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WO/1988/006950A1 |
A device for abrasive machining comprises an annular support (1) and a chuck (5) kinematically connected to a drive and mounted on a thrust bearing (2) rotatably in a radial bearing (8). The chuck (5) is provided with a coaxial bushing (...
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WO/1988/006497A1 |
The method provides for measuring the tension of the strip and calculating the difference in tension at the inlet of each descaling zone and at its outlet, comparing said difference in tension with a preset difference value and compensat...
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WO/1988/003001A1 |
A cleaning apparatus in its most preferred form of a floor polishing machine (10) having a polishing member (16) rotatably mounted to a platform (18). The polishing member (16) is raised off the floor surface by lift levers (32 and 42) a...
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WO/1987/005846A1 |
A grinding machine comprising a pair of columns (3) erected on a frame (1) facing each other and a support frame (4) fixed between the tops of said two columns (3), wherein a first movement means (16) is provided on said support frame (4...
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WO/1987/002608A1 |
An automatic polishing system (10) for polishing semiconductor material. A robot (20) and Bernoulli pickup (30) are used to retrieve polished wafers from an underwater unload station (62) which is located on a wafer polisher (60). The po...
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WO/1987/001321A1 |
A method of polishing a glass sheet which includes the steps of supporting the glass sheet in a substantially horizontal position with one of its major faces uppermost, providing a substantially horizontal gantry (11) supported so that i...
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WO/1987/000785A1 |
Technique for grinding an end surface of a core (2) of an optical connector used for connecting an optical fiber (11), to grind the same into a convex surface. A grinder (3) is provided with at least a layer (4) of a low-elasticity mater...
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WO/1986/001461A1 |
An abrasive surfacing machine (11) having a surfacing head which utilizes a large disk (81) with a fibrous web abrasive medium (85). The disk is sized to be at least as large in diameter as the width of the underlying workpiece conveyor ...
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WO/1986/000103A1 |
Improved block (1) particularly for building houses, preferably intended to be used as a formwork block and made with a swellable material such as porous concrete. According to the present invention, the block is so fabricated that there...
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WO/1986/000042A1 |
In a method for making a plurality of building blocks with porous concrete in a multicavity mould, wherein the filling mass for a single casting operation to fill the multicavity mould is distributed in dosing chambers before it is fed t...
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WO/1984/003467A1 |
The device comprises a carrier frame (1, 2) secured to the vehicle in place of the braking means. The carrier frame (1, 2) comprises two supports (5) which are displaceable individually and perpendicularly to the disc (13) to be reworked...
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WO/1984/000916A1 |
A grinding machine, especially for continuous hot grinding continuous cast workpieces (2) at their transport between continuous casting and subsequent rolling. The machine comprises a machine stand (1), in which a plurality of grinding m...
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WO/1982/004205A1 |
Apparatus for removing slag from the top surface of metal shapes (W) including a conveyor belt (8) and a pair of vertically adjustable impact units (A and B) located above the conveyor belt (8). Each impact unit (A and B) has an impact e...
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WO/1982/003593A1 |
Stone detection device for a programmed stone flat polishing machine adapted to be mounted on a moving carriage on which a polishing head is arranged. This system comprises flexible conduits (9) provided with nozzles (11) for blowing air...
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WO/1982/003038A1 |
A one-pass type automatic plane multi-head grinding, polishing and cleaning machine, which incorporates a vacuum chuck cleaning unit (1), an automatic wafer-from-cassette conveying unit (2), and a wafer-to-vacuum chuck automatic loading ...
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WO/1982/003040A1 |
Conventional lapping and polishing operations in which parallelism and dimensional accuracy are almost impossible to control are improved. The parallelism and dimensional accuracy are obtained by providing a parallelism adjusting unit (4...
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WO1982000111A1 |
Self-centering feed apparatus (23) for a dual head abrasive grinding machine (11). The grinding heads (17, 18) are mounted in opposed vertical relation, and workpieces are fed therebetween along a horizontal center line or plane. The sel...
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JP2024074421A |
A method for grinding a workpiece is provided that can reduce the frequency of dressing a plurality of grinding wheels and reduce the time required to thin the workpiece. [Solution] A grinding method for a workpiece, in which the workpie...
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JP2024074419A |
A method for grinding a workpiece capable of improving the processing efficiency of the workpiece is provided. [Solution] A method for grinding a workpiece includes a holding step of holding the workpiece on the holding surface of a chuc...
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JP2024074423A |
[Problem] To reduce deterioration of the condition of a second grinding wheel. [Solution] A method for grinding a workpiece includes a first grinding step of grinding a workpiece with a first grinding wheel having a plurality of first gr...
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JP2024074517A |
[Problem] A method for manufacturing plate glass includes an end surface processing step in which the end surface of a plate glass is processed using a plate glass processing device equipped with a guide mechanism that guides the movemen...
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JP2024074516A |
A plate glass processing apparatus that can prevent wear on a guide mechanism that guides the movement of a processing tool, and a plate glass manufacturing method using the plate glass processing apparatus are provided. [Solution] A pla...
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JP2024074422A |
[Problem] To reduce deterioration of the condition of a second grinding wheel. [Solution] A method for grinding a workpiece includes a first grinding step of grinding the workpiece with a first grinding wheel having a plurality of first ...
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JP2024074420A |
A method for grinding a workpiece that can easily reduce thickness variation of a non-circular workpiece is provided. [Solution] A method for grinding a workpiece in which a non-circular workpiece is ground with a grinding wheel equipped...
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JP2024074418A |
The present invention aims to suppress the occurrence of grinding defects in grinding for forming a ring-shaped reinforcing portion on the back surface of a workpiece. [Solution] A method for grinding a workpiece to form a circular reces...
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JP2024073263A |
A processing device is provided that can prevent the device from becoming large even when holding a test piece or the like. [Solution] The processing apparatus comprises a holding table unit 10 that holds a wafer 200 and a cutting unit t...
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JP7491697B2 |
To provide a processing device that can prevent processing chips from scattering and adhering to a processing room.A processing device 2 includes a processing chamber 10 that includes: holding means 4 for holding an object to be processe...
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JP2024072468A |
[Problem] To clarify when to replace a product. [Solution] A two-dimensional code 31, which is a mark indicating the usage limit of the chuck table 20, is embedded in the frame surface 24. The two-dimensional code 31 is configured to be ...
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JP2024071002A |
To provide a processing device that can eliminate the need for a separate means for supplying cooling water in order to keep a chuck table at a constant temperature, thereby eliminating the problem of wastefulness. [Solution] The grindin...
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JP2024069925A |
An object of the present invention is to judge the quality of a holding surface of a grinding device without grinding a wafer. [Solution] Initial holding surface height data, which is the height of the holding surface 22 immediately afte...
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JP7488117B2 |
To suppress unevenness of a thickness of a wafer including a protective member.A thickness of a wafer 100 including a protective member 105 is calculated at least at three positions by using a height gauge 320 of a grinding device 3. An ...
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JP2024068963A |
To perform self-grinding of a holding table using a height gauge without damaging a probe. [Solution] A grinding device that includes a holding table having a holding surface, a grinding unit including a grinding wheel having a grinding ...
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JP2024069177A |
A workpiece forming method and machine for improving the shaping and/or finishing of boules and other workpieces is provided. [Solution] In the system, a machine 100 is positioned within a case 13 by a mounting assembly 50 and includes a...
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JP2024519914A |
Brush assembly for floor machines. The brush includes a base having an annular moat and a plurality of cleaning elements disposed within the annular moat and secured to the base. The trench may include a plurality of pocket sets for rece...
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JP2024068261A |
The present invention provides a method for grinding a workpiece that can suppress deterioration in quality of the workpiece. [Solution] A workpiece is ground by using a first grinding wheel having a first grinding wheel including first ...
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JP2024068262A |
The present invention provides a wafer processing method capable of promoting self-sharpening of each of a plurality of grinding wheels when internal and external grinding is performed on the back side of a wafer included in a stacked wa...
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JP2024068263A |
The present invention provides a wafer processing method capable of promoting self-sharpening of each of a plurality of grinding wheels when internal and external grinding is performed on the back side of a wafer included in a stacked wa...
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JP2024067453A |
An object of the present invention is to reduce the occurrence of chipping at the upper edge and cracking at the lower edge on the inner circumferential side of a ring-shaped reinforcing part. [Solution] By grinding the radial center par...
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JP2024067347A |
An object of the present invention is to prevent machining debris from adhering inside the machining chamber in a processing device in which machining debris is scattered within the machining chamber. [Solution] A chuck table 10 that hol...
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JP2024068111A |
[Problem] To perform three types of processing without separating a wafer from the holding surface of a chuck table. [Solution] By rotating a turntable 25 on which four chuck tables 20 are arranged, a wafer 100 held on one chuck table 20...
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JP2024067725A |
An object of the present invention is to provide a processing device that allows processing tools to be replaced efficiently and in a short time without losing bolts. [Solution] A grinding device (processing device) in which a grinding w...
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JP7486333B2 |
To reduce a setup error.A setup method includes: performing a confirmation step in which a machining tool 34 is made to approach a chuck table 2 by using movement means 4 to form a clearance between a holding surface 200 and a tip 342 of...
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JP2024067754A |
An object of the present invention is to provide a method for processing a workpiece, which can grind a workpiece while keeping the condition of a grinding wheel of a grinding wheel stable. [Solution] A method for processing a workpiece ...
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JP2024067452A |
An object of the present invention is to suppress a convex shape formed on a supported surface of a workpiece that is supported and ground by a holding jig. [Solution] A grinding device including the chuck table, a grinding unit equipped...
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JP2024067243A |
An object of the present invention is to provide a grinding device and a grinding method that prevent the accumulation of grinding debris inside a wheel base and do not cause damage such as cracks or scratches to a workpiece. A grinding ...
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JP2024065409A |
The present invention provides a wafer processing method that can reduce chipping. A flattening step for flattening a protection member 113 is performed before a holding step and a processing groove forming step. Therefore, when the prot...
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JP2024066327A |
An object of the present invention is to provide a wafer polishing method that can polish the ground surface of a wafer with high precision. [Solution] A wafer polishing method is a wafer polishing method for polishing a circular concave...
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JP7482734B2 |
To provide a technology which can inhibit a grinding liquid contaminated by grinding dust from being discharged with a gas to the outside of a grinding device.A grinding device includes: chucks; a housing; a tool drive part; a nozzle; an...
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JP2024063935A |
An object of the present invention is to provide a wafer processing method capable of suppressing damage to devices due to the formation of thinned wafers and suppressing a decrease in the number of chips that can be manufactured from th...
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JP2024063936A |
An object of the present invention is to provide a wafer processing method capable of suppressing damage to devices due to the formation of thinned wafers and suppressing a decrease in the number of chips that can be manufactured from th...
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