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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021002570
Kind Code:
A
Abstract:
To improve the manufacturing efficiency of a semiconductor device.SOLUTION: A semiconductor device 1 includes a semiconductor chip 2 having an electrode pad 11, and a first connecting member 3 and a second connecting member 4 joined to the electrode pad 11 via a bonding material 5A. A through hole 23 is formed in a joint end portion 21 of the first connecting member 3 to be joined to the electrode pad 11. A joint end portion 31 of the second connecting member 4 is joined to the electrode pad 11 through the through hole 23.SELECTED DRAWING: Figure 1

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Inventors:
TAKEHARA NATSUKI
SHINOTAKE YOHEI
Application Number:
JP2019114918A
Publication Date:
January 07, 2021
Filing Date:
June 20, 2019
Export Citation:
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Assignee:
SHINDENGEN ELECTRIC MFG
International Classes:
H01L23/48; H01L21/60
Domestic Patent References:
JP2012028700A2012-02-09
JP2018207078A2018-12-27
JP2000174201A2000-06-23
JPS63170961U1988-11-07
Foreign References:
WO2012157584A12012-11-22
Attorney, Agent or Firm:
Sumio Tanai
Yasushi Matsunuma
Toshio Komuro



 
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