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WO/2023/042806A1 |
Provided is a copolymer containing monomer units represented by Formulae (I), (II), having a weight average molecular weight of greater than 70,000, and having a metal content of less than 100 ppb as determined by measuring K, Na, Fe, Ca...
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WO/2023/018676A3 |
The present invention includes methods and systems for forming an object in a volume of a photohardenable composition wherein the methods and systems preferably include telecentric illumination optics and/or telecentric projection optics.
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WO/2023/043599A1 |
A method of microfabrication includes depositing a photoresist film on a working surface of a semiconductor wafer, the photoresist film being sensitive to extreme ultraviolet radiation; exposing the photoresist film to a pattern of extre...
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WO/2023/043041A1 |
The present invention relates to a liquid-phase photosensitive resin composition with excellent developability and deep-part curability.
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WO/2023/041251A1 |
The invention provides a thermal conditioning unit to thermally condition a substrate, the thermal conditioning unit comprising: a top surface; a plurality of gas inlets and gas outlets provided in the top surface; a plurality of pressur...
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WO/2023/041271A1 |
Apparatuses, systems, and methods for providing beams for classifying and identifying failure mechanisms associated with a sample of charged particle beam systems. In some embodiments, a method may include analyzing a first plurality of ...
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WO/2023/041224A1 |
The invention relates to a DUV lithography system, comprising: a light source for generating DUV radiation at at least one operating wavelength in the DUV wavelength range, a photomask, and an optical element (44) that transmits the DUV ...
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WO/2023/042607A1 |
The present invention addresses the problem of providing a processing solution which makes it possible to prevent the occurrence of defects upon the application of the processing solution on a surface of interest when the processing solu...
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WO/2023/042608A1 |
A purpose of the present invention is to provide a polyimide resin which enables a photosensitive resin composition including the polyimide resin to satisfy the following: 1) to leave no residue causative of an obstacle to light emission...
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WO/2023/041213A1 |
The invention relates to an EUV lithography system (1) comprising: a housing (26), at least one reflective optical element (M1, M2) which is arranged in the interior (27) of the housing (26), and at least one gas-binding component (31a-c...
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WO/2023/041488A1 |
Disclosed herein is a method to determine a metrology contribution from statistically independent sources comprising providing a plurality of contributions from statistically independent sources obtained at a plurality of measurement set...
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WO/2023/040308A1 |
The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripping solution containing same and a method for cleanin...
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WO/2023/041306A1 |
A protection apparatus (100) includes a buffer generator and a heating apparatus. The buffer generator is configured to interact a buffer with a surface of a substrate (130) that is positioned inside a chamber of an extreme ultraviolet (...
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WO/2023/041579A1 |
The present invention relates to a photosensitive composition comprising a photoinitiator component, a photoinhibitor component, a photosensitizer component, and a chain transfer agent component. The present invention further relates to ...
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WO/2023/038139A1 |
This pellicle is provided with a pellicle frame, a pellicle film which is supported on one end surface of the pellicle frame, and an adhesive layer which is provided on the other end surface of the pellicle frame, and satisfies formula (...
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WO/2023/036521A1 |
Disclosed is a method of determining a substrate deformation metric relating to at least one substrate, the substrate deformation metric describing deformation across the at least one substrate. The method comprises obtaining alignment d...
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WO/2023/038142A1 |
This pellicle is provided with a pellicle frame, a pellicle film, and an adhesive layer. An inner wall surface and/or an outer wall surface of the adhesive layer satisfies expression (1).　Expression (1): ([A2s]/[A50s]) ≤ 0.97 where A...
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WO/2023/039054A1 |
Reticle pods include interfacing surfaces to secure segments of the reticle pod to one another. At least one of the interfacing surfaces is a ramped surface, such that when the reticle pods are secured to one another, the reticle is clam...
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WO/2023/036720A1 |
The present invention relates to a compound of structure (I), wherein A is a core moiety which is selected from structure (Ia), (Ib), (Ic) and (Id), to which is attached through X, a direct valence bond or a divalent linking group, m num...
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WO/2023/038840A1 |
Extreme ultraviolet (EUV) mask blanks, methods of forming EUV mask blanks and production systems therefor are disclosed. The EUV mask blanks comprise a multilayer reflective stack on a substrate. The multilayer reflective stack comprises...
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WO/2023/037949A1 |
The present invention provides a composition for forming a resist underlayer film, the composition containing a compound represented by formula (1) and a solvent. (In formula (1), each X independently represents a halogen atom or a monov...
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WO/2023/015115A3 |
The invention pertains to a printing form precursor, and particularly a printing form precursor that can form printing forms, or printing plates, having improved properties. The printing form precursor includes a photopolymerizable compo...
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WO/2023/036561A1 |
Since a mask check wafer can utilize a different process than a production wafer, a high-contrast illumination setting with lower pupil fill ratio (PFR) that leads to a reduction of the productivity of the scanner can be utilized. By sel...
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WO/2023/037663A1 |
Provided is a technique for improving resist stripping ability. The substrate processing method comprises: a holding step (S1) for holding a substrate (W) provided with a resist in a holding part (1); a first plasma processing step (S2) ...
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WO/2023/037790A1 |
The present invention addresses the problem of providing a colored curable resin composition with which it is possible to form a color filter having excellent adhesion. The present invention relates to a colored curable resin composition...
