Title:
タングステン研磨溶液
Document Type and Number:
Japanese Patent JP2005516384
Kind Code:
A
Abstract:
A metal polishing slurry having a static etch inhibitor and method for polishing a substrate while inhibiting static etching during the polishing of a substrate. The slurry composition includes an iodate-free halogenated inhibiting compound added to a generic slurry to form a resultant slurry. The substrate is polished using the resultant slurry, which inhibits the static etching of the substrate being polished. Also provided is a metal polishing slurry for inhibiting static etch comprising an oxidizer, a complexing agent, and an iodate-free halogenated inhibiting compound.
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Inventors:
Thomas, Terrence M
De Nardi, Stephen
Godfrey, Wade
De Nardi, Stephen
Godfrey, Wade
Application Number:
JP2003562206A
Publication Date:
June 02, 2005
Filing Date:
January 24, 2003
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
International Classes:
C09G1/02; C09K3/14; C23F3/00; H01L21/304; B24B37/00; H01L21/306; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; C09K3/14; H01L21/306
Domestic Patent References:
| JPH08197414A | 1996-08-06 | |||
| JPH10265766A | 1998-10-06 | |||
| JP2001311073A | 2001-11-09 |
Foreign References:
| WO1999061540A1 | 1999-12-02 |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Koshiro Tsukuda
Fumio Shinoda
Koshiro Tsukuda