Title:
CHIP MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2019220584
Kind Code:
A
Abstract:
To provide a chip manufacturing method capable of manufacturing a plurality of chips by dividing a plate-like workpiece without using an expanded sheet.SOLUTION: A chip manufacturing method includes a first laser processing step, a second laser processing step, and a dividing step. The first laser processing step forms a first modified layer along division schedule lines of a chip region by irradiating only the chip region with a laser beam of a wavelength having permeability to a ferroelectric substrate along the division schedule lines. The second laser processing step forms a second modified layer along a boundary between the chip region and an outer peripheral excess region by radiating a laser beam of a wavelength having permeability to the ferroelectric substrate along the boundary. The dividing step divides the ferroelectric substrate into individual chips by applying force and ultrasonic vibration to the ferroelectric substrate.SELECTED DRAWING: Figure 7
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Inventors:
YODO YOSHIAKI
CHO KINEN
CHO KINEN
Application Number:
JP2018117130A
Publication Date:
December 26, 2019
Filing Date:
June 20, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/10; B23K26/53; H01L21/304
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Tomohiro Okamoto
Kasahara Takahiro