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WO/2024/154409A1 |
An adhesive composition containing two or more release agent components.
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WO/2024/154702A1 |
An adhesive composition cured by means of a hydrosilylation reaction, the adhesive composition containing a platinum group metal catalyst and a compound represented by formula (1). (In formula (1), R1 and R2 each independently represent ...
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WO/2024/148574A1 |
This invention relates to an adhesive composition which is advantageously employed to improve the bonding of various of low energy substrates such as rubber-based substrates. The adhesive composition comprises silicone, fillers, and spec...
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WO/2024/149457A1 |
Provided is a silicone-based resin composition, including: an organic polysiloxane; and a conductive filler, wherein the silicone-based resin composition has a thermal conductivity change rate of 30% or less as measured by the following ...
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WO/2024/149458A1 |
Disclosed are a silicone-based resin composition including an organic polysiloxane and a conductive filler; and a semiconductor device including the silicone-based resin composition, wherein a relative ratio of a change in thermal conduc...
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WO/2024/145274A1 |
The present disclosure provides a curable silicone composition having a refractive index at 25 °C of 1.42 to 1.50 measured by means of an abbe refractometer at a wavelength of 589 nm, the composition comprising: (A) an organopolysiloxan...
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WO/2024/141497A1 |
The invention relates to new silicone layers showing excellent properties when being adhered to a surface such as skin. The silicone layer can for example be used as a wound contact layer for the preparation of articles such as wound dre...
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WO/2024/135805A1 |
[Problem] To provide: a curable silicone composition which can be cured rapidly at low temperatures, has excellent storage stability, and which forms, through curing, a relatively hard cured product that has less surface tackiness; a cur...
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WO/2024/130669A1 |
An electronic article having an interlayer adhesive layer, of which a temperature at tan δ peak is below 35℃, and tan δ value at peak is greater than 1.0, as measured by a dynamic mechanical analysis rheometer using a parallel plate ...
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WO/2024/136390A1 |
[Problem] An object of the present invention is to provide a dual curable organopolysiloxane composition which has the ability to both photo-cure and cure through exposure to moisture, and which exhibits excellent curability and long-ter...
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WO/2024/135806A1 |
[Problem] To provide: a hot melt curable silicone composition which is useful as a material for a die attach film, with which an unwanted dicing tape can be easily separated after dicing from a surface of a semiconductor device in a semi...
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WO/2024/135958A1 |
The present invention relates to a laminated film for a solar module having excellent radiation cooling properties, and a solar module comprising same. According to one embodiment, the laminated film for a solar module comprises a coatin...
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WO/2024/130670A1 |
A silicone-based pressure sensitive adhesive layer-forming composition comprising components (A) to (E): (A) a linear organopolysiloxane having alkenyl group in numbers greater than 1 on average per molecule; (B) an organopolysiloxane re...
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WO/2024/127889A1 |
The present invention provides a thermally conductive composite silicone rubber sheet which comprises a thermally conductive silicone rubber sheet and a thermally softening silicone resin layer that is disposed on one surface or both sur...
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WO/2024/117021A1 |
Provided is a heat resistant adhesive film that can be attached to the back surface of a lead frame after a wire bonding step in a method for producing a semiconductor package, said heat resistant adhesive film comprising an adhesive lay...
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WO/2024/118691A1 |
A silicone gel forming composition containing an a-dimethylvinylsiloxy-co-dimethylhydride terminal polydimethylsiloxane; an a-dimethylvinylsiloxy-oj-n-butyl terminal polydimethylsiloxane; and a hydrosilylation catalyst is provided. When ...
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WO/2024/108681A1 |
The present invention relates to the field of organosilicon potting compounds, in particular to an ultra-low-density super-flame-retardant organosilicon thermal-insulating potting compound and a preparation method therefor. The potting c...
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WO/2024/108683A1 |
The present invention relates to the field of organic silicon, and in particular to a two-component sealant for solar photovoltaic modules and a preparation method therefor. The two-component sealant for solar photovoltaic modules compri...
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WO/2024/103503A1 |
The present invention belongs to the field of polymer materials, and particularly relates to an adhesive, and a preparation method therefor and the use thereof. The adhesive of the present invention comprises the following components in ...
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WO/2024/106077A1 |
In the present invention, a bonded member is obtained by bonding together a plurality of members, including a member in which at least a portion of a bonding interface is metal, by means of a cured product obtained by curing a curable si...
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WO/2024/106900A1 |
The present invention relates to a thermal compression finishing tape comprising: a substrate; a pressure-sensitive adhesive layer laminated on one surface of the substrate; an adhesive layer laminated on the other surface of the substra...
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WO/2024/092554A1 |
The present invention provides a thermally conductive silicone adhesive composition comprising: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of at least two hydrogen atoms direct...
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WO/2024/090936A1 |
A fireproof bus bar of the present invention comprises: a bus bar conducting unit; a fireproof silicon coating layer ceramicized at a high temperature while encompassing portions that exclude end portions on both sides of the bus bar con...
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WO/2024/088062A1 |
The present application relates to a thermally-conductive addition type organosilicon composition for potting, a method for preparing the organosilicon composition, and a product prepared from the organosilicon composition. The organosil...
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WO/2024/084837A1 |
The present invention is a heat radiation composite film that includes a heat radiating layer and an adhesive layer, the film being characterized in that: the thickness of the heat radiating layer is 5-200 μｍ; one surface of the heat ...
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WO/2024/075543A1 |
Provided are: a room-temperature-curable organopolysiloxane composition that makes it possible to bring unpleasant odors and storage stability under control; and an adhesive agent and a coating agent containing the composition. The room-...
