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WO/2023/042409A1 |
The purpose of the present invention is to provide an adhesive sheet having an adhesive agent layer that has an adhesive surface having a wettability unlikely to change even when being exposed in an air environment and that is unlikely t...
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WO/2023/042745A1 |
[Problem] To provide: an organopolysiloxane composition which can undergo a curing reaction, which forms a slightly-adhesive adhesive agent layer having excellent transparency, and from which it is possible to design a heat-curable/light...
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WO/2023/042744A1 |
[Problem] To provide a curable reactive organopolysiloxane composition that can be made heat curable/light curable, enables design of a composition coatable even at a low solvent content and has sufficient adhesive strength, a cured prod...
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WO/2023/042811A1 |
Provided are: a method for cleaning a semiconductor substrate by which it is possible to remove (clean), in a shorter time and more cleanly by a simple operation, an adhesive layer obtained by using, for example, a siloxane-based adhesiv...
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WO/2023/042813A1 |
Provided are: a method for cleaning a semiconductor substrate having an adhesive layer on the surface thereof, in which removal (cleaning) can be performed in a shorter period of time and more thoroughly via a simple operation; a method ...
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WO/2023/039317A1 |
A laminate article includes a silicone pressure sensitive adhesive adhered to an article comprising a silicone rubber. A method for fabricating the laminate article is provided.
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WO/2023/033089A1 |
The present invention provides a cover member suited to preventing damage to a semiconductor element package caused by an increase in internal pressure. The provided cover member comprises: a cover sheet having a shape that covers a targ...
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WO/2023/032745A1 |
Provided are: a novel organopolysiloxane compound represented by general formula (1); a room temperature-curable organopolysiloxane composition which contains said compound and a hydrolyzable organosilane compound having a cycloalkenyl o...
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WO/2023/032782A1 |
A multilayer body which comprises a semiconductor substrate, a supporting substrate and a bonding layer that is provided between the semiconductor substrate and the supporting substrate, wherein: the bonding layer is formed of a cured pr...
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WO/2023/019504A1 |
A composition contains: (A) a curable silicone composition including: (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30-400 milliPascal*seconds, (a2) a silicon-hydride functional crosslink...
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WO/2023/017342A1 |
A curable composition comprises a siloxane compound and a tetraalkyl orthotitanate. The siloxane compound comprises m divalent units represented by the formula –SiH(R1)O–, n divalent units represented by the formula –Si(R1)(OR2)Oâ€...
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WO/2023/008204A1 |
This layered body manufacturing method includes: a step in which a first adhesive coating layer is formed on a surface of a support substrate; a step in which a second adhesive coating layer is formed on a surface of a semiconductor subs...
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WO/2023/008493A1 |
Provided are: a silane compound represented by general formula (1); and a polyorganosiloxane compound obtained through condensation of said silane compound. This polyorganosiloxane compound includes a structure represented by general for...
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WO/2023/008207A1 |
This layered body manufacturing method includes: a step in which a first adhesive coating layer is formed on a surface of a release agent coating layer formed on a surface of a support substrate; a step in which a second adhesive coating...
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WO/2023/002966A1 |
An ultraviolet ray curable silicone composition according to the present invention contains (A) an organopolysiloxane including an alkenyl group bound to at least two silicon atoms, (B) a strain-chain organohydrogenpolysiloxane having th...
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WO/2023/000218A1 |
An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive.
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WO/2023/001887A1 |
The present invention relates to a process for producing adhesive and sterile silicone, to the adhesive and sterile silicone as such and to a wound dressing comprising a layer of the adhesive and sterile silicone.
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WO/2023/002920A1 |
The purpose of the present invention is to provide a laminate roll having excellent long-term heat resistance even when a metal substrate having a high surface roughness is used.　The present invention provides a laminate roll in which ...
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WO/2023/002919A1 |
Provided is a laminate that has excellent long-term heat resistance even when a metal substrate having a high surface roughness is used.　A heat-resistant polymer film, an adhesive layer, and a metal substrate are layered in this order ...
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WO/2023/283819A1 |
A thermal conductive silicone composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule and having a viscosity at 25℃ of from 10 to 10,000Pa·S, (B) an organopolysiloxane havin...
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WO/2023/279327A1 |
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a topside protective film. ...
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WO/2023/272417A1 |
This relates to a process for the preparation of a one component translucent room temperature vulcanisable (RTV) silicone composition comprising chain-extended alkoxy end-capped polydiorganosiloxane polymers, and tin-based catalysts. The...
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WO/2023/273538A1 |
Disclosed in the present invention are a thermally conductive structural adhesive for a new energy power battery and a manufacturing method therefor, comprising: 3-14% a component A containing at least one of a block polymerized telechel...
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WO/2023/276638A1 |
A method for producing a multilayer body that comprises two silicon substrates, the method comprising a novel process for bonding the two silicon substrates. A method for producing a multilayer body that comprises two silicon substrates,...
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WO/2022/267990A1 |
The present invention relates to a nopol bio-based silicon-containing oxetane monomer, a method for preparing the monomer, a photocurable composition comprising the monomer, and a photocurable material derived from the photocurable compo...
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WO/2022/261858A1 |
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a topside protective film. ...
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WO/2022/257095A1 |
This disclosure relates to curable silicone rubber compositions suitable for use in the manufacture of cured-in-place gaskets (CIPGs), silicone elastomers resulting from the cure of said compositions and methods for making cured-in-place...
