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WO/2005/051593A1 |
The present invention relates to silver solder or brazing alloys and to their use in making soldered joints in various grades of silver, particularly silversmithing grades. They alloys are of the Ag-Cu-Zn family containing at least 55 wt...
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WO/2005/052200A1 |
[PROBLEMS] To provide a method for producing a reinforced platinum material, wherein use is made of a platinum alloy powder prepared by melting and spraying, the above material can be produced by easier and simpler working, a high streng...
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WO/2005/038078A1 |
Disclosed is a sputtering target material composed of an Ag-base alloy obtained by adding a specific small amount of P to Ag for alloying. The sputtering target material has a high reflectance and excellent heat resistance.
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WO/2005/031016A1 |
An Ag-Pd-Cu-Ge silver alloy is disclosed which enables to form a reflective electrode film which has such two characteristics at the same time that decrease in the reflectance due to thermal deterioration is extremely small and yellowing...
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WO/2005/024982A2 |
The present invention is directed to a composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum and copper, wherein the concentration of platinum is greater than 50 atomic percent and less than ...
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WO/2005/020222A1 |
[PROBLEM] To provide a sputtering target for forming a reflection layer or a reflection film of an optical recording medium such as an optical recording disc (CD-RW, DVD-RAM). [MEANS FOR SOLVING PROBLEM] A silver alloy reflection film co...
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WO/2005/017224A1 |
Method for producing platinum/copper alloys which envisages the steps of melting platinum and copper parts and/or powders in a predetermined ratio in a controlled atmosphere and subjecting the fusion product thus obtained to heat treatme...
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WO/2005/012591A1 |
A sintered sputtering target which has a structure having an average crystallite size of 1 nm to 50 nm and preferably comprises an alloy having three or more elements and containing, as a main component, at least one element selected fro...
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WO/2005/009652A1 |
Fine-grain silver powder that has a grain size of minuteness not known in the prior art, exhibiting dispersion close to monodispersion with reduced grain aggregation and exhibiting a low impurity content. For obtaining the fine-grain sil...
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WO/2005/007923A1 |
Ag base sputtering target (6) exhibiting a three-dimensional dispersion of crystal grain diameter of 18% or less. The three-dimensional dispersion of crystal grain diameter is as follows. The sputtering target is sliced with a plane para...
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WO/2004/108992A1 |
A titanium article having improved corrosion resistance resulting from a direct or indirect attachment of a platinum group metal or alloy thereof or incorporation of this metal or alloy thereof into a minor surface portion of the article.
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WO/2004/104243A2 |
An alloy including a Pt-group metal, Ni and A1 in relative concentration to provide a &gammad -Ni + &gammad ’-Ni3A1 phase constitution, and a coating including the alloy.
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WO2004053175B1 |
Magnetostrictive devices and methods involving a magnetostrictive alloy having; (1) one or more of Pd, and Pt, and (2) one or more of Ni, Co, Fe, where the alloy comprises one or more of PdxNi1-x, PdxFe1-x, PdxCo1-x, PtxNi1-x, PtxFe1-x, ...
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WO/2004/097056A2 |
An anti-tarnish silver alloy is provided including at least about 85% silver, with the balance including zinc, copper, indium, and tin. Also provided are articles made from the alloy and methods of making the articles.
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WO/2004/095594A1 |
A thermoelectrically transducing material which comprises a half Heuisler alloy represented by the formula: QR(L1-pZp), wherein Q is at least one element selected from the 5 Group elements, R is at least one element selected from cobalt,...
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WO/2004/090180A1 |
A white noble metal alloy which comprises 30 to 65 mass % of Pt and the balanced amount of Au and inevitable impurities. Preferably, a white noble metal alloy is produced by a method which comprises subjecting a second white noble metal ...
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WO/2004/076171A1 |
A coated carbide tap (10) comprises a substrate (16) consisting of tungsten carbide cemented with 12 to 16% by weight cobalt with additions of small amounts of transition metal carbides added to restrain grain growth, and may also contai...
