Title:
POLYIMIDE, POLYIMIDE RESIN COMPOSITION, POLYIMIDE FILM, ADHESIVE, FILM-LIKE ADHESIVE, ADHESIVE LAYER, ADHESIVE SHEET, RESIN-COATED COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD, AND METHOD FOR PRODUCING POLYIMIDE
Document Type and Number:
Japanese Patent JP2020105493
Kind Code:
A
Abstract:
To provide a novel polyimide that has a high softening point and flexibility, and that can be used as a varnish of homogeneous organic solvent.SOLUTION: Provided are a polyimide (A) which is a reaction product of a monomer group comprising an aromatic tetracarboxylic acid anhydride (a1) and an aromatic diamine-containing diamine (a2), and a polyimide which is a reaction product of a diamine (B) and in which either the diamine (a2) or the diamine (B) contains dimer diamine and the imide ring closure rate is 90 to 100%.SELECTED DRAWING: None
Inventors:
SUGIMOTO KEISUKE
YAMAGUCHI TAKASHI
SHIOTANI ATSUSHI
TASAKI TAKASHI
YAMAGUCHI TAKASHI
SHIOTANI ATSUSHI
TASAKI TAKASHI
Application Number:
JP2019218048A
Publication Date:
July 09, 2020
Filing Date:
December 02, 2019
Export Citation:
Assignee:
ARAKAWA CHEM IND
International Classes:
C08G73/10; C08L79/08; C09J7/30; C09J11/06; C09J179/08; H05K1/03