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Matches 251 - 300 out of 10,649

Document Document Title
WO/2022/243629A1
The present invention relates to a two-component crosslinkable composition comprising: - a component A comprising: - a reducing agent; - a metal salt selected from the group consisting of (meth)acrylic acid metal salts, itaconic acid met...  
WO/2022/246336A1
Photocurable compositions are provided herein, which provide a balance of fast curing properties at exposure to radiation in the electromagnetic spectrum and impressive cure through depth.  
WO/2022/238377A1
Method for bonding a thermoplastic piping system (1) without the use of solvent-based adhesives, the piping system (1) comprising at least one first pipe or fitting part (11), and at least one second pipe or fitting part (12), which comp...  
WO/2022/234017A1
The present invention relates to a two-part curable composition comprising: • a first part (component A) comprising : • at least 50% by weight based on the total weight of the first part, of one or more alkyl cyanoacrylate monomer, s...  
WO/2022/234802A1
[Problem] To provide, as a curable silicone composition used in an optical display or the like, an ultraviolet radiation-curable silicone composition which exhibits storage stability and sufficient rapid curing properties and yields a cu...  
WO/2022/227445A1
Disclosed in the present invention are an organosilicon-modified acrylate, a silane-modified polyether adhesive, and a preparation method therefor. The organosilicon-modified acrylate has a structure as shown in formula I. The silane-mod...  
WO/2022/230027A1
The present invention relates to: an energy ray-crosslinkable adhesive agent composition which contains (A) an acrylic resin that is energy ray-crosslinkable and (B) a tackifier, wherein the tackifier (B) contains (B1) a styrene resin; a...  
WO/2022/232475A1
Two part cyanoacrylate/free radical curable adhesive systems are provided.  
WO/2022/230874A1
The present invention provides a composition for provisional fixation containing the components (A) to (C) described below, the composition being excellent in terms of compatibility, adaptability to spin coating processes, heat resistanc...  
WO/2022/224934A1
Provided is an adhesive composition containing a polymerizable compound, a thermal polymerization initiator, and a dicarboxylic acid diester compound.  
WO/2022/225152A1
The present invention relates to a dual curable hybrid resin composition and a display adhesive using same, and, more specifically, has excellent initial adhesive strength after UV curing since a moisture curable component and a radiatio...  
WO/2022/208316A1
The present disclosure provides an adhesive precursor composition, comprising a polyfunctional acrylate oligomer, a reactive diluent including an acrylate monomer; a photoinitiator; and heat-expandable microspheres which are capable of e...  
WO/2022/210261A1
The present invention provides a curable resin composition that gives a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by cu...  
WO/2022/210166A1
An adhesive composition which contains a polymerizable monomer that has a (meth)acryloyl group, a radical polymerization initiator and polymer particles that are swellable with an organic solvent, wherein with respect to the particle siz...  
WO/2022/210673A1
Provided are: a curable adhesive composition including a first curing system, in which a cross-linking agent reacts with a binder resin having a reactive functional group and the reaction proceeds at a temperature of 120°C or less, and ...  
WO/2022/210340A1
The present invention addresses the problem of providing a method for producing a film laminate, the method being capable of producing, with high productivity, a film laminate that exhibits excellent ink curability and excellent adhesion...  
WO/2022/205417A1
Disclosed is a radiation curable (meth) acrylic adhesive composition consisting essentially of: i) a (meth) acrylated polydiene resin; ii) a multi-functional (meth) acrylic monomer component; iii) a mono-functional (meth) acrylic monomer...  
WO/2022/210703A1
An adhesive composition which comprises one or more polymerizable monomers each having a carbon-carbon double bond, an elastomer, and a polymerization initiator. At least some of the polymerizable monomers is a highly polar monomer havin...  
WO/2022/210672A1
Provided is an adhesive sheet including a curable adhesive layer, wherein the curable adhesive layer is one formed from a starting material composition comprising a binder resin (A) having a reactive functional group and a crosslinking a...  
WO/2022/209830A1
An adhesive sheet (2) is obtained by forming, into a layered configuration, an adhesive composition that contains an acrylic base polymer and a polyfunctional (meth)acrylate having four or more (meth)acryloyl groups in one molecule as a ...  
WO/2022/209042A1
Provided are: a curable water dispersion composition containing water serving as a solvent, a polymerizable compound A that is solid or has a viscosity of at least 100 mPa∙s at 25ºC, and a surfactant; and an optical film which include...  
WO/2022/202505A1
This electrically conductive resin composition contains (A) silver-containing particles, (B) a (meth)acrylic compound, and (C) at least one polyfunctional epoxy compound selected from compounds represented by general formula (1).  
WO/2022/203033A1
Provided is an ink-jet adhesive which, when a transparent member is used as an adherent member, can inhibit a component of the adhesive from adhering to areas of the transparent member which are not intended to be bonded. This ink-jet ...  
WO/2022/196328A1
Provided are: a resin composition which has a low modulus, can cure at low temperatures, and has a long pot-life and which is useful as electroconductive adhesives, materials for mounting components, sealants for protecting components, a...  
WO/2022/198030A1
A glass laminate article includes: a resin layer provided on a first surface of a core substrate; and a glass substrate layer provided on the resin layer, wherein the resin layer has an initial modulus of 30 MPa to 250 MPa, the initial m...  