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WO/2004/072310A2 |
The invention relates to an alloy of gold of at least 14 carats, characterised in containing 10 to 20,000, preferably 100 to 1000, ppm Zn, 10 to 20,000, preferably 100 to 1000 ppm Ga, 10 to 20,000, preferably 100 to 1000, ppm Ta, 10 to 1...
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WO/2004/064181A2 |
An electrocatalyst containing platinum, ruthenium, and cobalt, which is suitable for use in a fuel cell.
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WO/2004/059019A1 |
Pt-based bulk-solidifying amorphous alloys and methods of forming articles from Pt-based bulk-solidifying amorphous alloys are provided. The Pt-based alloys of the current invention are based on Pt-Ni-Co-Cu-P alloys.
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WO/2004/053861A1 |
A silver alloy for reflective films of optical recording media contains silver as the main component and indium and/or tin as additional elements. The concentration of the additional elements is preferably 0.1-25 weight%; and especially ...
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WO/2004/049415A1 |
An alloy material for semiconductors mainly contains Au and includes 3-40 wt% of Ag.
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WO/2004/048626A1 |
A decorative white alloy, characterized in that it comprises 3 to 20 % of Cu, 2 to 10 % of Ag, and the balanced amount of Pd, or in that it comprises 3 to 20 % of Cu, 2 to 10 % of Ag, at least one of 0.5 to 3 % of Au and 0.5 to 3 % of Pt...
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WO/2004/044249A2 |
Article of manufacture fabricated by plastic deformation of an intermetallic compound comprising R and M, such as an RM intermetallic compound and a higher order compound thereof, having a CsCl-type ordered crystal structure wherein R is...
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WO2002097145B1 |
A lead-free solder (130) comprises an alloy of silver and bismuth in amounts of 2wt% to 18wt% and 98wt% to 82wt%, respectively. Contemplated alloys have a solidus of no lower than 262.5 DEG C and a liquidus of no higher than 400 DEG C. C...
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WO/2004/037410A1 |
A metallic palladium having carbon as an interstitial atom which comprises the interstitial carbon in an amount of 0.16 mole or more relative to 1.0 mole of metallic palladium; a metallic palladium having carbon as an interstitial atom w...
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WO2002016666B1 |
A method includes combining a solid first material and a solid second material and melting at least a portion of the first material sufficient to coat the second material and any remaining first material. An approximately homogenous dist...
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WO2003073542B1 |
An improved metal alloy composition for a fuel cell catalyst containing platinum, nickel, and manganese or iron.
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WO/2004/016818A1 |
Although an Ag−CdO based material has excellent electrical characteristics, e.g. fusion resistance, arc consumption resistance, low contact resistance, and the like, required for electric contact, Cd tends to take a direction of disuse...
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WO/2004/007782A1 |
An iridium alloy consists essentially of iridium and at least one of W and Zr, and optionally Rh. When present, W comprises between 0.01 and 5 wt % of the alloy; when present in combination with W, Zr comprises between 0.01 and 0.5 wt % ...
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WO/2004/008596A2 |
An ignition device (10) such as a spark plug having ground (18) and center (16) electrodes, at least one of which includes a firing tip (20) formed from an alloy containing iridium, rhodium, tungsten, and zirconium. With the inclusion of...
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WO/2004/008468A1 |
The invention concerns an electrical contact material comprising a conductive metal matrix and an unstable fraction incorporated in said matrix. Said unstable fraction has the property of being decomposed between the use temperature of t...
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WO/2004/003903A1 |
An optical data recording and storage medium includes a reflective layer formed from a silver alloy that contains, in addition to silver, about 0.1 to about 4.0 wt.%, based on the total weight of alloy, of samarium (Sm.)
