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WO/2019/197267A1 |
In the cleaning of the tips of needles of needle cards, the tips of the needles are put into effective contact in a cleaning agent in different cleaning positions, in order to remove contaminants from the tips of the needles and to make ...
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WO/2019/197295A1 |
The testing apparatus for singulated semiconductor dies comprises a nesting frame (1) and a bottom part (2), which form a testing device nest adapted to the size of a semiconductor die (7). A pushing device (4) is provided for an alignme...
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WO/2019/198853A1 |
The present invention relates to contacts and a socket apparatus for testing a semiconductor device. Each contact according to the present invention is a spring contact integrally formed by punching out and bending a metal plate, and com...
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WO/2019/162194A1 |
An apparatus (1) for the automated assembly of a probe head for testing electronic devices integrated on a semiconductor wafer, comprises a support (6) adapted to support at least two parallel guides (2), which are provided with a plural...
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WO/2019/140795A1 |
Provided are a TDS detector and a packaging process therefor. The TDS detector comprises a wire (1), wherein both ends of the wire (1) are arranged with a connector (11) and a probe respectively, the probe comprises two sets of needles (...
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WO/2019/093614A1 |
Disclosed is a test probe assembly. The test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member co...
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WO/2019/089611A1 |
Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the...
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WO/2019/066135A1 |
The present invention relates to a bidirectional conductive module and a method for manufacturing the same. A bidirectional conductive module according to the present invention comprises: an insulative body which is made of an insulative...
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WO/2019/066256A1 |
The present invention relates to a substrate testing cartridge provided for simultaneously testing multiple substrates for which a substrate treatment process has been finished, and a method for manufacturing same. According to an embodi...
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WO/2019/048299A1 |
An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a f...
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WO/2019/039628A1 |
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method for manufacturing the same. The bidirectional conductive pin according to the present invention comprises: a pin bod...
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WO/2019/022272A1 |
The present invention relates to a probe pin for a probe card and, more specifically, to a probe pin with reduced flux diffusion, which prevents flux from diffusing along the probe pin when the probe pin is attached to an electrode of a ...
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WO/2019/014132A1 |
A test fixture (120) includes a mother board (225) that has test signal lines (223) configured to couple (651) to a test station (650). The mother board (225) includes a recessed region with contact pads (428) coupled to the test signal ...
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WO/2019/004663A1 |
The present invention relates to a probe member for a pogo pin, a manufacturing method therefor and a pogo pin comprising same. One embodiment of the present invention provides a probe member used in a test socket, the probe member compr...
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WO/2019/004661A1 |
The present invention relates to a probe member for a pogo pin, a manufacturing method therefor and a pogo pin comprising same. One embodiment of the present invention provides a probe member used in a test socket, the probe member compr...
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WO/2018/221834A1 |
Provided are a wafer probe card that matches in one-to-one correspondence with an LED wafer by implementing a probe system having the same size as the LED wafer, and inspects brightness and wavelength of light emitted from a plurality of...
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WO/2018/206506A1 |
The invention refers to a method for producing a multi-layer (30) of a probe card (1) for a testing apparatus of electronic devices, comprising the steps of: providing a plurality of dielectric layers (30a-30n) starting from a first diel...
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WO/2018/208604A1 |
One example includes a device (100) that is comprised of a plurality of printed circuit boards (200), a plurality of vias (110), and a plurality of castellations (130). The plurality of printed circuit boards (200) are laminated together...
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WO/2018/182327A1 |
A semiconductor package test socket and a method for manufacturing the same are disclosed. The test socket of the present invention is manufactured by the steps of: disposing a first film layer on a lower portion of a support plate havin...
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WO/2018/162343A2 |
A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe comprises a probe body, a first cantilever extending from the probe body. The first cantilever defining a first loop w...
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WO/2018/142170A1 |
The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a s...
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WO/2018/108675A1 |
A contact probe (20) for a probe head of an apparatus for testing electronic devices comprises a probe body (20C) being essentially extended in a longitudinal direction between respective end portions (20A, 20B) adapted to realize a cont...
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WO/2018/079982A1 |
The present invention relates to a bidirectional conductive pin using carbon fibers and a bidirectional conductive pattern module using carbon fibers, and a bidirectional conductive socket using the same. The bidirectional conductive pin...
