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WO/2001/094656A2 |
A programmable/controllable anode and related methods of operation. An anode to be used with an electroplating system containing a substrate (48) acting as a cathode. The anode includes a plurality of anode segments (203a, ..., 203d) and...
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WO/2001/091163A2 |
The facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber. The optimizer (step 70) utilizes two sets of input parameters along with the sensitivity table/matrix to ca...
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WO/2001/090434A2 |
A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a numerica...
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WO/2001/086031A1 |
A anode assembly (9) used in a plating operation, a planarization operation, and a plating and planarization operation of a semiconductor wafer (16). The anode assembly includes a rotatable shaft (27) disposed within a chamber (9c) in wh...
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WO/2001/083857A1 |
Method for the elctrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in th...
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WO/2001/083858A2 |
A rack suitable for holding a flexible substrate panel, the rack having a plurality of clamps for providing current to a panel clamped to the rack, the clamps being positioned to uniformly distribute current to the substrate. Seven clamp...
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WO/2001/081659A1 |
In order to establish electrical contact and to conduct electrolytic treatment, especially electroplating of very thin, electrically conductive layers, primarily with a high electrolytic current, a device is used that comprises a contact...
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WO/2001/081657A2 |
A rotation element (9,10), especially a contact cylinder is used to electrically contact printed circuit boards and conductor films in order to produce printed circuit boards and conductor films (7) wherein there is only a low amount of ...
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WO/2001/079592A1 |
In a method for electrochemical processing of a substrate (S), use is made of an apparatus which comprises a container (1) having a chamber for holding an electrolyte, an electrode member (8) arranged in the chamber, and a substrate hold...
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WO/2001/077416A2 |
Copper foil produced on a rotating drum cathode machine, wherein each of the outer edge portions of a web of the foil has a thickness greater than the thickness of the central portion of the web. In the process and apparatus used to elec...
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WO/2001/071066A1 |
Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device whi...
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WO/2001/068952A1 |
The invention relates to an electroplating device adapted to plate thin grooves and plugs for wiring in a semiconductor wafer surface, and openings in a resist layer, and adapted to form bumps (projecting electrodes) in a semiconductor w...
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WO/2001/068949A1 |
A single delivery channel is formed by, and between, inner wall (2) and baffle (3). Electrolyte (5) is pumped up the interior of channel (1) and is directed onto substrate (4) being a cathode maintained at -10 volts. The upper part of th...
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WO/2001/068953A1 |
The regulation of the concentration of metal ions in an electrolyte, for the electrolytic separation of metals, containing additional substances of an electrochemically reversible redox system is conventionally achieved by passing at lea...
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WO/2001/063018A1 |
An apparatus (300) capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate (10) is provided. It includes a rigid member (320) having a top surface of a predetermined shap...
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WO2000033356A9 |
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck ...
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WO/2001/050505A2 |
An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjustin...
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WO/2001/048800A1 |
A semiconductor wafer processing apparatus and processing method, in which a circuit pattern groove and/or hole formed in a semiconductor wafer is filled with a metal plating film and the metal plating film is removed except for the port...
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WO/2001/048274A1 |
An apparatus for plating a substrate by filling a fine interconnection pattern (recess) formed in a semiconductor substrate with a metal such as copper (Cu) comprises a substrate holding section (36) for horizontally holding and rotating...
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WO/2001/048275A1 |
A plating device and a plating method, for plating electronic parts boards, etc., while preventing metal pollution from spreading inside and outside the plating device, preventing the seed layer from dissolving, and preventing the washin...
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WO/2001/046996A2 |
The invention relates to a substrate holder (1) for holding substrates (5), especially semiconductor wafers. The inventive holder comprises first and second components (3, 4). The substrate (5) can be received between said components. Th...
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WO2000003072A9 |
A reactor (20) for plating a metal onto a surface of a workpiece (25) is set forth. The reactor (20) comprises a reactor bowl (35) including an electroplating solution disposed therein and an anode (55) disposed in the reactor bowl in co...
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WO/2001/039250A2 |
A physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at% to 0.001 at%. In one implementation, a physical vapor deposition target includes an alloy of ...
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WO/2001/037359A2 |
An electrochemical cell capable of operating in pressure differentials exceeding about 2,000 psi, using a porous electrode. The porous electrode comprises a catalyst adsorbed on or in a porous support that is disposed in intimate contact...
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WO/2001/034881A2 |
The invention relates to a device for electrolytically treating board-shaped workpieces, especially printed circuits. The board-shaped workpieces (W) are guided in a vertical position through a treatment cell (BZ) that contains a treatme...
