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WO/2003/062836A1 |
A probe is disclosed, comprising a beam (4B), which has a front end (4b1), an intermediate portion (4b2) and a base end (4b3), the front end being a portion for contacting a test subject through a contactor, the base end being a portion ...
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WO/2003/062322A1 |
A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passi...
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WO/2003/049155A1 |
System and method for laser micro−machining of crystalline and polycrystalline materials such as silicon that produces smooth surfaces. The invention is applied to integrated circuit applications including probing (1&sol 20) or modific...
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WO2002061443A9 |
A probe head assembly (66) for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer (74, 76) portion formed from a plurality of laminated metallic layers (74a-74e, 76...
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WO/2003/035541A2 |
The invention relates to a probe needle for testing semiconductor chips, one end of said probe needle being fixed in a holding element and the free end thereof comprising a contact tip. The invention also relates to a method for producin...
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WO/2003/027689A1 |
A probe plunger (14a, b) and method of making are provided. The probe plunger (14a, b) includes an outer layer (20) of a relatively hard, relatively low contact resistance such as a palladium-cobalt alloy. In some embodiments, a portion ...
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WO/2003/025589A1 |
A contact structure for electrical connection with contact targets, comprising a contact carrier and a plurality of contactors, the contactors further comprising upper springs having upper ends positioned in vertical direction, lower spr...
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WO/2003/025588A1 |
A contact structure for electrical connection with contact targets, comprising a contact carrier and a plurality of contactors, the contactors further comprising linear beams having upper ends positioned in vertical direction and lower e...
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WO/2003/017351A1 |
A method for manufacturing a probe card having on a base substrate a contact to be brought into electric contact with an electronic device terminal and transmitting&sol receiving a signal to&sol from the electronic device. The method inc...
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WO/2003/015155A1 |
A method of manufacturing a thin film sheet (24) with bumps, comprising the steps of forming a plurality of through holes (36) in the thin film sheet (24), stacking a positive dry film (38) and the thin film sheet (24) on a substrate (32...
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WO/2003/007430A1 |
A method for manufacturing a feed−through comprising a substrate having a plurality of through conductive parts formed therein, characterized by comprising a stopper film forming step for forming stopper film on one face of the substra...
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WO/2003/005042A1 |
A conductive contact characterized by being provided with a gold−plated layer (8) placed on a conductive needle element (2) via a Ni substrate layer (7a), formed with a Ni substrate (7b) on the gold−plated layer (8) at a needle porti...
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WO/2003/003027A1 |
A support body assembly used for a contact probe head allowed to come to contact with a contacted body, characterized by comprising a support body having a plurality of holder holes for supporting a plurality of conductive contactors in ...
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WO/2002/101830A2 |
An electronic component having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resili...
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WO/2002/097452A1 |
A method for manufacturing a probe card, which comprises a step of forming a plurality of amorphous alloy layers exhibiting a supercooling liquid temperature region and having a predetermined shape on a predetermined substrate, a step of...
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WO/2002/094508A1 |
A contactor cleaning sheet (10) capable of concurrently cleaning the tip and side faces of a contactor (22) by using one sheet of the cleaning sheet (10), comprising a base sheet (11), a first polishing layer (12) formed on the surface o...
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WO/2002/090054A2 |
A contactor cleaning sheet capable of concurrently cleaning the tip and side faces of a contactor, a contactor cleaning sheet manufacturing method, and a contact cleaning method; the cleaning sheet (10), comprising a base sheet (11), an ...
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WO/2002/083364A1 |
A cleaning implement of simple construction capable of cleaning the tip and lateral surface of a contactor is provided. It comprises a base plate (11), an intermediate sheet consisting of an elastic sheet having elasticity and a plastic ...
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WO/2002/082104A1 |
A probe substrate, wherein step parts (5) are formed at one end of each of a plurality of leads (2) formed in a specified pattern on an insulation base material (1) (for example, resin film), an insulation resin layer (3) is formed on th...
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WO/2002/068321A2 |
A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provi...
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WO/2002/064496A2 |
A layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for ...
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WO/2002/061439A1 |
A method of manufacturing a contact probe, comprising an electroforming process for forming a metal layer (526) by performing an electroforming so as to fill clearances in a resist film (522) by using the resist film (522)as a pattern fr...
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WO2000075677A9 |
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are f...
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WO/2002/058137A2 |
An improved microelectronic spring structure, and method of making the same, are disclosed. The improvement comprises, in a spring contact of the type comprising a beam (104) attached to a post, of replacing the post with a plurality of ...
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WO/2002/047209A1 |
A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contract substrate (20) and a plurality of contactors (30). The contractor has an intermediate portion which is inserte...
