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Matches 1 - 50 out of 10,700

Document Document Title
WO/2024/143421A1
This adhesive composition comprises a moisture-curable urethane resin (A) that is a reaction product of a polyol (a1) having a polytrimethylene glycol skeleton and a polyfunctional isocyanate (a2).  
WO/2024/144308A1
The present invention relates to an optically transparent adhesive sheet and a method for manufacturing same. More particularly, the optically transparent adhesive sheet has a structure in which a visible light curing layer is formed on ...  
WO/2024/143135A1
This conductive paste comprises a compound (A) having a carbon-carbon double bond, a thermoplastic resin (B), and conductive particles (C).  
WO/2024/144248A1
The present invention relates to an anaerobic adhesive composition and a method for preparing same and, more specifically, to an anaerobic adhesive composition and a method for preparing same, the composition comprising, in addition to (...  
WO/2024/144240A1
The present invention relates to an optical adhesive composition comprising a (meth)acrylate-based syrup with a viscosity of 1,500 to 10,000 cPs, a photoinitiator, and a UV absorber, and to an adhesive sheet manufactured therefrom.  
WO/2024/134355A1
In some embodiments, the antistatic pressure sensitive adhesive includes a (meth)acrylate-based optically clear pressure sensitive adhesive matrix that is the product of a reaction mixture and at least one antistatic agent. The reaction ...  
WO/2024/135442A1
This polymerizable composition containing a polymerizable compound comprises: (A) a borate anion; (B) at least one selected from the group consisting of aromatic carboxylic acids having at least two hydroxy groups, salts of the aromatic ...  
WO/2024/135156A1
The present invention addresses the problem of providing an environmentally friendly active energy ray-curable adhesive composition that has excellent curability, a cured film of which is flexible, and that can actualize adequate adhesio...  
WO/2024/135756A1
The curable adhesive composition of the present invention is characterized by containing (1) at least one cationic polymerizable component selected from the group consisting of cationic polymerizable monomers, cationic polymerizable olig...  
WO/2024/131980A1
The present invention relates to the technical field of current collectors, and specifically relates to a current collector, and a preparation method therefor and the use thereof in a lithium-ion battery. The current collector comprises ...  
WO/2024/135755A1
A curable adhesive agent composition according to the present invention is for the adhesion of a metal and a resin and is characterized in that the curable adhesive agent composition contains (1) a cation-polymerizable component containi...  
WO/2024/127733A1
This curable composition contains: a polythiol compound having two or more secondary thiol groups; a curable component; and a radical generator. This polarizing film is obtained by layering an optical film on at least one surface of a po...  
WO/2024/127721A1
This curable resin composition contains: a component (A) that is at least one type selected from the group consisting of a (meth)acrylic-modified polybutadiene and a (meth)acrylic-modified polyisoprene; and a component (B) comprising a (...  
WO/2024/125791A1
The invention relates to the technical field of pressure-sensitive adhesives, in particular pressure-sensitive adhesives for bonding to the skin as they are used in plasters, further medical dressings and increasingly in sensors to be at...  
WO/2024/127252A1
A compound is represented by formula (I) is described. In this formula, A represents a saturated, unsaturated, or aromatic ring; each R is independently hydrogen or methyl; each R1 is independently alkylene optionally interrupted by one ...  
WO/2024/126459A1
The present invention relates to a composite element (10), in particular a composite element (10) for an insulating-glass panel, at least comprising a first panel element (20) and at least one second panel element (22) and at least one f...  
WO/2024/127722A1
Disclosed is a curable resin composition which contains a component (A) that is composed of a polymer which comprises at least, as a repeating unit, a basic unit that has 5 or more carbon atoms without containing an oxygen atom. It is pr...  
WO/2024/121781A1
A curable composition includes 25 to 70 volume percent particles, 25 to 74.8 volume percent of a primary liquid phase, and 0.15 to 20 volume percent of a secondary liquid phase, based on the total volume of the curable composition. The p...  
WO/2024/120106A1
A lignin formaldehyde-free adhesive. The raw materials for preparation of the lignin formaldehyde-free adhesive comprise the following components in parts by mass: 100 parts of lignin, 2-10 parts of diallyl sulfide, 10-15 parts of epichl...  
WO/2024/117165A1
The present invention provides an adhesive composition which can be cured by energy rays on the comparatively long wavelength side, and in which there is little photo decomposition product. Provided is an adhesive composition comprising ...  
WO/2024/117343A1
The present invention relates to a dual-curable composition comprising: at least one type of photocurable compound; a photo-initiator; a thermal initiator; and a thiol group-containing compound. More specifically, the present invention p...  
WO/2024/117223A1
A purpose of the present invention is to provide a pressure-sensitive adhesive sheet which has excellent impact resistance although being obtained by ultraviolet curing. Another purpose of the present invention is to provide a method for...  
WO/2024/117222A1
The purpose of the present invention is to provide an ultraviolet-curable composition for printing which has excellent printability and re-peelability. Another purpose of the present invention is to provide a method for producing a lamin...  
WO/2024/116451A1
Provided is an adhesive film that is used to join a semiconductor chip to a substrate and to seal the gap between the semiconductor chip and the substrate, wherein the adhesive film is a single-layer film comprising an adhesive compositi...  
WO/2024/117183A1
Provided is a conductive paste with which it is possible to maintain high conduction reliability even when moisture has infiltrated the connection structure. A conductive paste according to the present invention contains a curable comp...  
