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Patent Searching and Data

Document Type and Number:
Japanese Patent JP2003510429
Kind Code:
The invention relates to a polyethylene moulding compound having a multimodal molecular weight distribution which has an overall density of >=0.940 g/cm<3 >and an MFI190/5 in the range from 0.01 to 10 dg/min. The moulding compound according to the invention comprises an amount of from 30 to 60% by weight of low-molecular-weight ethylene homopolymer A which has a viscosity number VNA in the range from 40 to 150 cm<3>/g, an amount of from 30 to 65% by weight of high-molecular-weight copolymer B comprising ethylene and a further olefin having from 4 to 10 carbon atoms which has a viscosity number VNB in the range from 150 to 800 cm<3>/g, and an amount of from 1 to 30% by weight of ultrahigh-molecular-weight ethylene homopolymer C which has a viscosity number VNC in the range from 900 to 3000 cm<3>/g.The invention also relates to a method for the production of the moulding compound in a three-step process, and to the use thereof for the production of hollow articles.

Bertholt, Joachim
Beem, Ludwig
Enderle, Johannes-Friedrich
Schopbach, Reinhard
Application Number:
Publication Date:
March 18, 2003
Filing Date:
September 09, 2000
Export Citation:
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Basel, Polyolefin, Gezel Shaft, Mitt, Beschlenktel, Haftung
International Classes:
B29C49/04; B29D22/00; C08F2/00; C08F2/18; C08F4/642; C08F10/00; C08F10/02; B65D1/00; C08F110/02; C08J5/00; C08L23/04; C08L23/06; C08L23/16; B29K23/00; B29L22/00; (IPC1-7): C08L23/04; B29C49/04; B65D1/09; C08F2/18; C08F4/642; C08F10/02; C08J5/00
Domestic Patent References:
Attorney, Agent or Firm:
Sato Eto