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WO/2006/136362A2 |
The invention relates to a galvanising device (11) for circuit boards (16) with contact wheels (28) for electrical contacting provided at the boundary region (19). The contact wheels (28) only contact the underside (17) of the circuit bo...
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WO/2006/125629A1 |
The invention relates to the transport and preferably to the electrically contacting of an article (1) to be treated, for example in the form of a printed circuit or a conductive foil, in an electrolytic system. The inventive device comp...
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WO/2006/126518A1 |
Gravure cylinder-use copper plating method and device which can perform a uniform-thickness copper plating on a gravure cylinder over its entire length without causing defects such as rashes and pits regardless of the size of a gravure c...
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WO/2006/117035A1 |
The invention relates to an electrolytic cell comprising a device provided with at least two cuboidal/column-shaped/prismatic chambers having identical cross-sections and made of a thermoplastic, mechanical resistant, electrical resistan...
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WO/2006/114305A1 |
There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.
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WO/2006/108140A1 |
A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt i...
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WO/2006/106221A2 |
The invention relates to an electrode (11) for processing the surface of at least one object (1) comprising at least one cavity (23) which contains the processable object (1) during processing, enables the object (1) to be freely movable...
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WO/2006/106118A1 |
The invention relates to a receiving device (3) for a component that is subjected in particular to an electroplating treatment in a process chamber (30). Said device comprises a gripper element (10), which can be displaced by at least on...
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WO/2006/094814A2 |
The invention relates to a cylindrical electrode for gas evolution comprising a non-activated conductive core whereto an easily detachable and replaceable component provided with catalytic activation is secured, for instance an undulated...
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WO/2006/093605A1 |
An electrode tool (40), having a fine conductive pattern is disclosed to be made by unconventional methods. The tool has very strong adhesion beween an insulation layer (71) and a substrate (60), which prevents penetration of electrolyte...
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WO/2006/091828A2 |
An electrochemical machining (ECM) system for machining a workpiece includes a plurality of ECM stations. A first ECM station machines a first region of the workpiece. A second ECM station machines a second region of the workpiece separa...
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WO/2006/088615A2 |
As population density increases, the transportation of hazardous chemicals, including acids and disinfectants, lead to an increased incidence of spills while the consequences of spills become more serious. While solutions of halide acids...
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WO/2006/087743A1 |
A hollow anode (A) for an apparatus for the galvanic coating of the running surfaces of cylinders is provided with a plurality of passages (P) formed in the top portion (T) thereof, the total area of the passages (P) being such as to ach...
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WO/2006/084973A1 |
The invention relates to a method for treating surfaces of hollow parts, this method being a conversion treatment such as an anodizing, and to a method according to which the hollow pieces are completely immersed inside at least one trea...
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WO/2006/082462A1 |
The device (2, 12, 19, 22, 26) for the electrolytic surface treatment of metals, comprises a nib (4, 11) connected with the unipolar supply of electric current (7) from an external apparatus, the other pole being connected with the metal...
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WO/2006/076136A2 |
An oxide-based electrolytic structure and process is disclosed, which is particularly useful for use as an oxygen separation device. The disclosed structures utilize thin film layers to provide the oxygen separation in conjunction with p...
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WO/2006/073163A1 |
An insoluble electrode that even when used in regions of intense consumption such as one where the phenomenon of conversion to negative electrode occurs, can stably maintain positive electrode functions for a prolonged period of time, an...
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WO/2006/070452A1 |
A method for manufacturing a semiconductor device, which comprises providing a tank (21) for storing a plating solution in addition to a plating treatment tank (20), and arranging magnets (33a to 33d) in the plating solution storage tank...
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WO/2006/064711A1 |
In a face down type jet plating device, it is possible to prevent lowering of the plating quality caused by a minute solid foreign matter attributed to a black film. In the face down type plating device, a partition wall (7) is provided ...
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WO/2006/065580A2 |
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (107). The multi-layered wafer support apparatus includes a bottom film layer (201) and a top film layer (301). The bot...
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WO/2006/061659A1 |
Apparatus for surface treatment of battery cans, including cleaning and electroplating of the interior and exterior surfaces of battery cans as they are transported along a continuously moving production line. The battery cans are automa...
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WO/2006/053877A1 |
The invention relates to a counter-electrode arrangement (14) that, e.g. can be used when coating and removing coatings from turbine blades, and to a method for the operation thereof. The counter-electrode arrangement comprises a referen...
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WO/2006/055766A1 |
Methods and systems are provided to eliminate bubble entrapment during electrochemical processing of a substrate, wherein a rigid plate (500) with fluid openings (520) allow process solution (505) to flow between the front surface (510) ...
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WO/2006/055145A2 |
A method and apparatus for plating a conductive material onto a substrate is provided. The apparatus includes a fluid processing cell having a fluid basin configured to contain an electrolyte solution and having an opening configured to ...
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WO/2006/048569A2 |
The invention relates to a holder for parts to be subjected to a surface treatment, for a vehicle comprising a chassis (57). Said holder comprises means (49, 65) for fixing parts in translation to the holder, at least one means (49, 65) ...
