Title:
COMBINATION OF MOLD AND RELEASE FILM, RELEASE FILM, MOLD, AND METHOD FOR MANUFACTURING MOLDING
Document Type and Number:
Japanese Patent JP2020152101
Kind Code:
A
Abstract:
To provide a technique for adjusting a surface state of a molding.SOLUTION: There is provided a combination of molds used for curing a thermosetting resin, and a release film arranged between the thermosetting resin and the mold in the curing. The release film includes a base material layer formed of a thermoplastic resin, and a surface layer which is layered on a surface arranged on the side of the thermosetting resin in the curing in two surfaces of the base material layer and is formed of a fluorine resin containing particles. The mold has unevenness formed on a surface in contact with the release film in the curing.SELECTED DRAWING: Figure 1
Inventors:
SAKAI KEISUKE
TANAKA NANAE
MIYASHITA KENJI
KOBAYASHI TAKESHI
TANAKA NANAE
MIYASHITA KENJI
KOBAYASHI TAKESHI
Application Number:
JP2020021299A
Publication Date:
September 24, 2020
Filing Date:
February 12, 2020
Export Citation:
Assignee:
KOBAYASHI KK
International Classes:
B29C33/42; B29C33/68; B32B27/20; B32B27/30
Domestic Patent References:
| JP2004017483A | 2004-01-22 | |||
| JP2014188746A | 2014-10-06 | |||
| JP2000210987A | 2000-08-02 | |||
| JPS5266578A | 1977-06-02 | |||
| JP2014212239A | 2014-11-13 |
Foreign References:
| WO2017199440A1 | 2017-11-23 | |||
| WO2015068808A1 | 2015-05-14 |
Attorney, Agent or Firm:
Miwako Inoue