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WO/2013/129438A1 |
Provided are a circuit connection material having excellent blocking resistance and excellent connection reliability, and a method for producing a mounted unit using the same. Elastic particles having a compression recovery rate of 50% o...
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WO/2013/129437A1 |
Through the present invention, conductivity is ensured even to an electrode terminal on which an oxide film is formed on the surface thereof, and insulation properties between adjacent wires are also provided. A method for manufacturing ...
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WO/2013/125695A1 |
In the whole anisotropic conductive member (105), a plurality of substantially spherical conductive bodies (106) are dispersively contained, each of said conductive bodies having a diameter larger than a step between a protection film (1...
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WO/2013/125388A1 |
Provided is a manufacturing method for a connection structure in which an anisotropic conductive connection layer is interposed between a terminal provided to a flexible display and a terminal of an electronic component, and the flexible...
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WO/2013/121877A1 |
An electrically conductive adhesive agent for connecting an electrode of a solar cell to a tab wire, said adhesive agent comprising an adhesive agent resin composition and aggregates of electrically conductive filaments.
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WO/2013/115360A1 |
[Problem] To provide: a conductive adhesive which is not susceptible to deterioration in a bonded portion caused by a halogen; and an electronic device which uses the conductive adhesive. [Solution] A conductive adhesive, which contains ...
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WO/2013/108740A1 |
Provided are conductive particles which are capable of lowering the connection resistance between electrodes in cases where the conductive particles are used for the connection between the electrodes. A conductive particle (21) of the pr...
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WO/2013/110051A1 |
The present invention relates to an easy, scalable method, relying on conventional and unconventional techniques, to incorporate tilt in the fabrication of synthetic polymer-based dry adhesives mimicking the gecko adhesive system. These ...
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WO/2013/108843A1 |
Provided are conductive particles which are capable of effectively lowering the connection resistance in cases where the conductive particles are used for the electrical connection between electrodes. A conductive particle (1) of the pre...
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WO/2013/108842A1 |
Provided are conductive particles which are capable of effectively lowering the connection resistance in cases where the conductive particles are used for the electrical connection between electrodes. A conductive particle (1) of the pre...
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WO/2013/094543A1 |
Provided are: a resin composition which has excellent adhesiveness, excellent economic performance and adequate viscosity and is capable of being cured at 80˚C or less, without being increased in the contact resistance with a metal term...
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WO/2013/089061A1 |
Provided are: an electrically conductive adhesive agent which can achieve good conduction in a substrate that has been treated with an organic solderability preservative; and a method for connecting an electronic component. An electrical...
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WO/2013/078557A1 |
The disclosure is directed to an adhesive material which can be applied underwater comprising hydrophilic adhesive molecules. In other embodiments, the adhesive material may also include hydrophilic polymers and/or an oxidizing agent.
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WO/2013/080708A1 |
Provided is a resin composition which has both a high storage stability and a high interface reliability, said resin composition comprising: (a) an epoxy compound; (b) a microcapsule type hardening accelerator; and (c) inorganic particle...
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WO/2013/073563A1 |
An anisotropic conductive film for the anisotropic conductive connection of a substrate terminal and an electronic component terminal, which film comprises a conductive particle layer including conductive particles and a photocurable res...
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WO/2013/061923A1 |
Provided are: a conductive adhesive which is capable of achieving excellent connection reliability by ensuring high adhesive power; and a solar cell module which is capable of achieving high power generation efficiency by connecting elec...
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WO/2013/062836A1 |
A conductive double-sided tape includes a conductive, nonwoven adhesive layer including an adhesive material, a nonconductive, nonwoven substrate having a plurality of passageways, and a plurality of conductive particles penetrating thro...
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WO/2013/062088A1 |
[Problem] To provide a conductive adhesive composition which is used for the purpose of forming a conductive adhesive layer that is interposed between a collector and an electrode active material layer, said conductive adhesive layer cap...
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WO/2013/058168A1 |
A conductive adhesive for connecting an electrode of a solar cell and a tab wire, which contains a curable resin, conductive particles, a curing agent and a black coloring agent that is formed only of titanium black.
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WO/2013/058187A1 |
Provided is a water-dispersible acrylic adhesive composition with which it is possible to form a visually attractive adhesive layer with outstanding adhesion, antistatic properties, removability, and resistance to increases in peel force...
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WO/2013/059762A1 |
One embodiment of the present invention provides a system for bonding a first substrate and a second substrate. During operation, the system starts by treating a first surface of the first substrate and a second surface of the second sub...
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WO/2013/058186A1 |
Provided is a water-dispersible acrylic adhesive composition capable of forming an adhesive layer which, when peeled, can prevent the buildup of electrostatic charge in the object to which the film is adhered (antistatic properties), has...
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WO/2013/058380A1 |
An adhesive composition of the present invention contains a resin composition and a plurality of conductive particles, and when the maximum diameter in the particle size distribution of the conductive particles is represented by a and th...
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WO/2013/051708A1 |
The present invention provides technology for an anisotropic conductive adhesive which uses conductive particles that use a silver-based metal as a conducting layer, and has high light reflectance and excellent migration resistance. This...