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WO/2002/041015A1 |
A kit and a method for cleaning a socket connection terminal; the kit, wherein a rubbing member (110) having a thickness, at a portion sandwiched between the pressing surface of a pusher (30) and the connection terminal (43) of a socket ...
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WO/2002/035244A1 |
The invention concerns a test block (10) for an electronic component, comprising an embossed support layer (12) including a plurality of projecting protrusions (12), said protrusions being respectively equipped in their top parts with at...
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WO/2002/025298A1 |
An inspection unit capable of positioning a probe and the other components with a high accuracy while suppressing the misalignment of the probe and also disposing the probe and the other components close to each other, comprising the pro...
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WO/2002/015653A1 |
A contact set and compressible interposer, methods for producing them and a compliant interconnect assembly for providing electrical connection of a first electronic device to a second electronic device. The compliant interconnect assemb...
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WO/2002/015260A1 |
Disclosed is a probe card that comprises: a probe substrate including a plurality of probes and a support substrate for supporting the probes; a PCB having at least one probe substrate; and a space transformer having a first surface conn...
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WO/2002/010780A1 |
An electrical test probe wedge tip according to the present invention includes an electrically conductive interior or blank (48) optionally surrounded, at least partially, by an electrically insulated exterior surface (46). A longitudina...
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WO/2002/010779A1 |
The invention concerns a method for making a card with tips for testing semiconductor chips with microsphere bond pads. A first thin adhesive coat is vacuum deposited on a flexible polyimide film, followed by a second metal coat. A combi...
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WO/2002/009169A1 |
An inspection apparatus with probe card capable of properly inspecting an inspected object even at the time of heating and cooling, comprising a performance substrate having inspection terminals disposed thereon, a contactor substrate ha...
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WO/2001/091053A1 |
The invention relates to a method for examining a pre-determined area of a printed circuit board by means of a device comprising a fixed camera and a display device. The printed circuit board is placed in the scanning area of the camera ...
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WO/2001/088612A1 |
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The p...
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WO/2001/088551A1 |
A probe card (100) comprising contactors (92), a substrate (94), a signal transmission passageway (96), a grounding conductor (98) and a hole (102). The signal transmission passageway (96) is formed on the substrate (94). The substrate (...
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WO/2001/084166A1 |
A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integ...
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WO/2001/080315A2 |
An interconnection element and a method of fabricating and using an interconnect element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformab...
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WO/2001/067116A2 |
An improved vertical pin probing device is constructed with a housing with spaced upper (48) and lower (50) spacers of Invar$m(3), each having a thin sheet of silicon nitride ceramic material (56, 58) held in a window in the spacer by ad...
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WO/2001/057541A1 |
The invention relates to an adapter for testing printed circuit boards and to a testing needle for such an adapter. The inventive adapter is characterized by two units that can be displaced with regard to one another, whereby each unit h...
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WO/2001/047831A1 |
A carbon-containing aluminum nitride sintered compact comprising an aluminum nitride matrix and, incorporated therein, a carbon which has peaks appearing in the vicinity of 1580 cm?-1¿ and 1355 cm?-1¿ as measured by the laser Raman spe...
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WO/2001/048818A1 |
An interconnection element of a spring (body), and a method for fabricating the interconnection element. The interconnection element is of a size suitable for directly contacting a semiconductor or a packaged semiconductor device such as...
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WO/2001/046704A2 |
A small swing reducer circuit. An apparatus includes a first number of input terminals including at least two input terminals coupled to receive a differential small swing signal and a reducer circuit to generate differential, small swin...
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WO/2001/036986A1 |
This invention relates to a probe card manufactured by the steps of: attaching an insulator board, which is made of a silicone glass material and has a plurality of fine probes formed through an etching process, to a circuit board; bondi...
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WO/2001/023898A1 |
[Problems to be Solved] By a probe of a conventional semiconductor inspection device, it is difficult due to accuracy of a probe or the like to inspect all of semiconductor devices at a time with a plurality of probes. [Solution] A metho...
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WO/2001/020347A1 |
A multi-point probe, a method for producing the multi-point probe and a cylindrical nano-drive for in particular driving the multi-point probe in a multi-point testing apparatus for testing electric properties on a specific location of a...
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WO/2001/009623A1 |
Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probes structures can be used to test one...
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WO/2001/007207A1 |
A substrate (200), preferably constructed of a ductile material and a tool (210) having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is prefer...
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WO/2001/006559A1 |
A lightweight wafer prober of good temperature characteristic, which is unlikely to warp when its probe card is pressed, thereby effectively preventing damage to silicon wafers and measurement errors. The wafer prober includes a conducto...
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WO/2001/000659A1 |
The invention is directed to novel benzimidazolone peptidomimetic compounds which are useful as thrombin receptor antagonists for the treatment of diseases associated with thrombosis, restenosis, hypertension, heart failure, arrhythmia, ...
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