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Title:
HEAT CONDUCTIVE SHEET AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021005594
Kind Code:
A
Abstract:
To provide a heat conductive sheet that can exhibit excellent heat conductivity and is also excellent in detachability from a suction portion and tensile strength.SOLUTION: In a heat conductive sheet including a resin and a heat conductive filler, the heat conductivity in the thickness direction is 15 W/m K or more, the heat conductive sheet penetrates in the thickness direction, and has a plurality of micropores with a pore diameter of 48 μm or more and 500 μm or less, and the number of the micropores is 3 or more and 40 or less per 100 cm2 in the plan view area of the heat conductive sheet.SELECTED DRAWING: Figure 1

Inventors:
KURATANI SHOTA
MATSUSHITA MIZUKI
DEMISE MASASHI
OGAWA TAKAHIRO
Application Number:
JP2019117439A
Publication Date:
January 14, 2021
Filing Date:
June 25, 2019
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
H01L23/36; B29D7/01; C08J5/18; H05K7/20
Domestic Patent References:
JP2017141345A2017-08-17
JP2015092534A2015-05-14
JP2018127530A2018-08-16
JP2011218504A2011-11-04
JP2018140474A2018-09-13
JP2015015360A2015-01-22
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Yuta Terashima
Rintaro Takahashi