Title:
COOLING PLATE, COOLING DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2020150170
Kind Code:
A
Abstract:
To expand a region with a high cooling efficiency in a cooling plate.SOLUTION: A cooling plate 102 comprises a first vertical flow path 126A and a second vertical flow path 126B which are extended to a heat reception surface 112 side from a first ctenidium flow path 124A and a second ctenidium flow path 124B which are alternately adjacent in a ctenidium shape. Further, the cooling plate comprises a first outside flow path 128A and a second outside flow path 128B which extend to an outside of a flat surface in parallel to the heat reception surface 112 from the first vertical flow path 126A and the second vertical flow path 126B, and are alternately adjacent. A first connection flow path 130A and a second connection flow path 130B are extended to the heat reception surface 112 side from the first ctenidium flow path 124A or the first outside flow path 128A, and the second ctenidium flow path 124B, or the second outside flow path 128B. The cooling plate comprises a heat reception flow path 132 that is communicated with the first connection flow path 130A and the second connection flow path 130B, and receives heat of the heat reception surface 112.SELECTED DRAWING: Figure 11
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Inventors:
MATSUMURA TAKAYOSHI
Application Number:
JP2019047521A
Publication Date:
September 17, 2020
Filing Date:
March 14, 2019
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/473; H05K7/20
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda