Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MOLD
Document Type and Number:
Japanese Patent JP2019014112
Kind Code:
A
Abstract:
To make it possible to control a lens shape with high precision.SOLUTION: The mold includes an abutting portion for abutting against a substrate when forming a resin material on the substrate into a predetermined shape. In a state where the abutting portion is abutted against the substrate, a space for allowing the resin material to flow in and out is formed. The present technology can be applied to, for example, a mold for forming a lens resin portion of a solid-state imaging device.SELECTED DRAWING: Figure 3
Inventors:
MATSUTANI HIROYASU
Application Number:
JP2017131905A
Publication Date:
January 31, 2019
Filing Date:
July 05, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP
International Classes:
B29C43/36; G02B1/04; G02B3/00
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yoshio Inamoto