Title:
LAMINATION MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2019077939
Kind Code:
A
Abstract:
To enhance productivity by shortening time for lamination when a plurality of powders are layered on a substrate in flat.SOLUTION: A lamination molding device 1 has: a stage 3 capable of mounting powdery materials; a first powder supply part 4 having a first aperture 12 with a long width formed in a direction and supplying a first powder 21, which is a powdery material, from the first aperture 12 to the stage 3; a second powder supply part 5 having a second aperture 13 with shorter width than that of the first aperture 12 and supplying a second powder 22, which is the powdery material, from the second aperture 13 to the stage 3; a closing plate 19 which is connected to the second powder supply part 5 and can close a part of the first aperture 12; a first drive part 6 moving the first powder supply part 4 to a first direction vertical to a width direction of the first aperture 12; and a second derive part 7 moving the second powder supply part 5 and the closing plate 19 to a second direction in parallel to the width direction of the first aperture 12.SELECTED DRAWING: Figure 1
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Inventors:
HATANAKA MASAYA
NAKAMURA MASAHIRO
NAKAMURA MASAHIRO
Application Number:
JP2017208112A
Publication Date:
May 23, 2019
Filing Date:
October 27, 2017
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
B22F3/16; B22F3/105; B29C64/153; B29C64/236; B29C64/336; B33Y30/00
Domestic Patent References:
| JP2015182288A | 2015-10-22 | |||
| JP2015175013A | 2015-10-05 | |||
| JP2011156678A | 2011-08-18 | |||
| JP2017180177A | 2017-10-05 |
Foreign References:
| WO2015151834A1 | 2015-10-08 | |||
| US20140306379A1 | 2014-10-16 | |||
| CN105562687A | 2016-05-11 |
Attorney, Agent or Firm:
Noriharu Fujita
Miori Takao
Kawakami Miki
Daisuke Nagata
Miori Takao
Kawakami Miki
Daisuke Nagata