Title:
PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2020203366
Kind Code:
A
Abstract:
To provide a processing device which can form a step part on a chamfer part of a wafer without deteriorating productivity.SOLUTION: The processing device comprises: a chuck table configured to be able to hold and rotate a wafer 10 in a disc shape; cutting means comprising rotatably a cutting blade that cuts a chamfer part of the wafer held on the chuck table to form a step part 162; feeding means that makes the cutting means approach and separate from a rotation axis of the chuck table; photographing means that photographs the wafer held on the chuck table; and height detecting means 4 that detects a height of the wafer held on the chuck table, which further comprises control means that makes the cutting means cut the chamfer part of the wafer held on the chuck table to form the step part, then makes the photographing means detect a width of the step part and makes the height detecting means detect a depth B of the step part.SELECTED DRAWING: Figure 5
Inventors:
MINATO KOKICHI
Application Number:
JP2019113714A
Publication Date:
December 24, 2020
Filing Date:
June 19, 2019
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24B49/02; B24B49/12; H01L21/304
Domestic Patent References:
| JP2019033189A | 2019-02-28 | |||
| JP2015023239A | 2015-02-02 | |||
| JP2011249571A | 2011-12-08 |
Foreign References:
| US20190148130A1 | 2019-05-16 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko