies a load to a substrate. The substrate backing assembly (112) includes an internal membrane (150), an external membrane (152...
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WO/2001/071730A1 |
The present invention provides systems and methods for grinding wafers for use in manufacturing semiconductor devices. The methods include grinding a semiconductor wafer (318) such that the grind pattern on the wafer is less than ten mic...
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WO/2001/070454A1 |
The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing a wafer having initial thickness variations between two wafer surfaces. Thw wafe...
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WO/2001/070457A1 |
The present invention provides exemplary cluster tool systems and methods for processing wafers, including exemplary double side polishing (DSP) and grind polishing systems and methods. One DSP system includes a first plate (710) having ...
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WO/2001/070458A1 |
A machine for surface working flat ceramic products comprises an operating head comprising tool means (10) suitable for working an external surface of said products (6), cooling conduit means (38, 40, 41, 42, 44, 46) arranged for cooling...
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WO/2001/068320A1 |
The polishing machine for stone materials comprises: a conveyor belt (2) for the slabs or strips to be polished, a beam (7) made to oscillate on at least two transverse, fixed frames (4, 5) above the said conveyor, at least one oscillati...
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WO/2001/066303A1 |
The inventive method is carried out by means of a software-controlled machine tool (1) and a tool whose surface (6) is provided with cutting grains projected from a binding material of the same height. The inventive method makes it possi...
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WO/2001/040138A1 |
A porous silicon carbide sintered compact which comprises a structure being composed of silicon carbide crystals (21, 22) and having open pores (23) present therein, wherein the carbide crystals have an average particle diameter of 20 $g...
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WO/2001/036153A1 |
A method for the precision two-side machining of flat articles consists of the following: A working displacement 'S' of a workpiece (3) into a machining area takes place between the cutting parts of two rotating abrasive diamond tools (1...
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WO/2001/036152A1 |
A machine tool for polishing flat articles comprises a bed (1) with two vertical columns (C2) and a table (3) arranged between (C2) has a rotating faceplate (P4) that is provided with a plate (5) with vacuum holders (6). The machine tool...
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WO/2001/036154A1 |
A method for precision two-sided machining of flat articles consisting in the following: a workpiece which is based at least on three points is introduced into a machining area between oppositely situated cutting elements of diamond tool...
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WO/2001/022484A1 |
A method of efficiently manufacturing a semiconductor wafer having high planarity from a wafer which has passed a surface-grinding process. Low planarity at the center, its vicinity, and the outer periphery of a surface-ground wafer is s...
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WO/2001/021356A1 |
A double side grinding device, comprising a pair of grinding wheels (4), a work rotating device (1), and a moving device (2), wherein each ground surface (4a) is brought into contact with a processed surface (a) on both sides of a work (...
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WO/2001/017414A1 |
Apparatus and methods for particulate containment and collection are disclosed in an apparatus (100) including a shroud (110) attachable to the floor machine (10) and having a skirt portion (114) positionable proximate a work surface to ...
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WO/2001/004227A2 |
An abrasive article (40) is provided comprising a rigid backing (42) having a first major surface (44) and a second major surface (46); a plurality of ceramic abrasive composites (50) each comprising a plurality of abrasive particles (51...
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WO/2000/069597A1 |
A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works (400) integrally with the carrie...
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WO/2000/067950A1 |
A method and a device for simultaneously grinding (lapping) double surfaces, characterized in that a relative position of the center of a thickness of a platy work and/or the center of holding means holding the platy work to the center o...
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WO/2000/066324A1 |
The invention relates to a glass grinding segment which is configured as a glass plate (1) having different possible shapes. The surface (2) of one or both sides of said plate is etched and then chemically hardened. The above glass segme...
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WO/2000/064633A2 |
An abrasive article (10) is provided which comprises a backing (12) and at least one three-dimensional abrasive coating (16) bonded to a surface of the backing (12). The abrasive coating (16) comprises a binder (15) formed from a cured b...
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WO/2000/064631A1 |
A method of grinding a glass or other workpiece is described comprising the steps of: contacting a grinding layer (22) of a flexible abrasive article (10) with the surface of a glass workpiece, the grinding layer comprising abrasive grit...
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WO/2000/064630A1 |
A method of grinding a surface of a glass workpiece is reported which includes (a) contacting a grinding layer of an abrasive article (10) with the surface of the glass workpiece, the grinding layer comprising a plurality of abrasive com...
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WO/2000/062975A1 |
The invention concerns a device for flat deburring by brushing characterised in that it comprises a plurality of brushes (4A to 4H) diametrically opposed in pairs, mounted on a rotary drive head (2A) and driven in rotation on themselves ...
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WO/2000/059678A1 |
The invention relates to a method for grinding a rolled metal band (6). The aim of the invention is to improve the grinding process. To this end, the abrasion of the metal band (6) is influenced by means of actuators. At least one actuat...
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WO/2000/054932A1 |
Automatic smoothing and polishing system for plates and blocks, generally of large sizes, made of marble, granite and plate in general, wherein during the translation of plates or blocks arranged along a conveyor belt (2), at least two r...
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WO/2000/051784A1 |
Magnetic-abrasive machining of a part (6') is performed by generating a magnetic field (5) by two different poles (1, 2) located near one another. This forms a magnetic gradient region (5) with magnetic flux lines which extend from one p...
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WO/2000/044035A1 |
A gas phase planarization process for semiconductor wafers. The present invention comprises a system and method of dry planarization for a semiconductor wafer. For instance, the present invention includes a system adapted to effectively ...
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WO/2000/043161A1 |
The invention relates to a method for machining plane surfaces of a disk brake (1) for motor vehicles. According to the invention, a wheel bearing unit consisting of a wheel hub (2), a roller arrangement (3) and an external bearing ring ...
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WO/2000/038882A2 |
The invention provides for a modular machine frame structure instead of the frame constructions customary to date. According to the invention the individual modules are made of non-metal castings, notably a mineral casting, produced usin...
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WO/2000/037214A1 |
Method for manufacturing cladding tubes for fuel and tubes for construction of fuel rod skeletons made of zirconium-based alloy for nuclear reactors and use of the method. The tubes will be ultrasmooth grounded after conservative manufac...
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WO/2000/036637A1 |
A method of processing a semiconductor wafer sliced from a single-crystal ingot includes lapping front and back surfaces of the wafer to reduce the thickness of the wafer and to improve the flatness of the wafer. The front surface is sub...
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WO/2000/035628A1 |
The invention relates to a novel solution for automating the grinding process of wide grinding machines for flat workpieces based on an optimal starting procedure and a grinding operation monitoring device, wherein the starting procedure...
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WO/2000/032353A2 |
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...
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WO/2000/028583A1 |
A method of producing a semiconductor wafer having a rear surface property and high flatness that can solve problems encountered in a device process involving the rear surface of a double-side, high-glossiness wafer produced by a convent...
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WO/2000/025979A1 |
A border planing machine (1) for wood floors comprising a footing (3) provided with wheels (3a) and a handle (4); a structure (5) which is hinged to the footing (3) so that it can rotate about a longitudinal axis and is adapted to suppor...
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WO/2000/025981A1 |
An unpolished work holding board having a high-precision work holding surface obtained by improving materials for the holding board body of an unpolished work holding board which vacuum-sucks/holds a work and for a resin coating spread o...
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WO/2000/023226A1 |
Lithium niobate and tantalate crystal rods or boules are sawed to wafers with diamond edged saws in the presence of inert fluorinated lubricating liquids.
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