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WO/2001/031095A1 |
A one-step, integrated process and apparatus for producing electrolytic copper foil (10) having a dual-layer copper bond enhancing treatment electrodeposited on the matter side of the foil, which employs two 'super-anodes' (27, 28) on a ...
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WO/2001/031094A1 |
Apparatus for metal plating an article comprising a frame having a plurality of sealing members positioned thereon, the frame being capable of conducting an electrical current between sealing members, each sealing member being adapted to...
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WO/2001/029290A1 |
The invention relates to the electrolytic treatment of conducting plates and films LP wherein a method and a device are used in which plates and films are transported by a treatment unit and thereby brought into contact with a treatment ...
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WO/2001/029289A1 |
The invention relates to the electrolytic treatment of electrically conducting structures (4) which are insulated from each other and positioned on the surface of electrically insulating film material (Fo) whereby a method is employed wh...
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WO/2001/027358A1 |
The invention relates to carriers serving for supplying current to workpieces or counter electrodes that are to be treated electrolytically. The invention also relates to a method for electrolytically treating workpieces. The inventive c...
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WO/2001/024257A1 |
A method for making semiconductor interconnect features in a dielectric layer is provided. The method includes depositing a copper seed layer over a barrier layer that is formed over the dielectric layer and into etched features of the d...
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WO/2001/018282A2 |
The invention relates to a method for chemically treating the surfaces of bulk material in several treatment steps. The bulk material is successively treated in batch quantities in several reactors with different treatment liquids. The a...
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WO/2001/013416A1 |
The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film (18b, 18c) while the substrate is being plated. The present invention ...
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WO/2001/004387A1 |
A lift and rotate assembly (200), for use in a workpiece processing station (400), which includes a body (210) having a slim profile and pins (250) located on opposite sides for mounting the assembly onto a tool frame (100). The lift and...
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WO/2001/000905A1 |
A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises an electrode base having at least one und...
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WO/2000/077279A1 |
An apparatus that is useful for evaluating and optimising electrochemical processes and for electrochemically characterising materials includes a base or substrate carrying a plurality of electrodes, at least one housing member that is s...
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WO/2000/075402A1 |
A plating tool cell anode for venting unwanted gases from a fluid plating solution. In a first embodiment, the solution is introduced into a chamber, defined by the plating tool cell (10), by fluid inlet (12) and contacts the anode (50)....
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WO/2000/070128A1 |
A plating jig for a semiconductor wafer capable of holding a semiconductor wafer between a first holding member and the seal packing of a second holding member, wherein the second holding member is provided with a second conduction membe...
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WO/2000/066814A1 |
The invention relates to an electroplating barrel whose barrel shell consists of a plurality of plastic shell elements (11) which are firmly interlinked across the circumference of the shell by gluing or welding without preheating. The s...
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WO/2000/061498A2 |
A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make e...
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WO/2000/059682A1 |
The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate (2) and then polishes the same substrate (2). This is achieved by providing multiple chambers (100, 200) in a s...
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WO/2000/060141A1 |
The present invention provides an improved anode formulation and an improved method of manufacture. More specifically, the invention provides a tri-layer anode having an improved service life when used, for example, for steel strip elect...
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WO/2000/056453A1 |
The invention relates to a method for producing a catalyst. A layer consisting of catalytically active metallic material is deposited on a flat substrate by means of electrodeposition, said substrate being immersed in an electrolyte cont...
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WO/2000/054889A1 |
An apparatus and method for removing surface coating of an article carrying jig (11) so as to enable electrical contact between the jig and the or each article (12) to enable the articles to be coated with surface coating in a treatment ...
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WO/2000/055888A1 |
The invention relates to a device for treating substrates, especially semiconductor wafers, with at least one processing container that is provided with an opening which can be closed from the exterior during the treatment with the subst...
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WO/2000/053829A1 |
The present invention relates to an apparatus for solder plating. At least one work piece comprises a frame, a carrier (10) mounted on the frame for rotation about a vertical axis (14) and having a plurality of work piece holders (20), a...
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WO/2000/050670A2 |
In the case of an apparatus for electro-dipcoating small electrically conductive parts, having a tank (6) with a predetermined filling height for receiving a dipping bath of electrically conductive, liquid coating agent, a delivery tube ...
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WO/2000/049206A1 |
A continuous band plating device capable of providing a glossy and beautiful plated surface, wherein an anode is not provided in a continuous band (80) rising section at the final-stage cell (13) of a plating tank (10), nor is provided a...
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WO/2000/041475A2 |
The invention relates to a component support for holding at least one component (12), notably for electroplating. The support comprises at least one holding magnet (31) whose magnetic field lines run through the component (12) in an area...
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WO/2000/038222A1 |
The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part ...
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