WO/2024/117182A1
Provided is a conductive paste with which it is possible to increase discharge stability, increase conduction reliability even when mounted at a relatively low temperature, and maintain high conduction reliability even when cooling and h...  
WO/2024/117224A1
One purpose of the present invention is to provide: an ultraviolet curable adhesive composition which has excellent ultraviolet curability in the presence of oxygen, and excellent waterproof properties and dustproof properties, while exh...  
WO/2024/117181A1
Provided is a conductive paste that can be placed on wiring with high precision, can prevent the misalignment of chips and uneven distribution of conductive fillers even when objects are transported vertically during the manufacturing pr...  
WO/2024/117230A1
A purpose of the present invention is to provide a photocurable resin composition having excellent adhesiveness and creep resistance. Another purpose of the present invention is to provide an adhesive sheet obtained using the photocurabl...  
WO/2024/117226A1
The present invention is an ultraviolet-curable adhesive composition comprising a maleimide derivative, an ultraviolet-polymerizable compound, a photopolymerization initiator, and an amine compound. When this maleimide derivative contain...  
WO/2024/117021A1
Provided is a heat resistant adhesive film that can be attached to the back surface of a lead frame after a wire bonding step in a method for producing a semiconductor package, said heat resistant adhesive film comprising an adhesive lay...  
WO/2024/117229A1
The purpose of the present invention is to provide a photocurable adhesive composition for printing which is excellent in terms of repeated printability, photocurability in the presence of oxygen, and post-curing adhesiveness and retenti...  
WO/2024/111438A1
The purpose of the present invention is to provide: a transparent adhesive sheet that has high sensitivity to actinic rays and that can be cured in a highly efficient manner; and a release film-provided transparent adhesive sheet, a tran...  
WO/2024/111236A1
A problem of the present invention is to provide an adhesive and a curable resin composition that can be cured at a low temperature, for example, 50 to 100°C, preferably 80°C and have a long time pot life. Provided is a curable resin...  
WO/2024/110817A1
5 Low dielectric constant adhesive compositions are optically clear pressure sensitive adhesives with a dielectric constant of 3.1 or less at 25°C and 100 kHz. The adhesive composition is the reaction product of a mixture of a first mon...  
WO/2024/103441A1
An ultra-low-viscosity sprayable OCR glue for a full-lamination module. The OCR glue is prepared from the following raw materials in parts by weight: 15-25 parts of an acrylic resin; 65-80 parts of an acrylic monomer; 0.5-4 parts of a ph...  
WO/2024/106387A1
Provided is an adhesive sheet that has a photocurable adhesive layer which exhibits a peel strength above a certain level in the initial state, the peel strength being able to be decreased by means of light irradiation, and which is base...  
WO/2024/106390A1
Provided is an adhesive sheet that exhibits at least a certain level of peel force at an initial state, that can be finely peeled from an adherend through photoirradiation, and that has a photocurable adhesive agent layer based on a poly...  
WO/2024/106386A1
Provided is an adhesive sheet having a photocurable adhesive layer that has sufficient reduction in peeling by light irradiation and is based on a polymer that is not based on solution polymerization. Provided is an adhesive sheet compri...  
WO/2024/106096A1
The following is provided as an adhesive sheet that has a low refractive index and excellent flexibility. An adhesive sheet according to the present invention is formed from an adhesive composition that contains an acrylic copolymer an...  
WO/2024/101258A1
This compound is represented by formula (1). (In formula (1), A represents an m+n-valent organic group that includes a sulfur atom. m represents an integer equal to or greater than 1. n represents an integer equal to or greater than 1. m...  
WO/2024/095322A1
This adhesive composition comprises 100 parts by mass of (a) syrup obtained by mixing a (meth)acrylic copolymer containing alkyl (meth)acrylate and a carboxyl group-containing (meth)acrylate as constituent components, an alkyl (meth)acry...  
WO/2024/090259A1
The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive. Provided is a resin c...  
WO/2024/090459A1
The present invention provides a photocurable resin composition that can maintain excellent adhesiveness even under high temperature and high humidity and that can be applied as a thin film when adhering adherends to each other. The phot...  
WO/2024/080336A1
Provided is a curable composition for inkjet use and for air cavity formation. The curable composition can form a cured product layer having a high aspect ratio, and can suppress the generation of outgassing even if exposed to high tempe...  
WO/2024/081296A1
Disclosed herein are acrylic structural adhesives that include high vinyl content styrene-butadiene-styrene block copolymers. In an embodiment, the acrylic structural adhesive includes: an acrylic monomer: a vinyl styrenic block copolyme...  
WO/2024/079569A1
An adhesive composition comprises an acrylic copolymer having pendant organosiloxane groups, pendant polyether groups, and optionally acidic groups. An article comprises a substrate having the adhesive composition adhered thereto. A meth...  
WO/2024/080145A1
A reinforcing film (10) comprises an adhesive layer (2) that is layered and fixed on one main surface of a film base material (1). The adhesive layer is composed of a photocurable composition containing an acrylic base polymer having a c...  
WO/2024/078801A1
The present invention relates to a curable and electrochemically debondable one-component (1K) structural adhesive composition comprising a) a (meth)acrylate monomer selected from the group consisting of hydroxypropyl acrylate, hydroxypr...  
WO/2024/079548A1
Curable and cured compositions as well as articles containing the curable or cured compositions are provided. The cured compositions are typically a semi-structural or structural adhesive. Advantageously, the cured compositions can be re...  

Matches 1 - 50 out of 10,700