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WO/2022/112379A1 |
Aqueous electrolyte for deposition of a ruthenium alloy layer on metal surfaces, in particular base metal surfaces, its use and a corresponding electrolytic process, and a correspondingly produced layer sequence.
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WO/2022/108325A1 |
Provided is a tin-silver plating solution comprising: a tin ion supply source; a silver ion (Ag+) supply source; and an organic additive including a silver (Ag) complexing agent, a tin carrier, and a grain refiner, whereby the generation...
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WO/2022/104875A1 |
A vapor chamber upper cover plate manufacturing method, a vapor chamber upper cover plate, and a vapor chamber. The vapor chamber upper cover plate manufacturing method comprises the following processes: manufacturing a vapor chamber upp...
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WO/2022/104882A1 |
Provided are a method for preparing a vapor chamber upper cover plate, a vapor chamber upper cover plate, and a vapor chamber. The method for preparing the vapor chamber upper cover plate comprises the following processes: manufacturing ...
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WO/2022/101474A1 |
The present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper a...
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WO/2022/091427A1 |
This potassium gold cyanide crystal is characterized in that the silicon content is 10 wt ppm or less. This potassium gold cyanide solution is characterized in that, per 10 mL of the potassium gold cyanide solution, the number of pieces ...
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WO/2022/088216A1 |
The present application provides a chemical nickel-plating process for a steel sheet, a phosphorus-nickel-plated steel sheet and a vapor chamber. The chemical nickel-plating process for a steel sheet comprises the following steps: provid...
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WO/2022/089232A1 |
Disclosed are manufacturing equipment and a manufacturing method for lead frame surface roughness. The manufacturing equipment for lead frame surface roughness comprises: a material dispensing apparatus, a cleaning apparatus, a copper el...
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WO/2022/082933A1 |
A production method for an ultrathin high-strength electronic copper foil, comprising the following steps: preparing an electrolyte, adding a mixed additive, manufacturing an isolation layer by using a copper foil having the thickness of...
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WO/2022/080735A1 |
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with n...
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WO/2022/080191A1 |
This tin or tin alloy plating solution at least contains (A) a first tin compound, (B) an acid or salt thereof selected from an organic acid and an inorganic acid, and (C) a surfactant. The plating solution contains polypropylene glycol ...
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WO/2022/079319A1 |
Disclosed are a metal strip (1, 101, 201) and a process for manufacturing such a metal strip (1, 101, 201). In order to be able to reproducibly manufacture a rigid metal strip (1, 101, 201), according to the invention, the butt seam (5) ...
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WO/2022/074221A1 |
The invention relates to a process for fabricating a 3D–NAND flash memory comprising a first step of electrodepositing an alloy of copper and of a dopant metal selected from manganese and zinc followed by a second step of annealing the...
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WO/2022/070983A1 |
The purpose of the present invention is to provide a tin plating liquid for barrel plating that can suppress the occurrence of mold in washing water for a washing step that follows a tin plating step, even in bath temperature environment...
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WO/2022/061948A1 |
The present invention relates to an insoluble anode methyl sulfonic acid coating low-lead content tin plate production method. The method comprises the following steps: step 1: an alkaline washing process section, first performing electr...
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WO/2022/060920A2 |
The disclosure relates to units, systems and methods for producing ammonia from a nitrogen-containing feedstock from sources like wastewater, ANSOL, or an input gas containing one or more nitrogen-containing species, which can advantageo...
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WO/2022/059237A1 |
Provided are: a silver-plated material having superior wear resistance than ever before; and a method for producing the silver-plated material. In the method for producing a silver-plated material by performing electroplating in a silver...
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WO/2022/054953A1 |
The present invention provides: a plated material which has low insertion force (low friction) and durability at high temperatures; and an electronic component. A plated material which is provided with: a base plating layer that is compo...
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WO/2022/050001A1 |
The purpose of the present invention is to provide a copper foil, with which a wiring board capable of exhibiting both RF characteristics and a high peeling strength can be fabricated using a resin base material made of LCP. The copper f...
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WO/2022/047480A1 |
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper ...
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WO/2022/041533A1 |
Disclosed in the present invention is a production method for a high heat-resistant electrodeposited copper foil, comprising the following steps: raw foil manufacturing, pickling and water washing, primary coarsening and water washing, s...
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WO/2022/041534A1 |
An additive for an electrolytic copper foil suitable for an HDI board, and an electrolytic copper foil production process, the additive being an aqueous solution containing a brightener SPS, a DPS, and gelatin, the concentration of the b...
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WO/2022/044451A1 |
Provided is a shock absorber, and a manufacturing method thereof, in which trivalent chromium is used and in which both a high degree of hardness and low friction are achieved at a high level without utilizing hexavalent chromium that ca...
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WO/2022/041093A1 |
A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; a...
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WO/2022/046328A1 |
Methods are proposed for fabricating highly pure lithium metal electrodes from aqueous lithium salt solutions by means of electrolysis through lithium ion selective membranes, performed at constant current densities between about 10 mA/c...