WO/2022/196586A1
[Problem] To provide: an adhesive composition which has excellent heat resistance, excellent adhesive strength, low relative dielectric constant, low dielectric loss tangent and excellent dielectric characteristics; and a bonding sheet, ...  
WO/2022/196585A1
[Problem] To provide an adhesive composition with excellent heat resistance and adhesion strength, with low relative permittivity and dielectric loss tangent, and with excellent dielectric properties, and to provide an adhesive sheet, a ...  
WO/2022/191147A1
[Problem] To provide: a coating composition that can form a non-adhesive coating layer that demonstrates tight adhesion to various resin base materials, excellent surface hardness, tack resistance, flex resistance, scuff resistance, shri...  
WO/2022/188504A1
The present application relates to the field of conductive adhesives, and specifically relates to a heat-cured conductive adhesive and a preparation method therefor. The preparation method for the heat-cured conductive adhesive mainly co...  
WO/2022/189868A1
The present application provides a two-component adhesive composition. Specifically, the two-component adhesive composition comprises 1.5-18 parts by weight of an epoxy resin, an effective amount of a peroxide oxidant, an effective amoun...  
WO/2022/189867A1
The present application provides a two-component adhesive composition. Specifically, based on the total weight of the two-component adhesive composition as 100 wt.%, the two-component adhesive composition comprises 1.5-16 wt.% of an epox...  
WO/2022/187848A1
The present invention relates to a curable cyanoacrylate composition comprising (i) at least one cyanoacrylate monomer, and (ii) at least one free radical stabilizer, wherein the free radical stabilizer is non-hazardous and shows good co...  
WO/2022/186642A1
The present invention relates to: an adhesive composition comprising a urethane oligomer, an acrylate monomer, a plasticizer and a photoinitiator, wherein the plasticizer has a weight average molecular weight (Mw) of 200 or more and is i...  
WO/2022/186442A1
The present invention relates to a pressure-sensitive adhesive composition with excellent pigment dispersibility, and a pressure-sensitive adhesive sheet using the pressure-sensitive adhesive composition, wherein the pressure-sensitive a...  
WO/2022/181725A1
A curable resin composition including a compound represented by general formula (1) and component (B), and a cemented lens using the composition. Component (B): A polymer including a structural unit (b1) having an aromatic ring and a str...  
WO/2022/182159A1
Provided are: an optical laminate comprising a second adhesive layer, a second adhesive layer laminated on the second adhesive layer, and a light shield part laminated between the first adhesive layer and the second adhesive layer; an op...  
WO/2022/182002A1
The present invention relates to a method for manufacturing a flexible flat cable (FFC) or a flexible printed circuit (FPC) that can be simultaneously etched on both sides, and a double-sided adhesive tape that is for double-sided etchin...  
WO/2022/180465A1
According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation ...  
WO/2022/181564A1
[Problem] To provide an adhesive which bonds a rubber, particularly an olefin-based rubber, to a metal strongly, exhibits excellent shear adhesive strength at high temperatures, exhibits temporary fixing properties until bonding/curing b...  
WO/2022/180011A1
The invention is directed to an adhesive composition comprising at least one acrylic compound A, a reaction product RP obtained by polyaddition reaction of at least one compound P and at least one hardener H, and at least one free radica...  
WO/2022/179825A1
The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition: from 40 to 90 wt.% of i) at least one ethylenically unsaturated n...  
WO/2022/177099A1
The present invention relates to an adhesive composition with excellent cold tolerance and heat resistance and an adhesive tape using same, wherein the adhesive composition contains a modified acrylic resin prepared by reacting silicone ...  
WO/2022/163233A1
The present invention provides, as an adhesive sheet equipped with a release film that is used in bonding two image display device structural members and that has exceptional storage stability and bonding reliability, an adhesive sheet e...  
WO/2022/163281A1
Proposed as an adhesive sheet which, even in the case of an image display device constituent member having a step part in the surface thereof, can conform to the step and be filled up to the corners, which exhibits excellent resilience a...  
WO/2022/163655A1
The purpose of the present invention is to provide an air gap layer in which a bonding agent or an adhesive does not readily penetrate into an air gap. In order to achieve the above-described purpose, an air gap layer according to the ...  
WO/2022/163523A1
A purpose of the present invention is to provide an adhesive composition capable of giving cured objects having excellent mechanical properties. The adhesive composition according to one aspect of the present invention comprises a polyox...  
WO/2022/158176A1
An organosilicon compound represented by formula (1). (R1 is an alkyl, alkenyl, aryl, or acyl group, R2 is an alkyl or aryl group, R3 is a hydrogen atom or a methyl group, A1 is a single bond or an alkylene group, A2, A3, and A4 are each...  
WO/2022/158594A1
Provided is a film-like adhesive 1 for connecting a circuit, the film-like adhesive 1 containing: solder particles 2 having a Bi content of 20-60 mass% and an Sn content of 40-80 mass%; a radically polymerizable compound; and a thermal r...  
WO/2022/149537A1
An adhesive composition according to the present invention contains: a moisture-curable resin (A) which has at least one of a polycarbonate skeleton and a polyester skeleton, while having an isocyanate group and a (meth)acryloyl group; a...  
WO/2022/145368A1
(Problem) To provide: a curable adhesive composition suitable for the bonding of a polarizer to a thermoplastic resin film; and a polarizing plate comprising a polarizer, an adhesive layer and a thermoplastic resin film which are arrange...  

Matches 251 - 300 out of 10,649