Title:
MOUNTING BOARD MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2021002568
Kind Code:
A
Abstract:
To perform reflow soldering of a double-sided mounting board at once while reducing processing cost.SOLUTION: There is provided a mounting board manufacturing method of manufacturing a mounting board in which electronic components C1 and C2 are bonded to both sides of a board S having a B-side SB and an A-side SA. On the basis of a component weight ratio which indicates the ratio of the weight of the electronic components C1 and C2 to component holding force which is the force with which a solder paste P holds the electronic components C1 and C2, it is determined that the electronic components C1 and C2 are to be placed on the B side SB or the A side SA. The solder paste P is applied to the B side SB and the A side SA. The electronic component C1 is mounted on the B side SB, and the board S is inverted. The electronic component C2 is mounted on the A side SA. The solder paste P is melted by heating in the reflow furnace R, to join the electronic components C1 and C2 to the board S.SELECTED DRAWING: Figure 1
Inventors:
MORIOKA YUTA
Application Number:
JP2019114881A
Publication Date:
January 07, 2021
Filing Date:
June 20, 2019
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H05K3/34
Domestic Patent References:
| JPH0334497A | 1991-02-14 | |||
| JPS60175488A | 1985-09-09 | |||
| JPS6178197A | 1986-04-21 | |||
| JPS6417495A | 1989-01-20 |
Foreign References:
| CN102131352A | 2011-07-20 |
Attorney, Agent or Firm:
Patent business corporation glory patent office