Title:
LAMINATE, PRODUCTION METHOD OF LAMINATE, PRODUCTION METHOD OF FLEXIBLE ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2019119126
Kind Code:
A
Abstract:
To provide a polymer film laminate which can be usefully used in formation of an electronic device requiring a processing temperature higher than 500°C in production of a flexible electronic device, and which is obtained by using an inorganic substrate as a temporary support.SOLUTION: A polymer film laminate which does not produce peeling in a process even when the process temperature is higher than 500°C, and is easily peeled off after completion of the process, can be obtained by joining a polymer film and an inorganic substrate to each other via a silane coupling agent with a predetermined structure.SELECTED DRAWING: None
Inventors:
HAYASHI MIYUKI
YAMASHITA MASAHIRO
OKUYAMA TETSUO
ICHIMURA SHUNSUKE
YAMASHITA MASAHIRO
OKUYAMA TETSUO
ICHIMURA SHUNSUKE
Application Number:
JP2018000207A
Publication Date:
July 22, 2019
Filing Date:
January 04, 2018
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
B32B7/06; B32B15/08; C08G73/22; H05K1/03
Domestic Patent References:
| JPS6433134A | 1989-02-03 | |||
| JP2015135483A | 2015-07-27 | |||
| JP2015178237A | 2015-10-08 | |||
| JP2007098791A | 2007-04-19 | |||
| JP2014100702A | 2014-06-05 |
Foreign References:
| CN101260235A | 2008-09-10 |