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WO/2012/043333A1 |
Provided are: a resin composition curable with actinic energy rays which is of the solvent-free type and, despite this, has a low viscosity suitable for application and which, when cured, is highly prevented from causing a curl; an adhes...
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WO/2012/042665A1 |
This adhesive composition and coating composition contains 10 to 30 mass % of an epoxy resin (a), 25 to 55 mass % of an oxetane compound (b), 25 to 55 mass % of a vinyl ether compound (c), 1 to 15 mass % of a denaturant (d) (wherein the ...
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WO/2012/039581A2 |
The present invention relates to an adhesive for a polarizing plate and to a polarizing plate comprising same. More particularly, the present invention relates to an adhesive composition for a polarizing plate, comprising one or more acr...
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WO/2012/039051A1 |
Provided is an energy-ray-curable resin composition which satisfies curability, adhesive properties, and storage stability, characterized by comprising (A) a cationically polymerizable compound, (B) a specific cationic photopolymerizatio...
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WO/2012/035958A1 |
The purpose of the present invention is to provide: a light-curing composition for use in a transparent pressure-sensitive adhesive sheet that is highly transparent and well suited to punching, has a strongly cohesive pressure-sensitive ...
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WO/2012/035112A1 |
Two part cyanoacrylate/cationically curable adhesive systems, are provided.
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WO/2012/029960A1 |
The present invention provides a resin composition that is suitable for non-solvent adhesives and exhibits high adhesive strength, the resin composition comprising: component (A), which is a (meth)acrylate having one or more (meth)acrylo...
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WO/2012/027377A2 |
Methods for preparing double-sided multi-layer adhesives, double-sided multi-layer adhesives and articles prepared with double-sided multi-layer adhesives are disclosed. The methods for preparing double-sided multi-layer adhesives includ...
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WO/2012/026470A1 |
The present invention relates to a circuit connecting material which is interposed between a first circuit member, wherein a first circuit electrode is formed on a main surface of a first substrate, and a second circuit member, wherein a...
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WO/2012/024217A1 |
An optical assembly is provided that includes a display panel, a substantially transparent substrate and an adhesive composition. The adhesive composition includes the reaction product of a miscible blend that includes one or more (meth)...
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WO/2012/020710A1 |
The purpose of the present invention is to provide an adhesive polymer gel that has high strength and excellent reworkability but leaves little trace when peeled from an object, and to provide an adhesive gel sheet that uses this adhesiv...
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WO/2012/021721A2 |
A pressure sensitive adhesive composition comprising the polymerization product of: (A) a monomer selected from the group consisting of alkyl acrylates, alkyl methacrylates, and combinations thereof; and (B) a macromonomer comprising the...
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WO/2012/017955A1 |
Provided is a method for manufacturing a semiconductor wafer provided with an adhesive layer, which includes: a step wherein a photosensitive adhesive layer is formed by applying a photosensitive adhesive to the whole one surface of a se...
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WO/2012/017057A1 |
Curing through large bond gaps, of approximately 0.5 - 1.0 mm, has proven particularly challenging in the field of adhesives technology. Most noteworthy is the difficulty associated with providing one-part adhesive formulations capable o...
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WO/2012/014682A1 |
A curable resin composition which exhibits high initial adhesion and bond durability is provided. The curable resin composition comprises (A) an oligomer which is free from epoxy groups and has a diene-based skeleton or a hydrogenated di...
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WO/2012/014563A1 |
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adh...
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WO/2012/014562A1 |
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first...
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WO/2012/012417A1 |
A stable transdermal adhesive composition comprising: an adhesive comprising a washed polymerization reaction product of at least two ethylenically unsaturated monomers; and at least one pharmaceutically active compound which is suscepti...
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WO/2012/011457A1 |
An anisotropic conductive film comprises an insulating adhesive agent composition comprising a (meth)acrylate monomer composition, a radical polymerization initiator and a film-forming resin and electrically conductive particles disperse...
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WO/2012/009241A2 |
One exemplary embodiment includes a method comprising polymerizing vinyl monomers with an initiator comprising a phenoxyaluminum alkyl compound in the presence of oxygen.
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WO/2012/008316A1 |
Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the p...
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WO/2012/004962A1 |
Disclosed is a highly-adhesive agent for a solar-cell back-side protective sheet. Said highly-adhesive agent overcomes hitherto existing problems and exhibits excellent adhesiveness and adhesion durability. Also disclosed are a solar-cel...
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WO/2011/161827A1 |
The disclosed adhesive composition is capable of imparting excellent adhesion between polyester resin and glass, and contains (a) a vinyl ester resin or an unsaturated polyester resin (10-40 mass%), (b) vinyl monomers and / or (meth) acr...
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WO/2011/162256A1 |
A process margin can be improved, and high connection reliability can be achieved. Disclosed is an anisotropic conductive material comprising an adhesive agent composition and electrically conductive particles dispersed in the adhesive a...
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WO/2011/158654A1 |
Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavele...
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WO/2011/157792A1 |
The invention relates to aqueous binding agent compositions based on aqueous polymer dispersions, to methods for producing same and to uses thereof. The aqueous binding agent composition contains: a) a water-insoluble polymer P in the fo...
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WO/2011/156060A2 |
This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capab...