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WO/2022/046327A1 |
A lithium metal electrode has no more than five ppm of non-metallic elements by mass, and is bonded to a conductive substrate. Optionally, the lithium metal electrode may be bonded on one side to a conductive substrate and on another sid...
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WO/2022/039171A1 |
The present invention provides a cyanide-based silver alloy electroplating solution characterized by containing 10 to 100 g/L of silver cyanide complex in terms of silver, 5 to 300 g/L of electroconductive salt, 0.1 to 10 g/L of germaniu...
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WO/2022/032048A1 |
A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer...
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WO/2022/018896A1 |
This terminal material for connectors comprises: a substrate having at least a surface made of copper or a copper alloy; and a silver-nickel-potassium alloy plating layer formed on at least a portion of the substrate, wherein the silver-...
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WO/2021/245766A9 |
The present invention provides technology for improving the filling properties of micropores in intermittent electroplating. This intermittent electroplating method is for performing intermittent electroplating of a plated object havin...
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WO/2022/018225A1 |
The invention relates to a method for producing a zinc coating optimized for coefficient of friction on a steel component. In order to provide such a method resulting in a coating having good corrosion protection properties, good adhesio...
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WO/2022/013387A1 |
This invention relates to a method for the electrodeposition of a functional or decorative chromium layer onto a metallic substrate in an electrodeposition process from a halide-ion free and boric acid free aqueous electrolyte solution a...
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WO/2022/012932A1 |
The present invention provides an acidic aqueous composition for copper electroplating comprising (a) copper ions; (b) bromide ions; and (c) at least one additive of formula (S1) wherein XS1 is selected from a linear, branched or cyclic ...
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WO/2022/012993A1 |
The present invention relates to an electrolyte and its use in a process for fabricating copper interconnects. The electrolyte of pH greater than 6.0 comprises copper ions, manganese or zinc ions, and ethylenediamine which complexes the ...
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WO/2022/013354A1 |
A method of forming a multilayered zinc alloy coating comprises steps of providing a bath of an aqueous electrolyte including zinc and a second electrodepositable component in an electrolytic cell having an anode and a cathode; applying ...
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WO/2022/009675A1 |
A flexible printed wiring board according to an aspect of the present disclosure comprises a base film and a plurality of wires that are disposed on the surface of the base film, wherein each of the wires has an end surface along the lon...
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WO/2022/007505A1 |
Disclosed in the present invention is a cleaning method used for replacing phosphating for thermal diffusion electroplated wire, where a phosphorus-free cleaning solution is used to clean a steel wire, the phosphorus-free cleaning soluti...
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WO/2022/007323A1 |
A piston, a device for manufacturing pistons, and a method for manufacturing pistons. The piston comprises: a piston base (100); a porous functional layer (101), which is provided on the top surface of the piston base (100); a microporou...
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WO/2022/002899A1 |
The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The platin...
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WO/2021/261066A1 |
Provided is a composite material obtained by forming, on a material, a composite film composed of a carbon particle-containing silver layer, wherein the content of Sb in the composite film is at most 1 mass%, and the crystallite size of ...
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WO/2021/261155A1 |
Provided is a surface-treated steel sheet provided with: a tin-plated steel sheet obtained by forming a tin-plating on a steel sheet; a tin oxide layer that is formed on the tin-plated steel sheet and that contains a tin oxide as a main ...
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WO/2021/248848A1 |
A method for manufacturing perforated copper coil for a shielded cathode plate. The method comprises the following steps: imprinting a shielding point on a separator according to an expected distribution mode, attaching the separator to ...
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WO/2021/247182A1 |
An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, w...
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WO/2021/242458A1 |
An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing ag...
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WO/2021/241865A1 |
The present invention relates to an electrolytic nickel plating surface modifier comprising a carboxyl group-containing compound and an electrolytic nickel plating solution comprising the electrolytic nickel plating surface modifier. Whe...
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WO/2021/234075A1 |
A trivalent chromium-based electrolysis bath comprises at least one trivalent chromium salt and at least two inorganic complexing agents, in which the first inorganic complexing agent is a halide; and the second inorganic complexing agen...
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WO/2021/236398A1 |
Nanotwinned copper and non-nanotwinned copper may be electroplated to form mixed crystal structures such as 2-in-1 copper via and RDL structures or 2-in-1 copper via and pillar structures. Nanotwinned copper may be electroplated on a non...
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WO/2021/235034A1 |
This electrolytic solution contains magnesium chloride, lithium chloride, and an aprotic solvent. In the electrolytic solution, the concentration at which the total of magnesium chloride and lithium chloride are dissolved with respect to...
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WO/2021/229481A1 |
The present invention describes a copper/Tin-based alloy containing Pt and optionally Zn and/or Pd having colorimetric coordinates that can be modulated from white to yellow to pink and exhibiting striking hardness and thus wear resistan...
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WO/2021/225827A1 |
Disclosed are apparatus, systems, and methods for electroplating cobalt, nickel, and alloys thereof in interconnect features of partially or fully fabricated electronic devices. During electroplating, cobalt, nickel, or alloys thereof fi...
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