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WO/2006/030998A1 |
Disclosed are an electro polishing combined electric plating apparatus and an electroless plating apparatus using the same that that can form a plating film on a workpiece shaped in a pipe made of a material selected from the group consi...
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WO/2006/030276A2 |
A primer (16) for forming a resin frame (17) is formed on an outer end portion (16p) of a separator (1) of a fuel cell. An electrodeposition coating device (2) includes an upper frame (21) and a lower frame (22), and covers only the oute...
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WO/2006/027311A1 |
The invention relates to an electrode arrangement having a variable geometry which can be adapted to a component (13) which is to be treated. The treatment of the component can be an electrochemical coating or a removal of said electroch...
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WO/2006/012112A2 |
An apparatus and method for plating a metal layer onto a substrate is provided. A catholyte volume is positioned to receive a substrate for plating. An anolyte volume having one or more anode segments positioned therein is ionically sepa...
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WO/2006/010888A1 |
A method of depositing or etching a micro- or nano- scale pattern on a work-piece is disclosed, comprising the steps of: (a) placing the work piece in an electrochemical reactor in close proximity to a patterned tool; (b) connecting the ...
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WO/2006/010149A2 |
Systems and processes for producing hydrogen using bacteria are described The system includes a reactor having an anodophilic bacteria disposed within the interior and an organic material that is oxidizable by the anodophilic bacteria in...
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WO/2006/009686A1 |
Disclosed is a multi-step process for the coating of a substrate without re-racking the substrate between the coating operations comprising: providing a substrate holder (10) with an inert protective polymeric coating (16) covering a sub...
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WO/2006/006992A1 |
An electrolyte bath (10) and method of electrolytically plating a layer of metallic chromium on a substrate comprises providing an electrolyte bath (10) of a trivalent chromium, passing a current through the bath from an anode to a catho...
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WO/2006/005549A2 |
The invention relates to a clamping device for a printing cylinder, comprising two holders (11), arranged on a common axis, the holders (11) each comprising a recess (12) for housing one end (15) of the printing cylinder, with the recess...
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WO/2006/004747A2 |
A membrane electrode cell is disclosed which has a membrane cartridge that can reaily be removed from the cell without disassembling the framework of the cell. Also, a membrane electrode cell is disclosed which has a water flow arrangeme...
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WO/2006/002969A2 |
A device and a method for chemically or electrolytically treating work pieces (1) are proposed in an effort to avoid irregular contours of finest conductive structures, pads and lands as well as bridges (shorts) on the one side or breaks...
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WO/2006/000301A1 |
The invention relates to a device for the electrochemical surface treatment of metal parts in an electrolyte bath (B). The device comprises a drum (12) which is rotatable about an axis (X) and provided with a shell (14) and sidewalls (16...
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WO/2005/123989A1 |
A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liq...
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WO/2005/118915A2 |
A method of electrolytic synthesis comprises applying a potential between a first electrode and a second electrode. The first electrode is in contact with a first fluid stream in a channel, the second electrode is in contact with a secon...
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WO/2005/116300A1 |
In an external plating structure of a semiconductor package, a Pd or Pd alloy film is used as a material replacing the conventional solder plating as a soldering metal. The highly reliable semiconductor component external plating structu...
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WO/2005/116302A2 |
The invention relates to an electrochemical electrolyte cleaning method using plastic-diamond composite electrodes. The electrolyte is generally liquid waste from chemical or electrochemical methods. The bipolar plastic-diamond composite...
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WO/2005/108651A2 |
The invention relates to a method for production of a corrosion-resistant and/or oxidation-resistant coating, whereby at least one metal of the platinum group, in particular, platinum and/or palladium, or an alloy made from at least one ...
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WO/2005/105322A1 |
A substrate processing unit allows reduction of a space required for the entire substrate processing and reduction of energy required for substrate transportation, by performing a process by using different processing solutions in one su...
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WO/2005/103339A1 |
The invention relates to a method for producing a green body, by which means solid particles are deposited on a mould (2) arranged in a liquid (1). According to the invention, a first electrode (3a) is in contact with the liquid (1), and...
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WO/2005/095678A2 |
The present invention includes a method of electroplating an object, where the objects are stacked in at least one sleeve and the objects have an interior surface, that upon stacking, form a stack conduit. The sleeves are then racked to ...
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WO/2005/090647A1 |
In a process for the electrogalvanic coating of metal items through a sequence of chemical or electrochemical treatment phases, each of said treatment phases includes the following steps: a) introducing the drum containing the items into...
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WO/2005/091340A1 |
A process chamber for processing semi-conductor wafers. The chamber includes at least one rotor within the process chamber. The rotor is adapted to receiver and/or process semi-conductor wafers. The top of the process chamber also includ...
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WO/2005/086696A2 |
An improved electrical connection (10) between an inert anode (12) and a conductor rod (14) is disclosed. The conductor rod (14) has a smaller diameter than a hole in the anode (12) such that a gap is provided between the conductor rod (...
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WO/2005/086880A2 |
A lithography device (200) includes one or more conductive strips (202, 204) monolithically embedded in an insulative structure (214). A method of manufacturing a lithography device includes monolithically forming a conductive strip thou...
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WO2005017971A9 |
A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) ha...
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