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WO/2011/151890A1 |
Disclosed is an adhesive composition comprising (a) 10 to 40% by mass of a vinyl ester resin or an unsaturated polyester resin, (b) 30 to 60% by mass of a compound having a cyclic structure and one ethylenic unsaturated group, (c) 5 to 4...
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WO/2011/152404A1 |
A composition for use as coating material and adhesive, which comprises (a) 20 to 40% by mass of a vinyl ester resin or an unsaturated polyester resin, (b) 0.1 to 50% by mass of a modifier, (c) 30 to 70% by mass of a vinyl monomer and/or...
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WO/2011/145524A1 |
Disclosed is a composition which has high adhesive strength and high water resistance. The composition comprises the following components (A) to (D): (A) an isocyanuric ring derivative represented by general formula [1]; (B) (meth)acryla...
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WO/2011/138630A1 |
The present invention relates to UV curable encapsulant compositions based on acrylic and/or methacrylic block copolymers, to structures containing these compositions especially photovoltaic cells and to the use of these compositions in ...
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WO/2011/139726A2 |
The present invention generally relates to adhesive compositions containing among other things the combination of sulfur-containing acids and phosphorous-containing acids. These curable compositions are capable of curing when applied to ...
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WO/2011/136326A1 |
Provided is an adhesive composition, which can prevent misregistration in bonding adherends to each other, can firmly bond adherends to each other as such in the case where no modification is needed in bonding, and easily allows the sepa...
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WO/2011/135708A1 |
Disclosed is an adhesive composition with which positioning error at the time of bonding adherends to each other can be prevented, and when correction for bonding is not required, the adherends can be firmly adhered directly to each othe...
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WO/2011/136015A1 |
Provided are an optical adhesive which is stable to autoclave sterilization and an endoscope configured using the optical adhesive. The optical adhesive comprises an acrylate oligomer, an alicyclic monomer, and a polyfunctional monomer a...
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WO/2011/118697A1 |
An adhesive for porous materials which is composed of both a base resin that contains an epoxy resin and a curing agent composition, wherein the curing agent composition comprises: an aqueous polyaminoamide- or polyamide-type curing agen...
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WO/2011/118719A1 |
Disclosed is an adhesive composition for connecting a first circuit member having a first connection terminal on the main surface, and a second circuit member having a second connection terminal on the main surface, wherein the first cir...
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WO/2011/119180A1 |
An optical assembly including a display panel is disclosed herein. The display panel is optically bonded to a substantially transparent substrate using an adhesive layer. The adhesive layer is formed from a liquid optically clear adhesiv...
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WO/2011/115399A2 |
The present invention relates to an adhesive film and to a touch panel. According to the present invention, even when the adhesive film is applied to a touch panel, for example, a capacitive touch panel, and directly attached to a conduc...
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WO/2011/115374A2 |
The present invention relates to a UV-curable adhesive composition, wherein the composition of the present invention includes polyurethane (meth)acrylate which is synthesized from polycarbonate polyol, polycaprolactone polyol, and polyte...
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WO/2011/115721A2 |
The present invention relates to moisture-curable silane-reactive hot melt compositions having an acrylate-urethane copolymer moiety. Desirably, the silane groups contain alkoxy functionality to enable and enhance moisture curing. Such c...
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WO/2011/104510A1 |
An adhesive composition, especially suitable for a two- part adhesive system curable via free radical polymerisation comprises; (A) (meth) acrylate ester monomer; (B) chlorinated elastomeric polymer; (C) core-shell impact modifier; and (...
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WO/2011/106474A1 |
A package (10) configured to reclose after an initial opening and reduce head space in the package includes a plurality of walls (32, 34) with a pair of opposing wall segments, where each of the opposing wall segments have top and bottom...
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WO/2011/106486A1 |
A reclosable package for a plurality of products is described herein. The reclosable package includes an adhesive-based fastener that utilizes a low tack adhesive and pivotably connected first and second compartments, each compartment co...
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WO/2011/101175A1 |
The present invention relates to a novel method for controlling the viscosity of adhesive or coating formulations, for example. The viscosity control method enables very rapid thermoplastic curing of a formulation already at room tempera...
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WO/2011/093207A1 |
Provided is an anisotropic conductive film comprising at least a conductive layer and an insulating layer, wherein said insulating layer contains a binder, a monofunctional polymerizable monomer and a curing agent, said conductive layer ...
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WO/2011/087146A1 |
Disclosed is a re-adherable silicone-based adhesive composition which exhibits excellent adhesion and release characteristics and makes it possible to easily control the adhesive strength of a re-adherable adhesive layer according to the...
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WO/2011/083652A1 |
Provided is an actinic-radiation curable composition which exhibits fast curability and which can yield a cured product having a high refractive index. The composition comprises: a urethane (meth)acrylate compound that has a specific str...
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WO/2011/083828A1 |
Provided are a pressure-sensitive adhesive composition enabling the production of a pressure-sensitive adhesive, which has excellent adhesiveness to members having various surface polarities and can exert good repulsion resistance even i...
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WO/2011/083824A1 |
Provided is a circuit connecting adhesion film having at least an adhesive layer (A) and an adhesive layer (B), wherein the adhesive layer (A) is an anisotropic conductive layer (11) containing a prescribed adhesive ingredient (3a) and c...
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