Title:
電流阻止構造を有する発光デバイスおよび電流阻止構造を有する発光デバイスを作製する方法
Document Type and Number:
Japanese Patent JP2008505483
Kind Code:
A
Abstract:
Light emitting devices and methods of fabricating light emitting devices having a current blocking mechanism below the wire bond pad are provided. The current blocking mechanism may be a reduced conduction region in an active region of the device. The current blocking mechanism could be a damage region of a layer on which a contact is formed. The current blocking mechanism could be a Schottky contact between an ohmic contact and the active region of the device. A semiconductor junction, such as a PN junction could also be provided between the ohmic contact and the active region.
Inventors:
Kevin Habaraan
Michael John Bergman
Ban Mietsu Course Key
David Todd Emerson
John Edmond
Michael John Bergman
Ban Mietsu Course Key
David Todd Emerson
John Edmond
Application Number:
JP2007519194A
Publication Date:
February 21, 2008
Filing Date:
March 30, 2005
Export Citation:
Assignee:
CREE INC.
International Classes:
H01L33/14
Domestic Patent References:
| JPH1140854A | 1999-02-12 | |||
| JPH07147428A | 1995-06-06 | |||
| JPH11186607A | 1999-07-09 | |||
| JP2003008055A | 2003-01-10 | |||
| JPH08250768A | 1996-09-27 | |||
| JP2005093485A | 2005-04-07 |
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe