Title:
電気的には切断されているが機械的には連続である集積回路向けのダイの封止
Document Type and Number:
Japanese Patent JP2013530524
Kind Code:
A
Abstract:
A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die.
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Inventors:
David Van
Thomas Andrew Myers
Thomas Andrew Myers
Application Number:
JP2013510369A
Publication Date:
July 25, 2013
Filing Date:
May 19, 2011
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
H01L21/822; H01L23/02; H01L27/04
Domestic Patent References:
| JP2006059976A | 2006-03-02 | |||
| JP2004297022A | 2004-10-21 | |||
| JP2009290197A | 2009-12-10 | |||
| JP2002353307A | 2002-12-06 | |||
| JP2008140829A | 2008-06-19 | |||
| JP2010040892A | 2010-02-18 | |||
| JP2006059976A | 2006-03-02 | |||
| JP2004297022A | 2004-10-21 | |||
| JP2009290197A | 2009-12-10 | |||
| JP2002353307A | 2002-12-06 |
Foreign References:
| WO2010039981A2 | 2010-04-08 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei