Title:
ADHESIVE COMPOSITION, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2019210400
Kind Code:
A
Abstract:
To provide an adhesive composition having excellent moisture resistance.SOLUTION: An adhesive composition contains a conductive particle and a surfactant.SELECTED DRAWING: None
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Inventors:
SHINOHARA KENGO
KAWABATA YASUNORI
MATSUDA KAZUYA
IIJIMA YUSUKE
KAWABATA YASUNORI
MATSUDA KAZUYA
IIJIMA YUSUKE
Application Number:
JP2018108691A
Publication Date:
December 12, 2019
Filing Date:
June 06, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J201/00; C09J7/10; C09J7/24; C09J7/25; C09J7/35; C09J9/02; C09J11/04; C09J11/06; H01B1/22; H01B5/16; H01L21/60
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Mt. Nakatsuka
Yoshinori Shimizu
Hiroyuki Hirano
Mt. Nakatsuka