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WO/2004/001093A1 |
A silver alloy sputtering target useful for formation of a silver alloy thin film of especially uniform thickness according to sputtering technique, wherein, when crystal orientation intensities are determined at four arbitrary points ac...
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WO/2004/001092A1 |
A spattering target, characterized in that it is a sintered compact comprising 95 vol % or more of an Al-Ru intermetallic compound. The spattering target has a homogeneous structure and is reduced in the content of oxygen and thus allows...
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WO/2003/098641A1 |
A wiring material for TFT-LCD which comprises an Ag alloy containing Ag and Zr as essential components and further one or more metals selected from the group consisting of Au, Ni, Co and Al; and a wiring material which comprises a Cu all...
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WO/2003/096080A2 |
A silver-based alloy thin film is provided, suitable for use as a reflective and/or a transparent electrical conductor for various opto-electronic device applications such as liquid crystal displays, flat panel displays, plasma displays,...
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WO/2003/088387A1 |
A catalyst for a fuel electrode of a polymer solid electrolyte type fuel cell having a carbon powder and, carried thereon, platinum and ruthenium, characterized in that platinum and ruthenium are carried in a ratio of 1 : 2.5 to 1 : 4 (m...
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WO/2003/081702A2 |
An improved fuel cell catalyst containing platinum, rhodium at least one of tungsten, tin, and copper, and optionally molybdenum, in metallic oxidation states. Additionally, the platinum and rhodium are at concentrations such that the su...
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WO/2003/074745A1 |
A hard metal alloy member which comprises a copper alloy comprising copper (Cu) in an amount of 40.00 to 99.45 wt % and, gadolinium (Gd) and at least one element selected from the group consisting of a rare earth element except Gd , an a...
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WO/2003/073541A1 |
An improved metal alloy composition for a fuel cell catalyst containing platinum, manganese, and cobalt.
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WO/2003/071621A2 |
An improved metal alloy fuel cell electrocatalyst composition containing comprising platinum, molybdenum, and a metal selected from the group consisting of nickel, iron, tin, and tungsten, provided (i) the concentration of each of nickel...
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WO/2003/066917A1 |
A gold alloy consisting substantially of 0.2 to 10.0 wt.% carbon and gold as the remainder. It has a blackish golden tone, does not fade, and has excellent mechanical properties.
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WO/2003/063191A1 |
An electric contact which comprises an Ag alloy having a chemical composition wherein Sn and In contents are both 1 to 9 mass %, has a first layer as a surface layer and a second layer as an inner part, wherein the first and second layer...
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WO/2003/053843A2 |
A microelectromechanical device, comprizing: at least one flexible member formed from an alloy comprising: one or more noble metals selected from the group consisting of gold, platinum and palladium; and one or more alloying elements, th...
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WO/2003/028669A1 |
Alloys composed of 35.5 to 62.5 % silver, 4.1 to 11.0 % indium, 5 to 37.0 % gold, 0 to 40.0 % platinum, 0 to 35 % palladium, 0 to 9.5 % zinc, tin, gallium, copper, 0 to 2.0 % iridium, rhenium, rhodium, ruthenium, 0 to 5.0 % boron, cobalt...
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WO/2003/029501A1 |
The present invention provides an additive alloy consisting essentially of (7) percent to (45) percent by weight copper, (40) percent to (84.50) percent by weight zinc, and 0.1 percent to (4) percent by weight silicon, the alloy being fr...
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WO/2003/015217A2 |
The invention relates to an electric contact comprising a base body consisting of a copper base alloy or stainless steel and a contact layer consisting of a gold base alloy. According to the invention, the contact layer has a thickness o...
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WO/2003/009323A1 |
A thermal fuse exhibiting a low electrical resistance at the time of conduction, in which fusion of a movable electrode (4) and a lead wire (2) is prevented even when temperature rise of an apparatus for connecting the thermal fuse is sl...
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WO/2003/007312A2 |
A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycli...
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