Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRESSING CONDITION CORRECTION METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
Japanese Patent JP2020027915
Kind Code:
A
Abstract:
To properly correct a processing condition without damaging productivity in a substrate processing system having a small number of imaging devices.SOLUTION: In a method for correcting a processing condition in a substrate processing system, the substrate processing system performs a series of processing in which the formation and removal of a layer-like film with respect to a substrate is respectively executed one or more times, includes a plurality of processors in each unit processing, and includes an imaging device for imaging the substrate. The method includes: a device specification step for specifying the processor estimated to have abnormality on the basis of an imaging result in a monitoring imaging step and information of the processor before starting the series of processing and after ending the series processing about each substrate; an abnormality presence/absence determination step for determining the presence/absence of actual abnormality in the processor specified in the device specification step on the basis of an imaging step for abnormality determination for imaging a substrate for inspection by the imaging device and an imaging result; and a processing condition correction step for correcting a processing condition in the processor on the basis of the imaging result about the processor determined to actually have abnormality in the abnormality presence/absence determination step.SELECTED DRAWING: Figure 12

Inventors:
MORI TAKUYA
Application Number:
JP2018153396A
Publication Date:
February 20, 2020
Filing Date:
August 17, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; H01L21/02
Domestic Patent References:
JP2014195122A2014-10-09
JP2018056574A2018-04-05
JP2012104593A2012-05-31
JP2015159261A2015-09-03
Foreign References:
WO2018142840A12018-08-09
Attorney, Agent or Firm:
Tetsuo Kanamoto
Koji Hagiwara
Naoki Ogita



 
Previous Patent: 保持装置

Next Patent: ウエーハの一体化方法