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WO/2022/259869A1 |
Provided is a heat resistant adhesive film to be used in a high-temperature heat treatment step wherein said film can be peeled off without leaving adhesive residue on an adherend, even when the adhesive force to the adherend is increase...
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WO/2022/255165A1 |
Provided is a laminated film capable of improving work efficiency in a process for producing a semiconductor device.　The laminated film according to the present invention is such that a first separator, a first adhesive layer composed ...
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WO/2022/255328A1 |
The present invention relates to a display device that has an inter-member pressure-sensitive adhesive layer, the maximum value of the loss tangent tanδ (f) of the pressure-sensitive adhesive layer at 25°C and a frequency f (Hz) of 100...
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WO/2022/246681A1 |
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a topside protective film. ...
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WO/2022/234802A1 |
[Problem] To provide, as a curable silicone composition used in an optical display or the like, an ultraviolet radiation-curable silicone composition which exhibits storage stability and sufficient rapid curing properties and yields a cu...
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WO/2022/226797A1 |
Disclosed is a silicone pressure sensitive adhesive which is prepared by curing a hydrosilylation reaction curable composition. The silicone pressure sensitive adhesive is useful in preparation of components of flexible display devices.
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WO/2022/226775A1 |
A silicone pressure sensitive adhesive is prepared by curing a hydrosilylation reaction curable composition. Said composition comprises: (A) a polydiorganosiloxane gum component, (B) a polyorganosilicate resin component, (C) a hydrosilyl...
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WO/2022/226796A1 |
A silicone pressure sensitive adhesive is prepared by curing a hydrosilylation reaction curable composition. The silicone pressure sensitive adhesive adheres to silicone elastomers and is useful in preparation of components of flexible d...
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WO/2022/226779A1 |
A silicone pressure sensitive adhesive is prepared by curing a radical reaction curable composition. The silicone pressure sensitive adhesive adheres to various silicone elastomers and is useful in preparation of components of flexible d...
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WO/2022/224081A1 |
Provided are a wallpaper laminate that can maintain a good retention force when applied to a wallpaper and that can be peeled while reducing or suppressing pressure-sensitive adhesive residue and damage to the wallpaper when peeled from ...
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WO/2022/220672A1 |
According to various embodiments, a glove is provided with improved hydration characteristics and low dermatitis potential. The glove comprises a substrate and a polymer system that coats a surface of the substrate. The polymer system co...
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WO/2022/219063A1 |
A substrate (12) for delivering a biologically active substance, the substrate (12) comprising: a cross-linked silicone matrix formed by cross-linking a silicone polymer using at least one crosslinking agent comprising a tetraalkoxysilan...
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WO/2022/215746A1 |
Provided are: an adhesive capable of achieving bonding with excellent shear strength and impact resistance; a polysiloxane composition able to be used as a component contained in this adhesive; and methods for producing the adhesive and ...
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WO/2022/216482A1 |
A process for producing a silicone pressure sensitive adhesive is shown and described herein. The process comprises reacting a MQ silicone resin with a polydiorganosiloxane in the absence of a solvent. The MQ silicone resin is a solid, s...
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WO/2022/213377A1 |
A process for preparing a waterborne dispersion of a silicone pressure sensitive adhesive base includes the use of a solventless polyorganosiloxane pellet containing a polyorganosilicate resin and a polyorganosiloxane gum. The waterborne...
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WO/2022/210262A1 |
This laminate comprises: a semiconductor substrate; a light-transmitting support substrate; and an adhesion layer and a release layer that are disposed between the semiconductor substrate and the support substrate. The release layer abso...
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WO/2022/212304A1 |
There is provided an adhesion mediator composition for use in the adhesion of silicone elastomers made from hydrosilylation curable silicone rubber compositions to thermoplastic substrates, especially polyolefin substrates and a process ...
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WO/2022/207359A1 |
A gas separation membrane comprising the following layers: (i) a porous support layer; and (ii) a discriminating layer comprising groups of the Formula (1): M-(O-)x, wherein: M is a metal or metalloid atom; O is an oxygen atom; and x has...
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WO/2022/210068A1 |
Provided is an adhesive composition, wherein: an adhesive-coated layer obtained by applying the adhesive composition has a complex viscosity of 10-10,000 Pa∙s at 25-100ºC; and the viscosity reduction rate of the adhesive-coated layer,...
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WO/2022/207360A1 |
A gas separation membrane comprising the following layers: (i) a support layer; (ii) a discriminating layer comprising groups of the Formula (1): M-(O-)x wherein: M is a metal or metalloid atom; O is an oxygen atom; and x has a value of ...
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WO/2022/207361A1 |
A gas separation membrane comprising the following layers: (i) a support layer; (ii) a layer comprising a crosslinked polysiloxane; (iii) a discriminating layer comprising groups of the Formula (1): M-(O-)x,wherein: M is a metal or metal...
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WO/2022/209064A1 |
The present invention provides an adhesive paste that contains a curable organopolysiloxane compound and a heat conductive filler, wherein: the thermal conductivity of a cured product which is obtained by heat curing of the adhesive past...
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WO/2022/202845A1 |
The present invention is an adhesive paste that contains a curable organopolysiloxane compound. The storage elastic modulus at -60°C of a cured product obtained by heating and curing the adhesive paste for 20 hours at 80°C and then fur...
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