Title:
電気化学的機械研磨のプロセス制御
Document Type and Number:
Japanese Patent JP2005516383
Kind Code:
A
Abstract:
A method and apparatus for electrochemically processing a substrate is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station, detecting an endpoint of the first electrochemical processing step at or just prior to breakthrough of the exposed layer of barrier material, electrochemically processing the exposed layer of barrier material in a second electrochemical processing step in the barrier processing station, and detecting an endpoint of the second electrochemical processing step.
Inventors:
Dubourst, Alain
Wang, Yang
Neo, Siu
Chen, Liangya
Mainenz, Antoine, Pea.
Wang, Yang
Neo, Siu
Chen, Liangya
Mainenz, Antoine, Pea.
Application Number:
JP2003561828A
Publication Date:
June 02, 2005
Filing Date:
January 21, 2003
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B23H5/08; B24B37/013; B24B49/04; B24B49/10; C25F7/00; H01L21/304; H01L21/3063; (IPC1-7): H01L21/304; B24B37/00; B24B37/04; C25F7/00; H01L21/3063
Domestic Patent References:
| JPH10270412A | 1998-10-09 | |||
| JP2000286217A | 2000-10-13 | |||
| JP2001269862A | 2001-10-02 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yuichi Yamada