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WO/2023/036568A1 |
The invention relates to an optical element (M2) for the reflection of radiation, in particular for the reflection of EUV radiation (16), comprising: a substrate (31), which is formed from quartz glass, in particular from titanium-doped ...
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WO/2023/036539A1 |
A method of obtaining focus and dose data that requires no special marks and that uses images of in-die features is described. A focus/dose matrix wafer is created. Dimensions such as critical dimension (CD), CD uniformity (CDU), edge pl...
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WO/2023/037828A1 |
A coloring composition with which colored article with resistance against light can be obtained, a film that uses this coloring composition, an optical filter, a solid-state imaging element, an image display device, and a novel compound ...
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WO/2023/035658A1 |
Disclosed are a semiconductor structure and a manufacturing method therefor, and a memory. The semiconductor structure may at least comprise: a first grating, a second grating, and a third grating stacked from bottom to top and disposed ...
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WO/2023/038448A1 |
A light source device according to an embodiment of the present invention is a light source device that outputs light from an extreme ultraviolet light source, on the basis of an electron beam and a metal droplet, the light source device...
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WO/2023/036526A1 |
Disclosed is a computer implemented method of determining a placement metric relating to placement of one or more features on a substrate in a lithographic process. The method comprises obtaining setup data comprising placement error con...
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WO/2023/038092A1 |
A photosensitive composition comprising a colorant, one or more binder resins, a polymerizable compound, one or more photopolymerization initiators, a resin-type dispersant, and a leveling agent, wherein the binder resins include an alka...
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WO/2023/038446A1 |
A light source device according to one embodiment of the present invention outputs an extreme ultraviolet light source on the basis of an electron beam, the light source device comprising: a chamber; an electron beam emission unit that g...
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WO/2023/036200A1 |
The present application provides a thin film mask, comprising: a first layer and a second layer. The first layer and the second layer are laminated; the second layer comprises an adhesive film; the absorption coefficient of the first lay...
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WO/2023/035305A1 |
Disclosed are a Micro LED device and a preparation method therefor. The method comprises: providing an imprint mold; coating a photoresist solution only on a side face of a substrate to form an uncured liquid photoresist layer; pressing ...
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WO/2023/036593A1 |
Described herein is a metrology system and a method for converting metrology data via a trained machine learning (ML) model. The method includes accessing a first (MD1) SEM data set (e.g., images, contours, etc.) acquired by a first scan...
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WO/2023/036530A1 |
A sensor system for measuring a shape of a substrate, comprising: a substrate support to support a surface of the substrate, at least one sensor device, each sensor device comprising an optical emitter to emit radiation beams onto the su...
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WO/2023/037979A1 |
For the purpose of producing a semiconductor element by a subtractive method with use of a novel metal such as Ru, which is other than Cu, the present invention provides a composition for forming a resist underlayer film which is suitabl...
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WO/2022/256225A3 |
In an example of a method for making a flow cell, a light sensitive material is deposited over a resin layer including depressions separated by interstitial regions, wherein the depressions overlie a first resin portion having a first th...
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WO/2023/030807A1 |
Described herein is systems and methods for evaluating selected set of patterns of a design layout. A method herein includes obtaining (i) a first pattern set resulting from a pattern selection process, (ii) first pattern data associated...
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WO/2023/032973A1 |
Provided are a radiation-sensitive resin composition and a pattern formation method that make it possible to form a resist film that has excellent sensitivity and CDU performance and an excellent residual film ratio, even when next-gener...
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WO/2023/030814A1 |
Systems, apparatuses, and methods for detecting a location of a positioned sample may include an electrostatic holder configured to hold a sample and form a gap area between an outside edge of the sample and a structure of the electrosta...
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WO/2023/034296A1 |
The invention provides certain mixed Sn (II) amide/alkoxide precursor compounds. These compounds are useful in precursor compositions in the vapor deposition of tincontaining films such as tin oxide films onto a surface of a microelectro...
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WO/2023/032545A1 |
Provided are: a cured product production method by which a cured product having excellent elongation at break is obtained; a laminate production method including said cured product production method; and a semiconductor device manufactur...
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WO/2023/032707A1 |
The present invention provides a protective film and a laminate which have excellent adhesion to an electrode and excellent hygrothermal durability. A protective film according to the present invention is a protective film for an electro...
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WO/2023/032794A1 |
The present invention provides: an actinic ray sensitive or radiation sensitive resin composition containing a compound (C) that generates an acid when being irradiated with an actinic ray or radiation and that is represented by a specif...
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WO/2023/033094A1 |
Provided are a protective film that can completely cover the edge of a substrate (wafer) for semiconductor manufacturing via a simple coating method in the manufacture of a semiconductor device, a protective-film-forming composition for ...
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WO/2023/032765A1 |
The present invention addresses the problem of providing a photosensitive composition having low dielectric properties and excellent development contrast. This problem is solved by a photosensitive composition containing a polyphenylene ...
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WO/2023/034029A1 |
A magnification adjustable projection system is provided that includes an imaging system having an object or image space, a first deformable lens plate located within the object or image space for contributing a first magnification power...
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WO/2023/032681A1 |
A multilayer body which is obtained by stacking a slip sheet and a planographic printing original plate having an image recording layer that contains an infrared absorbent, a polymerizable compound and a polymerization initiator, wherein...
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