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Matches 1 - 50 out of 6,107

Document Document Title
WO/2024/117021A1
Provided is a heat resistant adhesive film that can be attached to the back surface of a lead frame after a wire bonding step in a method for producing a semiconductor package, said heat resistant adhesive film comprising an adhesive lay...  
WO/2024/118691A1
A silicone gel forming composition containing an a-dimethylvinylsiloxy-co-dimethylhydride terminal polydimethylsiloxane; an a-dimethylvinylsiloxy-oj-n-butyl terminal polydimethylsiloxane; and a hydrosilylation catalyst is provided. When ...  
WO/2024/108681A1
The present invention relates to the field of organosilicon potting compounds, in particular to an ultra-low-density super-flame-retardant organosilicon thermal-insulating potting compound and a preparation method therefor. The potting c...  
WO/2024/108683A1
The present invention relates to the field of organic silicon, and in particular to a two-component sealant for solar photovoltaic modules and a preparation method therefor. The two-component sealant for solar photovoltaic modules compri...  
WO/2024/103503A1
The present invention belongs to the field of polymer materials, and particularly relates to an adhesive, and a preparation method therefor and the use thereof. The adhesive of the present invention comprises the following components in ...  
WO/2024/106077A1
In the present invention, a bonded member is obtained by bonding together a plurality of members, including a member in which at least a portion of a bonding interface is metal, by means of a cured product obtained by curing a curable si...  
WO/2024/106900A1
The present invention relates to a thermal compression finishing tape comprising: a substrate; a pressure-sensitive adhesive layer laminated on one surface of the substrate; an adhesive layer laminated on the other surface of the substra...  
WO/2024/092554A1
The present invention provides a thermally conductive silicone adhesive composition comprising: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of at least two hydrogen atoms direct...  
WO/2024/090936A1
A fireproof bus bar of the present invention comprises: a bus bar conducting unit; a fireproof silicon coating layer ceramicized at a high temperature while encompassing portions that exclude end portions on both sides of the bus bar con...  
WO/2024/088062A1
The present application relates to a thermally-conductive addition type organosilicon composition for potting, a method for preparing the organosilicon composition, and a product prepared from the organosilicon composition. The organosil...  
WO/2024/084837A1
The present invention is a heat radiation composite film that includes a heat radiating layer and an adhesive layer, the film being characterized in that: the thickness of the heat radiating layer is 5-200 μm; one surface of the heat ...  
WO/2024/075543A1
Provided are: a room-temperature-curable organopolysiloxane composition that makes it possible to bring unpleasant odors and storage stability under control; and an adhesive agent and a coating agent containing the composition. The room-...  
WO/2024/066254A1
Disclosed are a low-modulus die attach film adhesive for a vertically stacked package, a preparation method therefor and an application thereof. The die attach film adhesive comprises the following raw materials: 2-5 parts by mass of sil...  
WO/2024/063068A1
[Problem] To provide an ultraviolet-curable composition containing silicon atoms, wherein the ultraviolet-curable composition has a high ability to adjust the mechanical properties of the cured product thereof, and has excellent workabil...  
WO/2024/062968A1
The present invention is a cyclic organopolysiloxane characterized by being represented by general formula (1). Through this feature, provided are: a cyclic organopolysiloxane that is an adhesion promoter excellent in adhesion to a metal...  
WO/2024/063069A1
[Problem] To provide a silicon-atom-containing ultraviolet-curable composition which ensures high regulation ability for the mechanical properties of products to be obtained by curing the composition and which, although being of a solven...  
WO/2024/062973A1
The present invention is a cyclic organopolysiloxane characterized by being represented by general formula (1). Thus, provided are: a cyclic organopolysiloxane that has excellent adhesiveness to metal and resin and that provides an adhes...  
WO/2024/057924A1
[Problem] To provide: a curable silicone composition having UV-light delayed curability, transparency, and low yellowing under high temperature conditions, and being capable of exhibiting high adhesive strength even to a base material, s...  
WO/2024/056507A1
The invention relates to curable compositions based on polyorganosiloxanes with silicon-containing terminal groups, a polymer having at least one silane-functional group, and optionally at least one curing catalyst. The invention also re...  
WO/2024/046715A1
The present invention relates to novel silanes of the formula Si(R1)m(R2)4-m, wherein each R1 independently stands for a substituted or unsubstituted alkyl, alkenyl, or alkynyl group; a substituted or unsubstituted cycloaliphatic group o...  
WO/2024/040687A1
The present invention relates to the field of silicone structural sealants, and in particular to a single-component transparent silicone structural sealant for photovoltaics and a preparation method therefor. The single-component transpa...  
WO/2024/027006A1
The present invention relates to the field of silicone sealants, in particular to a low-toxicity single-component silicone sealant for a photovoltaic frame and a preparation method therefor. The silicone sealant is composed of raw materi...  
WO/2024/029782A1
The present invention may provide a light modulation device and a use thereof. The present invention may provide: a light modulation device wherein an adhesive layer or bonding layer is applied to ensure adhesion between facing substrate...  
WO/2024/027932A1
The present disclosure provides: a silicone composition including: (a1) a first organopolysiloxane including at least two unsaturated hydrocarbons; (a2) a second organopolysiloxane including at least one unit represented by SiO4/2; (b) a...  
WO/2024/027906A1
The present disclosure provides a silicone composition including: (a1) a first organopolysiloxane including a C2 to C20 alkenyl group bonded to at least one Si at both ends or a chain, the first organopolysiloxane formed from a unit repr...  