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WO/2024/066254A1 |
Disclosed are a low-modulus die attach film adhesive for a vertically stacked package, a preparation method therefor and an application thereof. The die attach film adhesive comprises the following raw materials: 2-5 parts by mass of sil...
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WO/2024/063068A1 |
[Problem] To provide an ultraviolet-curable composition containing silicon atoms, wherein the ultraviolet-curable composition has a high ability to adjust the mechanical properties of the cured product thereof, and has excellent workabil...
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WO/2024/062968A1 |
The present invention is a cyclic organopolysiloxane characterized by being represented by general formula (1). Through this feature, provided are: a cyclic organopolysiloxane that is an adhesion promoter excellent in adhesion to a metal...
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WO/2024/063069A1 |
[Problem] To provide a silicon-atom-containing ultraviolet-curable composition which ensures high regulation ability for the mechanical properties of products to be obtained by curing the composition and which, although being of a solven...
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WO/2024/062973A1 |
The present invention is a cyclic organopolysiloxane characterized by being represented by general formula (1). Thus, provided are: a cyclic organopolysiloxane that has excellent adhesiveness to metal and resin and that provides an adhes...
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WO/2024/057924A1 |
[Problem] To provide: a curable silicone composition having UV-light delayed curability, transparency, and low yellowing under high temperature conditions, and being capable of exhibiting high adhesive strength even to a base material, s...
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WO/2024/056507A1 |
The invention relates to curable compositions based on polyorganosiloxanes with silicon-containing terminal groups, a polymer having at least one silane-functional group, and optionally at least one curing catalyst. The invention also re...
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WO/2024/046715A1 |
The present invention relates to novel silanes of the formula Si(R1)m(R2)4-m, wherein each R1 independently stands for a substituted or unsubstituted alkyl, alkenyl, or alkynyl group; a substituted or unsubstituted cycloaliphatic group o...
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WO/2024/040687A1 |
The present invention relates to the field of silicone structural sealants, and in particular to a single-component transparent silicone structural sealant for photovoltaics and a preparation method therefor. The single-component transpa...
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WO/2024/027006A1 |
The present invention relates to the field of silicone sealants, in particular to a low-toxicity single-component silicone sealant for a photovoltaic frame and a preparation method therefor. The silicone sealant is composed of raw materi...
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WO/2024/029782A1 |
The present invention may provide a light modulation device and a use thereof. The present invention may provide: a light modulation device wherein an adhesive layer or bonding layer is applied to ensure adhesion between facing substrate...
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WO/2024/027932A1 |
The present disclosure provides: a silicone composition including: (a1) a first organopolysiloxane including at least two unsaturated hydrocarbons; (a2) a second organopolysiloxane including at least one unit represented by SiO4/2; (b) a...
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WO/2024/027906A1 |
The present disclosure provides a silicone composition including: (a1) a first organopolysiloxane including a C2 to C20 alkenyl group bonded to at least one Si at both ends or a chain, the first organopolysiloxane formed from a unit repr...
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WO/2024/025185A1 |
The present invention relates to a primer composition for a glass adhesive, comprising a first silane oligomer, a second silane oligomer, and an acryl polymer, wherein the first silane oligomer contains an amino group and an epoxy group ...
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WO/2024/000245A1 |
An object of the present invention is to provide a UV curable organopolysiloxane composition without using organic solvent, in which a cured product obtained by curing has sufficient hardness and toughness, with particularly excellent wo...
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WO/2023/234084A1 |
The present invention provides a two-pack type room temperature curable organopolysiloxane composition which exhibits both excellent fast curing properties and excellent bonding properties without the addition of a metal-based condensati...
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WO/2023/232982A1 |
The present invention relates to a coating composition a substrate, comprising: a microcrystalline cellulose composition, at least one silane, at least one acid catalyst, a liquid dispersion phase, and optionally at least one inorganic f...
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WO/2023/234189A1 |
Provided are an adhesive film and an adhesive label that have good flatness and excellent adhesiveness, and in which no wrinkles or curls occur in the process of imparting adhesiveness thereto. The adhesive film comprises an adhesive l...
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WO/2023/234155A1 |
The present invention provides: a laminate having an adhesive layer that has both a bonding function and a release function in a single layer and can be released using photoradiation, the laminate being capable of firmly bonding together...
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WO/2023/228636A1 |
The present invention is an addition-curable mold-releasing silicone composition that is for a silicone adhesive and that comprises: (A) a fluorine-containing organopolysiloxane which has at least two alkenyl groups bonded to a silicon a...
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WO/2023/227714A1 |
The present invention relates to a transition metal compound, comprising at least one phosphite compound of the formula P(OR)3 wherein R represents an organic group, and wherein at least one group R is represented by the formula (II) A, ...
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WO/2023/224174A1 |
The present invention relates to an electrically conductive low-temperature-curable adhesive composition. Specifically, the present invention relates to an electrically conductive thermosetting silicone adhesive composition for LED packa...
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WO/2023/216074A1 |
An insulating, compressible, and flame-resistant foamed material comprises a polyorganosiloxane foam, a fire retardant, and micron-sized hollow ceramic particles. The foamed material is useful for providing heat insulation, flame resista...
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WO/2023/216073A1 |
A composition comprises reactive polysiloxanes and hydroxyl-containing precursors, a fire retardant, and micron-sized hollow ceramic particles. The composition is useful in the preparation of an insulating, compressible, and flame-resist...
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