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WO/2018/046896A1 |
A liquid conductivity measurement pin (10). The pin has a sensor portion (130) and an electrical contact portion (110). The electrical contact portion (110) is spring-loaded such that the electrical contact portion (110) is adapted to ma...
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WO/2018/044014A1 |
Disclosed is a testing device. The testing device includes a testing socket configured to support a plurality of probes, a testing-circuit substrate which includes a contact point to contact the probe, a slider which makes the testing so...
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WO/2018/035515A1 |
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies of a semiconductor wafer includes: a wafer translator having a wafer-side configured to face the wafer, and an in...
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WO/2018/035054A1 |
Systems and methods for testing semiconductor wafers are disclosed herein. In one embodiment, an apparatus for testing dies of a semiconductor wafer includes a composite space transformer for contacting the dies. The composite space tran...
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WO/2018/019866A1 |
The invention describes a testing head (21) of an apparatus for testing electronic devices comprising a plurality of contact probes (22) inserted into guide holes realized in at least one upper support (23) and one lower support (24), a ...
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WO/2018/019863A1 |
The invention describes a probe card (20) for a testing equipment of electronic devices comprising at least one testing head (21) with a plurality of contact probes (22) inserted into guide holes being realized in at least one upper guid...
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WO/2017/213387A1 |
A rubber socket comprises a lower film, an upper film, an electrical connection member, and a rubber layer. The lower film comprises a plurality of lower electrode parts coupled to a synthetic resin film. The upper film is arranged in pa...
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WO/2017/209357A1 |
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: an upper contact p...
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WO/2017/209356A1 |
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: a pin body formed ...
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WO/2017/200146A1 |
The present invention relates to a case for semiconductor probe pins and to a case which can accommodate and maintain probe pins having been subjected to ultraprecision micromachining so as to be mounted to a probe used for semiconductor...
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WO/2017/196092A1 |
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...
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WO/2017/196093A1 |
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...
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WO/2017/196094A1 |
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...
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WO/2017/189898A1 |
Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a stan...
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WO/2017/183757A1 |
The present invention relates to a contact pin for testing an electrical terminal mounted on a printed circuit board, etc. The present invention provides a contact pin comprising: a substrate, which is made of a single material, and whic...
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WO/2017/183788A1 |
An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external ...
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WO/2017/179836A1 |
The present invention relates to a CIS probe card which prevents light projected for CIS inspection from being interfered with by lead-in wires and to a method for producing the CIS probe card. The CIS probe card comprises: a plurality o...
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WO/2017/160090A2 |
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...
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WO/2017/155155A1 |
A bidirectional conductive module for testing a semiconductor device, according to one embodiment of the present invention, comprises: a substrate part having a structure bent such that one surface thereof faces the semiconductor device ...
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WO/2017/129999A1 |
A transmission line arrangement having a first end and a second end, the transmission line arrangement being configured to transmit a signal between the first end and the second end, the transmission line arrangement comprising a signal ...
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WO/2017/126877A1 |
The present invention relates to an electric characteristic inspection pin and, more particularly, to an electric characteristic inspection pin capable of performing stable electric characteristic inspection and an inspection unit having...
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WO/2017/126782A1 |
The present invention relates to a bidirectional conductive pattern module for testing a semiconductor, a semiconductor test socket using the same, and a manufacturing method for the bidirectional conductive pattern module for testing a ...
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WO/2017/107189A1 |
A sensor and a signal processing method. The sensor comprises: an input vector generating module (101), a sampling module (102), and an output module (103), wherein the input vector generating module (101) is configured to convert a wave...
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WO/2017/080340A1 |
Provided are a nanowire giant piezo-resistive property measurement device and a manufacturing method therefor. The measurement device comprises: a nanowire (6); a platinum resistance temperature sensor (1); an electrothermal actuator (2)...
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WO/2017/082510A1 |
A test socket of the present invention comprises: a first PCB film having a plurality of first pads; a first conductive wire bonded to first surfaces of the first pads; insulation silicone rubber provided on the first PCB film, having a ...
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WO/2017/061656A1 |
The present invention relates to a Kelvin test probe, a Kelvin test probe module, and a manufacturing method therefor. The Kelvin test probe according to the present invention comprises: an upper insulating sheet made of a ductile materi...
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WO/2017/053910A1 |
In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The interface apparatus includes a housing. The housing includes a lower housing substrate and an upper housing substrate. The lower hous...
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