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JP2019178190A |
To provide a resin composition used in manufacturing a molded article preferably, improving adhesiveness or compatibility with a resin material and a particle or the like, and capable of enhancing mechanical strength of the molded articl...
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JP2019529593A |
Provided herein are curable compositions comprising 1,1-2 activated vinyl compounds. Also provided are coatings formed from 1,1-2 activated vinyl compounds. Also provided are methods for coating substrates and articles. A curable composi...
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JP2019178192A |
To provide a resin composition used in manufacturing a molded article preferably, improving adhesiveness or compatibility with a resin material and a particle, and capable of enhancing mechanical strength of the molded article.There are ...
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JP6590572B2 |
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JP2019167496A |
To provide a heat-resistant resin composition excellent in heat resistance.The heat-resistant resin composition comprises: a polymer comprising a structural unit derived from a maleic anhydride represented by a prescribed general formula...
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JP2019156887A |
To provide an aqueous dispersion which allows for formation of a coated film excellent in adhesion to a polyolefin resin, water resistance, and chemical resistance, and which is excellent in stability of being mixed with an additive.The ...
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JP6577138B2 |
The invention relates to penflufen-containing polymer particles, to penflufen-containing compositions comprising them, to processes for preparing them, and to the use thereof for protecting technical materials, more particularly wood, wo...
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JP6572532B2 |
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JP6571169B2 |
The present invention relates to a styrene-based thermoplastic resin composition with improved flowability and, more specifically, a thermoplastic resin composition, which retains heat resistance and improved flowability by introducing a...
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JP6569227B2 |
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JP2019137769A |
To provide a thermoplastic resin composition, and a molded product excellent in toughness, heat resistance, and surface smoothness.A thermoplastic resin composition is composed of: 25-40 pts.wt. of a graft copolymer (I) obtained by graft...
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JP6557965B2 |
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JP6550872B2 |
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JP6545179B2 |
The present invention provides a process for producing a resin sheet which has satisfactory surface properties and is inhibited from suffering warpage due to residual stress. The ratio of the difference between the coefficient of linear ...
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JP2019099710A |
To provide a thermosetting resin composition having excellent heat resistance, low thermal expansion, a low dielectric constant and a low dielectric loss tangent, and to provide a prepreg, a laminate, a printed wiring board and a high-sp...
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JP2019099735A |
To provide a thermoplastic resin composition good in flowability and moldability, and excellent in impact resistance, heat resistance and chemical resistance of the resulting molded article.There is provided a thermoplastic resin composi...
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JP6524262B2 |
The disclosure relates to compositions containing 1,1-disubstituted alkene compounds capable of preparing polymers having glass transition temperatures above room temperature. The present teaching also relates to polymers prepared 1,1-di...
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JP6509592B2 |
To provide a carbon black dispersion liquid which is excellent in dispersibility and dispersion stability of fine carbon black having an average primary particle diameter of 30 nm or less; and to provide a carbon black composite resin wh...
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JP6503374B2 |
The present invention relates to a thermoplastic resin composition with excellent chemical resistance and, more specifically, to a resin composition for blow molding and a molded product obtained by molding the same, the composition main...
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JP6491506B2 |
To provide a polycarboxylic acid based polymer composition being a composition including a polycarboxylic acid based polymer obtained by polymerizing an unsaturated monocarboxylic acid based monomer or an unsaturated dicarboxylic acid ba...
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JP6468393B2 |
This resin composition comprises a phenol resin, and a polymer including a repeating unit represented by formula (1). (In formula (1), RX, RY are each independently hydrogen or an organic group having 1 to 3 carbon atoms.)
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JP2019019264A |
To provide a thermoplastic resin composition which can improve impact resistance, tapping strength and coating properties of a thick part of a molded article in a well balanced manner.A thermoplastic resin composition contains 5-30 pts.m...
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JPWO2017170041A1 |
The rate of decrease in the molecular weight of the acrylic polymer is less than 50% when it contains an acrylic polymer and a polyfunctional organic compound having a urea group and is heated in air at 190 ° C. for 144 hours. A certain...