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WO/2013/042203A1 |
An adhesive composition for adhering a first circuit member, in which a first circuit electrode is formed on the main surface of a first circuit board, to a second circuit member, in which a second circuit electrode is formed on the main...
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WO/2013/042724A1 |
An adhesive composition for adhering together a first circuit member where a first circuit electrode is formed atop the primary surface of a first circuit board and a second circuit member where a second circuit electrode is formed atop ...
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WO/2013/041568A1 |
The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar module...
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WO/2013/037930A1 |
The present invention relates to a composition comprising at least one curable structural adhesive, and at least one chemically crosslinked elastomer on the basis of a silane-functional polymer, wherein the elastomer is particularly in t...
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WO/2013/039809A2 |
A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier bel...
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WO/2013/034058A1 |
A light guiding liquid glue and a touch sensitive display using the same are provided. The light guiding liquid glue includes a liquid glue and a plurality of light guiding particles dispersed in the liquid glue, wherein volume percent o...
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WO/2013/035164A1 |
An adhesive composition, which comprises (a) a thermoplastic resin, (b) a radically polymerizable compound and (c) a radical polymerization initiator, and wherein the radically polymerizable compound contains a compound having an epoxy g...
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WO/2013/031702A1 |
Provided is a method for manufacturing a connecting structure that includes a connecting step for connecting surface electrode conductive wiring of solar cells with a substrate thickness of 40 µm - 190 µm and tab wires by an adhesive t...
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WO/2013/031519A1 |
The purpose is to shorten cycle time and to improve heat resistance and connection reliability. A conductive adhesive (17) provided with at least an epoxy resin, a hardening agent, and conductive particles (23), wherein the hardening age...
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WO/2013/027606A1 |
Provided are a conductive adhesive having a high heat resistance, and a solar cell module. A bus bar electrode (11) on a surface of a solar cell, and an Al rear-surface electrode (13) of adjacent other solar cell are electrically connect...
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WO/2013/024544A1 |
This adhesive material reel is provided with: a core; a pair of side sheets provided to both sides of the core in a manner so as to face each other; and an adhesive material tape wound to the core and having a tape-shaped base material a...
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WO/2013/024873A1 |
This adhesive material reel is provided with: a winding core; a pair of side sheets provided to both sides of the winding core in a manner so as face each other; and an adhesive material tape that is wound to the winding core and has a t...
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WO/2013/025330A2 |
The present invention provides an electrically conductive, optically clear adhesive including an optically clear adhesive layer and an interconnected, electrically conductive network layer positioned over the optically clear adhesive lay...
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WO/2013/021838A1 |
Provided is a novel surface protection film, which is capable of achieving sufficiently high antistatic characteristics and wettability, and furthermore, has excellent reworkability (peelability). This surface protection film having a ba...
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WO/2013/022147A1 |
The present invention relates to a dielectric bonding film for an electronic paper display device. According to the present invention, a lower electrode to which a voltage is applied by a dielectric bonding film and an image upper electr...
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WO/2013/020767A1 |
The invention relates to adhesive compound compositions, comprising a) a polymer-metal blend comprising at least one adhesive compound, at least one metal component, which melts within the temperature range of 50°C to 400°C, and b) at ...
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WO/2013/021895A1 |
Provided are a conductive material with which it is possible to improve conduction reliability and insulation reliability of a connection structure obtained in a case where electrodes of members to be connected are electrically connected...
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WO/2013/021936A1 |
Disclosed is a conductive adhesive tape winding unit with which it is possible for blocking to not occur and furthermore for there to be little variability in the connection reliability of circuit connection units that can be obtained th...
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WO/2013/020765A1 |
The invention relates to adhesive films that can be bonded when heat-activated, comprising a) a polymer-metal blend comprising - at least one adhesive compound that can be bonded when heat-activated, - at least one metal component that m...
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WO/2013/013566A1 |
The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: f...
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WO/2011/105878A9 |
The present invention relates to an adhesive composition. According to the present invention, an adhesive having different release forces on either side thereof, and having a modulus of elasticity which varies in a lengthwise direction, ...
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WO/2013/005507A1 |
A multilayer adhesive article with a higher interlayer adhesive strength is provided. This multilayer adhesive article is provided with: an adhesive layer (A) formed from an adhesive composition (a) containing, as the main component, an ...
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WO/2013/005831A1 |
A circuit-connecting material which comprises an adhesive component, conductive particles, a silica filler having a mean particle diameter of 7 to 75nm and an organic filler having a mean particle diameter of 130 to 2000nm, and in which ...
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WO/2012/172912A1 |
The objective of the present invention is to provide: a thermally conductive pressure-sensitive adhesive sheet-like molded body which has high thermal conductivity and good moldability; a method for producing the thermally conductive pre...
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WO/2012/169535A1 |
Disclosed is a film-shaped circuit connecting material including: an adhesive component having an adhesive layer placed between opposing circuit electrodes and used in order to electrically connect the circuit electrodes, the adhesive la...
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WO/2012/167407A1 |
A preparation process of nano-conductive carbon primer for precoating aluminum foil and a coating method thereof are provided. The preparation process comprises the following steps: i) preparing aqueous or oily primer, wherein the aqueou...
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