Title:
【発明の名称】複合ラミネート切断
Document Type and Number:
Japanese Patent JP2002528278
Kind Code:
A
Abstract:
The method comprises positioning a die (16) on the laminate (10) with the laminate in an uncured or part-cured condition, applying a covering (24) to the die (16) and laminate (10) and applying fluid, such as gas, under pressure to the covering (24) to load the die sufficiently to cut through the laminate. In one preferred embodiment the die (16) is left in position after cutting the laminate (10) to form a liner for the cut formed by the die (16).
Inventors:
Williams, Stephen
Application Number:
JP2000578142A
Publication Date:
September 03, 2002
Filing Date:
October 20, 1999
Export Citation:
Assignee:
BAE SYSTEMS plc
International Classes:
B26F1/00; B26D5/12; B26F1/40; B29C70/44; B29C70/54; B64C1/00; B64C1/14; (IPC1-7): B26F1/00; B64C1/14
Domestic Patent References:
| JPH0482951A | 1992-03-16 | |||
| JPH01228796A | 1989-09-12 |
Foreign References:
| WO1991017035A1 | 1991-11-14 | |||
| WO1993022128A1 | 1993-11-11 | |||
| US4291816A | 1981-09-29 |
Attorney, Agent or Firm:
Takehiko Suzue (4 outside)