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JP6465104B2 |
A nitrile copolymer rubber composition comprising a nitrile copolymer rubber (A) containing 35 to 80 wt% of ±,²-ethylenically unsaturated nitrile monomer units (a1), 19.5 to 64.5 wt% of conjugated diene monomer units (a2), and 0.5 to 2...
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JP2019502776A |
The present invention relates to (a) a monomer containing at least one functionalized or defunctionalized acryloyl moiety and at least one lactam moiety, (b) any monomer containing at least one double bond, and (c) at least one. With res...
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JP6454416B2 |
The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transi...
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JP2019001912A |
To provide a conductive resin composition that can form a shield layer, by spraying, which has excellent shield properties, excellent adhesion to a package, and resists discoloration under sever heat conditions, and a method for producin...
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JP2019001981A |
To provide a resin composition that makes it possible to give a foam molding showing excellent foam molding properties.A polylactic acid resin composition for the production of foamed particles, contains a base material resin in which a ...
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JP6445848B2 |
To provide a maleimide compound-containing resin composition excellent in heat resistance, containing a phenolic oligomer comprising a dihydric allyl-substituted phenolic compound formed by substituting a dihydric phenol with an allyl gr...
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JP6445011B2 |
A polymer having a partial structure formed by performing radical polymerization with respect to a compound having a mesogenic group derived from at least one type of liquid crystal compound selected from a rod-like liquid crystal compou...
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JP6430950B2 |
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JP2018534415A |
A method for preparing an aqueous solution of a cycloimide-containing polymer is an aqueous solution of a cycloanhydride-containing polymer in a ratio of about 1: 1 to about 1: 1.5 cycloanhydride to neutralizer with a first neutralizer. ...
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JP6426514B2 |
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JP6420479B2 |
A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin...
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JP6414352B2 |
This resin composition comprises a phenol resin, and a polymer including a repeating unit represented by formula (1). (In formula (1), RX, RY are each independently hydrogen or an organic group having 1 to 3 carbon atoms.)
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JP6414237B2 |
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JP6389886B2 |
It is an object of the present invention to provide an excellent thermosetting resin that achieves both higher heat resistance and higher toughness and mechanical strength for improving cracking resistance and lower viscosity which are c...
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JP2018138656A |
To provide a technique on a phenolic resin composition for a friction material that is useful for preparing the friction material having improved durability while maintaining flexibility.A resin composition contains phenolic resin, and a...
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JP6387122B2 |
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JP2018135447A |
To provide a resin composition that is used for an insulation material such as a laminate or a printed wiring board, or a sealing material to seal a semiconductor element, the resin composition having excellent temperature cycle reliabil...
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JP6380045B2 |
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JP6381802B2 |
A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40...
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JP2018523733A |
The present invention relates to partial decarboxylation of polyitaconic acid polymers or copolymers. This partially decarboxylated resin is suitable not only for use in the preparation of dispersions, but also for anti-scale applications.
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JP6378346B2 |
Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation...
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JP2018127564A |
To provide a resin composition having excellent heat resistance.A resin composition contains a polymer containing: a first structural unit derived from a first esterified product in which an acid anhydrous ring of an unsaturated carboxyl...
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JP6373072B2 |
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JP2018125094A |
To provide a binder composition which never mars a function as a nonaqueous electrolyte battery electrode binder, i.e. a binding ability among active materials and with a collector electrode, and the toughness as an electrode, and which ...
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JP2018115249A |
To provide a resin composition excellent in heat resistance.The resin composition includes: a phenol resin; and a polymer including a structural unit A derived from unsaturated carboxylic acid anhydride having a cyclic structure in the m...
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JP6364490B2 |
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JP6359579B2 |
[Problem] The purpose of the present invention is to provide a resin film having an excellent appearance. [Solution] A resin film comprising a thermoplastic resin composition containing a polymer (A) that includes a cyclic acid anhydride...
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