WO/2024/025185A1
The present invention relates to a primer composition for a glass adhesive, comprising a first silane oligomer, a second silane oligomer, and an acryl polymer, wherein the first silane oligomer contains an amino group and an epoxy group ...  
WO/2024/000245A1
An object of the present invention is to provide a UV curable organopolysiloxane composition without using organic solvent, in which a cured product obtained by curing has sufficient hardness and toughness, with particularly excellent wo...  
WO/2023/234084A1
The present invention provides a two-pack type room temperature curable organopolysiloxane composition which exhibits both excellent fast curing properties and excellent bonding properties without the addition of a metal-based condensati...  
WO/2023/232982A1
The present invention relates to a coating composition a substrate, comprising: a microcrystalline cellulose composition, at least one silane, at least one acid catalyst, a liquid dispersion phase, and optionally at least one inorganic f...  
WO/2023/234189A1
Provided are an adhesive film and an adhesive label that have good flatness and excellent adhesiveness, and in which no wrinkles or curls occur in the process of imparting adhesiveness thereto. The adhesive film comprises an adhesive l...  
WO/2023/234155A1
The present invention provides: a laminate having an adhesive layer that has both a bonding function and a release function in a single layer and can be released using photoradiation, the laminate being capable of firmly bonding together...  
WO/2023/228636A1
The present invention is an addition-curable mold-releasing silicone composition that is for a silicone adhesive and that comprises: (A) a fluorine-containing organopolysiloxane which has at least two alkenyl groups bonded to a silicon a...  
WO/2023/227714A1
The present invention relates to a transition metal compound, comprising at least one phosphite compound of the formula P(OR)3 wherein R represents an organic group, and wherein at least one group R is represented by the formula (II) A, ...  
WO/2023/224174A1
The present invention relates to an electrically conductive low-temperature-curable adhesive composition. Specifically, the present invention relates to an electrically conductive thermosetting silicone adhesive composition for LED packa...  
WO/2023/216074A1
An insulating, compressible, and flame-resistant foamed material comprises a polyorganosiloxane foam, a fire retardant, and micron-sized hollow ceramic particles. The foamed material is useful for providing heat insulation, flame resista...  
WO/2023/216073A1
A composition comprises reactive polysiloxanes and hydroxyl-containing precursors, a fire retardant, and micron-sized hollow ceramic particles. The composition is useful in the preparation of an insulating, compressible, and flame-resist...  
WO/2023/213430A1
The present invention relates to a medical silicone pressure-sensitive adhesive composition comprising at least one organopolysiloxane gum A comprising, per molecule, at least two C2 to C6 alkenyl radicals each bonded to a silicon atom, ...  
WO/2023/212403A1
The present disclosure is an adhesive composition which is compatible with propellants, suitable for deployment via a canister, and configured for use on substrates which include rubber such as thermoplastic polyolefin (TPO) and plastic ...  
WO/2023/202470A1
A curable siloxane composition, and a use thereof in skin care products. Provided is a curable silicone composition, comprising: (a) based on the total weight of the curable silicone composition, an organosiloxane component having an alk...  
WO/2023/205123A1
A liquid optically clear adhesive (LOCA) for bonding optical substrates includes siloxane and epoxy-containing oligomers, a UV-activated photo-acid generator, a cross-linker additive, a solvent; and a reactive plasticizer, such as an add...  
WO/2023/204091A1
Provided is a heat-resistant adhesive film for a semiconductor package manufacturing step, the heat-resistant adhesive film having low adhesive strength at room temperature and favorable reworkability and attachability to a lead frame, w...  
WO/2023/195390A1
[Problem] To provide: a silicone adhesive composition for forming an adhesive layer capable of maintaining high adhesive strength and holding power even at high temperatures above 150°C; and an adhesive tape and an adhesive film compris...  
WO/2023/195268A1
The present invention is a silicone pressure-sensitive adhesive composition that contains: (A) an organopolysiloxane which is represented by average formula (1) and in which the content of silicon atom-bonded alkenyl groups is 0.0010-0.0...  
WO/2023/195671A1
The present invention relates to a glass adhesive primer composition, which does not use organic solvents, and thus is environmentally friendly and can be ensured to have a sufficient pot life, the primer composition comprising: a mercap...  
WO/2023/188521A1
The present invention addresses the problem of providing a wafer production method that makes it possible to remove an adhesive material from a laminate that comprises a wafer and the adhesive material more simply and stably than convent...  
WO/2023/184222A1
A curable composition contains: (A) a polydiorganosiloxane component including: (A1) greater than 3.1 wt% to 20 wt% of an aliphatically unsaturated polydiorganosiloxane polymer and (A3) a hydroxyl-terminated polydiorganosiloxane gum of u...  
WO/2023/182138A1
The present invention provides an adhesive and a laminated body having the adhesive. The adhesive exhibits excellent performance in spin coating onto a wafer circuit surface or a support body (support substrate), is excellent in heat res...  
WO/2023/170501A1
Curable bonding compositions include a free radically polymerizable bis- maleimide resin, a polymerizable siloxane -based release agent, and an optional thermal or ultraviolet free radical initiator. The curable composition is a coatable...  
WO/2023/172340A1
A laminate includes a silicone pressure sensitive adhesive adhered to an article comprising a fluorosilicone rubber or a silicone foam. A method for fabricating the laminate is provided.  
WO/2023/166775A1
Provided is an adhesive sheet 1 including a single-layered or multi-layered adhesive agent layer 11, in which at least one of layers constituting the adhesive agent layer 11 comprises an adhesive agent comprising a modified cyclodextrin....  

Matches 1 - 50 out of 6,107